Miniaturized monolithic multi-layer capacitor and apparatus and method for making

• US 5,018,048 A
• Filed: 09/15/1989
• Issued: 05/21/1991
• Est. Priority Date: 12/19/1983
• Status: Expired due to Term

• Current Assignee: Spectrum Control Incorporated (API Technologies Corporation)
• Original Assignee: Spectrum Control Incorporated (API Technologies Corporation)
• Inventors: Yializis, Angelo, Shaw, David G., Strycker, Donald S., Ham, Mooyoung
• Primary Examiner(s): GRIFFIN, DONALD
• Application Number:
  US07/408,471
• Time in Patent Office: 613 Days
• Field of Search: 29/25.42, 361/323
• US Class Current: 361/323
• CPC Class Codes: B05D 1/60 Deposition of organic layers from vapour phase vapour phase deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B05D 3/068 using ionising radiations (gamma, X, electrons)
• CPC Class Codes: B05D 7/24 for applying particular liquids or other fluent materials
• CPC Class Codes: B05D 7/56 Three layers or more
• CPC Class Codes: H01G 13/00 Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
• CPC Class Codes: H01G 4/306 made by thin film techniques
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

A monolithic multi-layer capacitor is disclosed having a central capacitively active area and two electrode joining sections separated from the active area by sloped sections. The dielectric layers are about 1 micron thick in the active area and taper gradually to zero thickness in the sloped sections. Electrode layers in the active area have a thickness in the range from 200 to 500 Angstroms and sufficient thickness throughout the sloped sections for adequate current carrying capacity. Various acrylates are used for the dielectric layers, the number of layers ranging from a few to many thousands.

Apparatus and methods are disclosed for the fabrication of such capacitors on a high speed, production scale basis. Such employ techniques for the flash evaporation of highly reactive monomers of acrylate dielectric materials so as to form a gaseous stream of such materials. The gas stream is controllably directed to a deposition surface for condensation and subsequent curing by a field enhanced gas discharge electron beam source. The control of the dielectric gas stream is accomplished by means of adjacent gas streams of an inert gas directed to areas of the deposition surface where deposition of the electrode material is unwanted. Means are disclosed for the atomization of the monomers of the dielectric material in preparation for its flash evaporation.

Claims

1. A capacitor comprising a plurality of vapor-deposited conductive layers with each layer being laterally offset in alternating directions relative to the preceding layer so as to define a central capacitance region, wherein a polymer dielectric layer, formed (a) by condensing a vaporized radiation-curable monomer onto such a conductive layer to form a liquid monomer coating on the layer, and (b) by thereafter subjecting the monomer coating to a radiation source to cure the monomer, is on each of the conductive layers to that, in the central capacitance region, the conductive layers are spaced and separated from each other by the polymer layers, wherein the polymer layers taper to zero thickness toward lines spaced substantially from two separated portions of the central capacitance region, and the conductive layers extend beyond the lines with successive conductive layers electrically contacting one another at spaced-apart terminal portions.

2. A capacitor according to claim 1 wherein the thickness of each of the conductive layers is such that the capacitor is self-healing.

3. A capacitor according to claim 1 wherein the thickness of the conductive layers is within the range of about 200 to 500 angstroms and the thickness of the polymer dielectric layers is about 1 micron in the central capacitance region.

4. A capacitor according to claim 1 having at least one hundred conductive layers, with each such layer having a polymer dielectric layer thereon.

5. A capacitor according to claim 1 having at least one thousand conductive layers, with each such layer having a polymer dielectric layer thereon.

6. A capacitor according to claim 1 where the line spacing is sufficient to cause an uppermost polymer dielectric layer to have a horizontal dimension extending from the central capacitance region to the terminal portions sufficient to accept a final conductive layer.

