Nonlinear transmission line for generation of picosecond electrical transients

• US 5,014,018 A
• Filed: 10/06/1987
• Issued: 05/07/1991
• Est. Priority Date: 10/06/1987
• Status: Expired due to Term

• Current Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Original Assignee: Stanford University
• Inventors: Rodwell, Mark J. W., Bloom, David M.
• Primary Examiner(s): GENSLER, PAUL L
• Application Number:
  US07/106,554
• Time in Patent Office: 1,309 Days
• Field of Search: 333/20, 333/247, 307/263, 307/320, 328/65, 357/15
• US Class Current: 333/20
• CPC Class Codes: H03H 7/325 Adjustable networks

Abstract

There is disclosed herein a non linear transmission line comprised of a 50 ohm coplanar monolithic waveguide formed on top of a gallium arsenide substrate having a layer of lightly doped epitaxial gallium arsenide with a heavily doped buried layer, said epitaxial layer having spaced, electrically isolated islands. A self aligned Schottky diode junction is formed at the intersection of each isolation island with the center conductor of the transmission line. The second conductor of the transmission line is coupled through a contact window and an ohmic contact to the buried layer in each isolation island.

Claims

1. An apparatus comprising:

a coplanar waveguide nonlinear transmission line for compressing the fall time of an input signal applied to an input thereof to generate an output signal at an output having a shorter fall time than said input signal, said nonlinear transmission line being integrated on a substrate of semiconductor material having islands of doped, conductive semiconductor along said transmission line surrounded by areas of said substrate which have been rendered nonconductive, said transmission line having a center conductor of constant width and at least two ground plane conductors spaced apart from said center conductor on either side of said center conductor, said center conductor-to-ground plane conductor spacing alternating between a first dimension and a second larger dimension at selected points along said transmission line, said first dimension being the smallest allowable spacing permitted by the design rules under which the integrated transmission line is fabricated, said second dimension selected in conjunction with the size and spacing of said islands to yield a desired, selected characteristic impedance of said transmission line which results in a usable, not excessive attenuation value for attenuation of signals propagating along said transmission line;

means integrated in said substrate coupled to said transmission line for causing the group velocity for propagation of said input signal toward said output to be voltage dependent at each point along said transmission line including a buried layer of heavily doped semiconductor under said islands.

2. The apparatus of claim 1 wherein said means for causing voltage dependence of the group velocity is a plurality of varactor diodes integrated on said substrate in said islands and electrically connected between said center conductor and said ground plane conductors of said transmission line at spaced apart points, and wherein said varactor diodes and said transmission line include means for reducing the attenuation along said transmission line to a minimum attainable value.

3. The apparatus of claim 2 wherein each said varactor diode is a Schottky diode comprising a metal anode contact, a lightly doped semiconductor layer, a heavily doped buried semiconductor layer having the same impurity type as said lightly doped semiconductor layer, and an ohmic contact, said metal anode contact in electrical contact with said lightly doped semiconductor layer to form a Schottky diode junction, and said lightly doped semiconductor layer in electrical contact with said heavily doped semiconductor layer, and said ohmic contact in electrical contact with said heavily doped semiconductor layer and said metal ground plane.

4. The apparatus of claim 3 further comprising means for reducing series resistance of each said Schottky diode comprising a maximum level of doping of said heavily doped semiconductor layer and minimum design rule spacing between said anode contact and said cathode contact according to the design rules for an integrated circuit process used to manufacture said apparatus on an integrated circuit substrate.

5. The apparatus of claim 4 wherein said diodes have junction areas which are periodically spaced along and coupled to said transmission line, and wherein said junction areas and spacing of said varactor diodes is established such that the characteristic impedance of said apparatus is a desired, selected impedance.

6. The apparatus of claim 5 wherein said junction areas get progressively smaller for varactor diodes coupled to said transmission line further from said input and wherein the spacing of the connection of each said varactor diode to said transmission line gets progressively less in proportion to the decrease in junction area of each said varactor diode.

7. An integrated nonlinear transmission line comprising:

a semiconductor substrate;

a layer of doped epitaxial material formed on said substrate having a lightly doped layer and a heavily doped buried layer under said lightly doped layer formed in said substrate and having regions of ion implant damage to form spaced-apart, electrically isolated islands of epitaxial material;

a coplanar transmission line center conductor of constant width integrated on said substrate so as to be in electrical contact with said lightly doped layer at least at the locations of said isolation islands thereby forming Schottky varactor diodes; and

a pair of coplanar transmission line groundplane conductors integrated on said substrate and overlying a plurality of ohmic contacts formed in said islands so as to be in direct electrical contact with said heavily doped buried layer to form a Schottky varactor diode cathode contact structure in each said island, said pair of groundplane conductors having a spacing from said center conductor over said islands which is approximately equal to the minimum acceptable spacing allowed by the design rules used to fabricate said integrated nonlinear transmission line, and having a spacing from said center conductor in regions outside said islands which is selected in conjunction with selection of the areas and spacings of said islands to establish a desired characteristic impedance for said integrated nonlinear transmission line which will match the characteristic impedance of devices to be electrically coupled to and used with said nonlinear transmission line.

