Cooling structure

• US 5,014,777 A
• Filed: 09/19/1989
• Issued: 05/14/1991
• Est. Priority Date: 09/20/1988
• Status: Expired due to Fees

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Sano, Toshifumi
• Primary Examiner(s): Schwadron, Martin P.
• Assistant Examiner(s): Flanigan, Allen J.
• Application Number:
  US07/409,426
• Time in Patent Office: 602 Days
• Field of Search: 165/80.2, 165/80.4, 165/185, 361/386, 357/81, 357/82
• US Class Current: 165/185
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4062 heatsink to or through board or cabinet
• CPC Class Codes: H01L 2023/4068 Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4338 Pistons, e.g. spring-loaded members
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling structure which includes a substrate, at least one heat generating member fixed on the substrate, a heat radiating member provided above the heat generating member, and an elastic heat transfer sheet provided between the heat generating member and the heat radiating member for conducting heat generated in the heat generating member to the heat radiating member, with either the heat radiating member being formed with grooves at least on the part opposite the heat generating member, or the at least one heat generating member being formed with grooves on the upper portion thereof, or the elastic heat transfer sheet being formed with grooves on either one of the surface opposite the heat generating member or the surface opposite the heat radiating member.

Claims

1. A cooling structure comprising:

a substrate;

at least one heat generating member fixed on said substrate;

a heat radiating member provided above said heat generating member which is formed with grooves at least on the part opposite said heat generating member; and

an elastic heat transfer sheet provided between said heat generating member and said heat radiating member for conducting heat generating in said heat generating member to said heat radiating member.

3. The cooling structure as set forth in claim 1, wherein said heat radiating member is a piston on which said grooves are formed.

4. The cooling structure as set forth in claim 1, wherein said grooves are arranged in parallel linear relation.

5. The cooling structure as set forth in claim 1, wherein said grooves are arranged in a grid form.

6. The cooling structure as set forth in claim 1, wherein said grooves are arranged in a radial form.

7. The cooling structure as set forth in claim 1, wherein said grooves are arranged in a spiral form.

8. The cooling structure as set forth in claim 1, wherein said grooves are arranged in a concentric form.

9. The cooling structure as set forth in claim 1, wherein said at least one heat generating member includes at least one semiconductor component and includes a heat transfer plate, said heat transfer plate being made of a material having a high thermal conductivity and having a thermal expansion coefficient substantially equal to that of said at least one semiconductor component.

10. The cooling structure as set forth in claim 9, wherein said heat transfer plate is formed of a Cu/W alloy.

2. A cooling structure comprising:

a substrate;

at least one heat generating member fixed on said substrate which is formed with grooves on upper portion thereof;

a heat radiating member provided above said heat generating member; and

an elastic heat transfer sheet provided between said heat generating member and said heat radiating member for conducting heat generating in said heat generating member to said heat radiating member.

11. The cooling structure as set forth in claim 2, wherein said at least one heat generating member includes a heat transfer plate on which said grooves are formed and at least one semiconductor component, said heat transfer plate having a thermal expansion coefficient substantially equal to that of said at least one semiconductor component.

12. The cooling structure as set forth in claim 2, wherein said at least one heat generating member includes a heat transfer plate on which said grooves are formed, said heat transfer plate being made of a material having a high heat conductivity.

13. The cooling structure as set forth in claim 12, wherein said at least one heat generating member includes at least one semiconductor component, said heat transfer plate having a thermal expansion coefficient substantially equal to that of said at least one semiconductor component.

14. The cooling structure as set forth in claim 12, wherein said heat transfer plate is formed of a Cu/W alloy.

15. The cooling structure as set forth in claim 13, wherein said heat transfer plate is formed of a Cu/W alloy.

16. The cooling structure as set forth in claim 2, wherein said grooves are arranged in parallel linear relation.

17. The cooling structure as set forth in claim 2, wherein said grooves are arranged in a grid form.

18. The cooling structure as set forth in claim 2, wherein said grooves are arranged in a concentric form.

19. The cooling structure as set forth in claim 2, wherein said grooves are arranged in a radial form.

20. The cooling structure as set forth in claim 2, wherein said grooves are arranged in a spiral form.