Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit
First Claim
1. In a method for cooling a semiconductor device using heat transfer means, the improvement comprising the use of a heat conducting body disposed between said semiconductor device and said heat transfer means, said heat conducting body being an alloy which is in the state of a two-phase field of liquid and solid uniformly throughout the body when the semiconductor device is at operating temperature and having a coefficient of viscosity greater than 3,000 centipoise at a temperature less than 40°
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Abstract
A method of cooling a semiconductor device with a cooling unit, using a metal sherbet, which is metal being in a state of a mixed phase consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the semiconductor device for transferring heat generated in the semiconductor device to the cooling unit. The metal sherbet is metal, such as In-Ga binary system, in which solids of In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the semiconductor device and the cooling unit.
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Citations
3 Claims
- 1. In a method for cooling a semiconductor device using heat transfer means, the improvement comprising the use of a heat conducting body disposed between said semiconductor device and said heat transfer means, said heat conducting body being an alloy which is in the state of a two-phase field of liquid and solid uniformly throughout the body when the semiconductor device is at operating temperature and having a coefficient of viscosity greater than 3,000 centipoise at a temperature less than 40°
Specification
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- Resources
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Current AssigneeFujitsu Limited
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Original AssigneeFujitsu Limited
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InventorsKawamura, Isao, Yamamoto, Haruhiko, Watanabe, Isao, Nagai, Takeshi, Katsuyama, Koji, Natori, Katsuhide
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Primary Examiner(s)Price, Carl D.
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Application NumberUS07/334,770Time in Patent Office757 DaysField of Search165/185, 165/80.3, 165/80.4, 165/1, 357/81, 357/82, 357/66, 357/67, 420/555, 420/557, 361/385, 361/386, 361/387US Class Current165/80.4CPC Class CodesH01L 2224/16 of an individual bump conne...H01L 2224/73253 Bump and layer connectorsH01L 23/4275 by melting or evaporation o...
