Process for manufacturing transparent, conductive film

• US 5,013,416 A
• Filed: 09/19/1990
• Issued: 05/07/1991
• Est. Priority Date: 03/12/1986
• Status: Expired due to Term

• Current Assignee: TOBI COL Limited, Yoichi Murayama
• Original Assignee: TOBI COL Limited, Yoichi Murayama
• Inventors: Murayama, Yoichi, Nomachi, Tetsuya
• Primary Examiner(s): Weisstuch, Aaron
• Application Number:
  US07/585,263
• Time in Patent Office: 230 Days
• Field of Search: 204/192.14, 204/192.29, 204/192.31, 204/298.05, 427/40
• US Class Current: 427/525
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 14/32 by explosion; by evaporation and subsequent ionisation of the vapours , e.g. ion-platingC23C14/34 - C23C14/48 take precedence
• CPC Class Codes: C23C 14/562 for coating elongated substrates

Abstract

A conductive thin film is deposited on the surface of plastic film moving at high velocity by ion-plating using a pressure-gradient discharge. The moving velocity of the substrate film is as high as 8 to 30m/min. A conductive, thin film composed of indium oxide, tin oxide, TTD and similar substances is deposited on the plastic film, at a pressure of 1×10^-5 to 1×10^-1 Torr and a discharge voltage of 50 to 100 V.

Claims

1. A process for manufacturing a transparent, conductive film which comprises:

(a) moving a polymer film substrate at high velocity, and

(b) depositing a transparent conductive thin film on the surface of the polymer film by ion-plating using a pressure-gradient discharge.

2. The process as in claim 1, wherein the polymer film is moved at a velocity of from 8 to 30 m/min.