7. A polymer monolithic multi-layer capacitor having a capacitively active section and two electrode joining sections, wherein each such joining section is separated from the active section by a sloping section, the capacitor comprising first and second sets of vapor-deposited electrode layers interleaved with one another, with each electrode layer having an active area extending through and contributing to the capacitively active section of the capacitor in a stacked and spaced apart relationship with the active areas of all the other layers, and each electrode layer having an electrode joining margin in a stacked electrically contacting relationship with the electrode joining margins of the other electrode layers in its set so as to form one of the electrode joining sections of the capacitor, and each electrode layer having a sloped portion, running between its active area and its margin, contributing to one of the sloping sections, wherein polymer dielectric layers, formed (a) by condensing a vaporized radiation-curable monomer onto such an electrode layer to form a liquid monomer coating on the layer, and (b) by thereafter subjecting the monomer to a radiation source to cure the monomer, are in adherent contact with and between each of the adjacent electrode layers, the polymer dielectric layers being of substantially uniform thickness in the capacitively active section and tapering to zero thickness through the sloping section.

8. The capacitor of claim 7 in which the active section is spaced from each of the joining sections by more than 10 microns.

9. A capacitor sheet comprising successive vapor-deposited conductive layers comprising intermittent strips of conductive material wherein the strips of successive layers are laterally offset from the strips in the preceding layer so as to define central capacitance regions where the strips are interleaved, and thin, polymer dielectric coatings, formed by vapor depositing a monomer material onto such a conductive layer and crosslinking the monomer material by radiation in place and in immediate succession after the deposition of the underlying conductive layer, are on and between each of the conductive strips of the conductive layers so that in the capacitance regions the interleaved conductive strips are uniformly spaced from one another by such polymer dielectric coatings.

10. A capacitor sheet according to claim 9 wherein the sheet is adapted to being subdivided into discrete capacitors by cutting substantially perpendicular to the plane of the layers.

11. A capacitor sheet according to claim 10 wherein the thickness of the conductive layers and the thickness of the dielectric coatings are such that the discrete capacitors will be self-healing.

12. A capacitor sheet according to claim 9 wherein the thickness of the conductive material strips is within the range of about 200 to 500 angstroms and the thickness of the polymer dielectric layers is about 1 micron in the central capacitance region.

13. A capacitor sheet according to claim 9 having at least one hundred conductive layers each with dielectric coatings associated therewith.

14. A capacitor sheet according to claim 9 having at least one thousand conductive layers each with dielectric coatings associated therewith.

15. A capacitor sheet according to claim 9 in which the strips of conductive material are thin enough to burn or melt laterally offset strips when connected by defects in the dielectric coatings upon the application of a voltage of up to 50 volts across the laterally offset strips.

16. A capacitor sheet according to claim 9 formed by a process comprising the following steps:

(a) providing a vacuum chamber containing;

(i) a movable surface,

(ii) a vapor outlet of a vaporizer mounted adjacent an upstream portion of the surface,

(iii) a radiation curing means mounted adjacent a downstream portion of the surface,

(iv) means for maintaining the surface at a temperature below that of the vaporizer; and

(v) means for depositing conductive metal layers;

(b) evacuating gas from the chamber until the pressure within the chamber is less than about 1×

10^-4 Torr;

(c) selecting a polymerizable and crosslinkable monomer that can be evaporated at the pressure defined in step (b);

(d) metering a quantity of the monomer into an inlet portion of the vaporizer;

(e) vaporizing the monomer within the vaporizer;

(f) moving the surface relative to the vapor outlet and the radiation curing means at a rate of between about 150 and 600 feet per minute;

(g) condensing a film of vaporized monomer dispensed from the vapor outlet onto the moving surface;

(h) activating the radiation curing means whereby the monomer is cured to form a substantially crosslinked polymer dielectric coating on the surface;

(i) depositing a conductive layer of metal onto the crosslinked polymer coating;

(j) condensing a film of vaporized monomer dispensed from the vapor outlet onto the conductive layer of metal provided in step (i); and

(k) repeating steps (h) through (j) a selected number of times.