Identification card with integrated circuit

• US 5,013,900 A
• Filed: 01/23/1989
• Issued: 05/07/1991
• Est. Priority Date: 12/28/1982
• Status: Expired due to Fees

• Current Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Original Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Inventors: Hoppe, Joachim
• Primary Examiner(s): Pellinen, A. D.
• Assistant Examiner(s): Gaffin, Jeffrey A.
• Application Number:
  US07/299,654
• Time in Patent Office: 834 Days
• Field of Search: 235/487, 235/488, 235/492, 357/72, 357/79, 357/84, 283/83
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.

Claims

1. A multilayer card construction comprising:

(a) at least one layer having an opening for accommodating an IC module;

(b) at least one layer having space for receiving elastic material;

(c) an IC module positioned in said opening; and

(d) an elastic material filling at least a portion of said space for receiving elastic material in an amount effective for protecting said IC module and minimizing disturbance in said card construction.

2. The multilayer card construction of claim 1, wherein said space for receiving elastic material comprises an area of said opening between said IC module and said at least one layer.

3. The multilayer card construction of claim 2, wherein said area of said opening between said IC module and said at least one layer is at least partially filled with said elastic material.

4. The multilayer card construction of claim 3, wherein said space for receiving elastic material comprises an equalizing space for an amount of elastic material in excess of said amount effective for protecting said IC module.

5. The multilayer card construction of claim 4, wherein said equalizing space is at least partially filled with elastic material.

6. The multilayer card construction of claim 5, wherein said space for receiving elastic material comprises a cavity in at least one card layer.

7. The multilayer card construction of claim 6, wherein said at least one card layer having said cavity is in a different card layer than said at least one card layer having said opening.

8. The multilayer card construction of claim 7, wherein said cavity is substantially filled with said elastic material.

9. The multilayer card construction of claim 8, wherein said equalizing space and said area of said opening between said IC module and said at least one card layer are in the same at least one card layer.

10. The multilayer card construction of claim 9, wherein said equalizing space is in communication with said area of said opening between said IC module and said at least one card layer.

11. The multilayer card construction of claim 10, wherein said equalizing space comprises said area of said opening between said IC module and said at least one layer.

12. The multilayer card construction of claim 10, wherein said equalizing space is remote from said open area between said IC module and said at least one card layer.

13. The multilayer card construction of claim 12, wherein said remote equalizing space is a hollow area.

14. The multilayer card construction of claim 13, wherein said area of said opening between said IC module and said at least one card layer is substantially filled with said elastic material.