8. The apparatus of claim 7 wherein said center and ground plane conductors are formed on the surface of said epitaxial layer to form a coplanar waveguide transmission line and wherein said Schottky diode junctions are the self aligned intersections of said isolated islands and said center conductor.

9. The apparatus of claim 8 wherein the spacing between said isolated islands, the size of said Schottky diode junction areas and the center conductor to ground plane conductor spacings are selected to yield a characteristic impedance for said transmission line of approximately 50 ohms.

10. The apparatus of claim 9 wherein the spacing of said isolated islands is periodic.

11. The apparatus of claim 9 wherein each succeeding junction area is smaller and the spacing of each succeeding isolated island starting from said input of said nonlinear transmission line is decreased in an amount to yield a characteristic impedance for the transmission line of approximately 50 ohms.

12. An integrated circuit comprising:

a semiconductor substrate having a nonlinear transmission line integrated thereon having at least a center conductor and a ground plane conductor and having a plurality of first regions comprising doped, conductive isolated islands formed therein surrounded by and electrically isolated from each other by second regions comprising ion implant damaged areas of nonconducting semiconductor substrate, said nonlinear transmission line comprised of a center conductor having constant width and at least two ground plane conductors spaced apart from said center conductor by a gap, said gap within said isolated islands having a width equal to the minimum allowable spacing under the design rules for the fabrication process used to form said integrated circuit and having a width in said second regions between said isolated islands which is selected to yield a capacitance and inductance per unit length of said nonlinear transmission line which will cause the characteristic impedance of said transmission line to be a desired value when considered with the area and spacing of said islands;

a plurality of junction means each including a junction having a junction area and a series resistance formed in said isolated islands, each having a transition capacitance which is voltage dependent, each said junction means coupled to said nonlinear transmission line at spaced intervals and inside the perimeter of an isolated island, said spacing of said junction means and said junction area being sized so as to cause said transmission line to have a desired, selected characteristic impedance when considered with the spacing between junctions, the series resistance and the capacitance and inductance per unit length of said nonlinear transmission line, said junction means for causing the group velocity of propagation along said transmission line to be voltage dependent.

13. The apparatus of claim 12 further comprising a lightly doped epitaxial layer in said substrate having a doping profile and in electrical contact with an underlying heavily doped epitaxial layer wherein each said junction means comprises a Schottky diode formed with an anode metal contact electrically coupled to said center conductor of said transmission line and in electrical contact with said lightly doped epitaxial layer and formed with an ohmic cathode contact electrically coupled to said ground plane conductor of said transmission line and in direct electrical contact with said heavily doped epitaxial layer, said heavily doped epitaxial layer also being in electrical contact with said lightly doped epitaxial layer.

14. The apparatus of claim 13 wherein said lightly doped epitaxial layer is uniformly doped between the surface of said substrate in contact with said anode metal contact and the junction between said lightly doped epitaxial layer and said heavily doped epitaxial layer.

15. The apparatus of claim 13 wherein each said Schottky diode is a hyperabrupt junction with a nonuniform doping profile of said lightly doped epitaxial layer.

16. The apparatus of claim 13 wherein said doping profile of said lightly doped epitaxial layer is chosen to cause the change in transition capacitance to be linear over the range of voltages of signals as they propagate down the transmission line.

17. An integrated nonlinear transmission line for causing the fall time of an input signal to be compressed during propagation from an input to an output comprising:

a gallium arsenide substrate;

a first epitaxially grown layer of doped single crystal gallium arsenide formed on said substrate which is uniformly doped throughout the thickness thereof to doping levels on the order of 10¹⁸ donor atoms cm³ ;

a second epitaxially grown layer of single crystal gallium arsenide layered adjacent to said first epitaxially grown layer and doped to doping levels on the order of 10¹⁶ donor atoms/cm³, and further comprising isolation islands of each of said first and second epitaxial layers electrically isolated from each other and periodically spaced along said transmission line;

a first Schottky metal conductor of constant width running across the surface of said second epitaxial layer to form the center conductor of an integrated coplanar waveguide transmission line comprising said nonlinear transmission line and intersecting said islands to form a self-aligned Schottky diode junction at each intersection thereby forming a plurality of Schottky junctions each of which has an area which is related to the spacing between said islands so as to cause a selected, desired characteristic impedance for the transmission line;

a plurality of ohmic contacts formed in said isolation islands through said second epitaxial layer to make electrical contact with said first epitaxial layer; and

a pair of metal ground plane conductors running across the surface of said second epitaxial layer and over each said ohmic contact so as to form the ground plane conductor of said integrated coplanar waveguide transmission line, the spacing of said ground plane conductors from said Schottky metal conductor over said isolation islands and in regions between said isolation islands selected so as to establish said selected, desired characteristic impedance when considered with the junction areas and spacing of said isolation islands.