IC card having circuit modules for mounting electronic components

• US 5,018,051 A
• Filed: 12/28/1988
• Issued: 05/21/1991
• Est. Priority Date: 03/31/1988
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Hongu, Akinori, Ohuchi, Masayuki, Yamada, Hiroshi, Saito, Masayuki
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Ghosh, Paramita
• Application Number:
  US07/291,252
• Time in Patent Office: 874 Days
• Field of Search: 361/392, 361/393, 361/397, 361/401, 361/406, 361/414, 361/, 235/488, 235/489, 235/492, 235/493, 235/494
• US Class Current: 361/729
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00

Abstract

An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector terminal pattern formed thereon, circuit modules embedded in the recess portions in main substrate, each module having electronic components including IC chips, a chip capacitor and a thin D.C. battery unit, and a double-layered wiring structure for providing electric connection between the electronic components and the connector terminal pattern. The double-layered wiring structure comprises a first wiring layer formed on the main substrate to cover the circuit modules and a second wiring layer formed insulatively above the former wiring layer. The first wiring layer has a first wiring pattern that extends in a first direction of the main substrate to be coupled to the electronic components. The second wiring layer has a second wiring pattern that extends in a second direction of the main substrate to be coupled to the first wiring pattern and the connector terminal pattern.

Claims

1. A structure comprising:

(a) a card-shaped main base layer having a surface in which recess portions are formed and a connector layer having an external connection terminal pattern formed at an edge portion thereof;

(b) sub-base layers embedded in said recess portions of said main base layer and each having electronic components; and

(c) double-layered wiring means for providing electric connection between said electronic components and said connector terminal pattern, said wiring means comprising,

(d) a first wiring layer disposed on said main base layer so as to cover said sub-base layers and having a first wiring pattern which substantially consists of essentially parallel wiring lines extending in a first direction of said main base layer to be coupled to said electronic components, and

(e) a second wiring layer insulatively provided above said first wiring layer and having a second wiring pattern which substantially consists of essentially parallel wiring lines extending in a second direction of said main base layer to be coupled to said first wiring pattern and said connector terminal pattern.

2. The structure according to claim 1, wherein said first wiring pattern includes wiring lines for providing electrical connection between said electronic components of said sub-base layers embedded in said main base layer.

3. The structure according to claim 2, wherein said second wiring pattern includes wiring lines for providing electric connection between said connector terminal pattern and said wiring lines of said first wiring pattern.

4. The structure according to claim 1, wherein said first wiring pattern is substantially perpendicular to said second wiring pattern.

5. A structure comprising:

(a) a card-shaped main base layer having a surface in which recess portions are formed and a connector layer having an external connection terminal pattern formed at an edge portion thereof;

(b) sub-base layers embedded in said recess portions of said main base layer and each having electronic components; and

(c) double-layered wiring means for providing electric connection between said electronic components and said connector terminal pattern, said wiring means comprising,

(d) a first wiring layer disposed on said main base layer so as to cover said sub-base layers and having a first wiring pattern extending in a first direction of said main base layer to be coupled to said electronic components, and

(e) a second wiring layer insulatively provided above said first wiring layer and having a second wiring pattern extending in a second direction of said main base layer to be coupled to said first wiring pattern and said connector terminal pattern,

(f) said first wiring pattern includes wiring lines for providing electrical connection between said electronic components of said sub-base layers embedded in said main base layer.

(g) said second wiring pattern includes wiring lines for providing electric connection between said connector terminal pattern and said wiring lines of said first wiring pattern,

(h) said double-layers wiring means has substantially the same thickness as said connector layer.

6. The structure according to claim 5, further comprising:

(d) securing means for securing each of said sub-base layers in a corresponding one of said recess portions.

7. The structure according to claim 6, wherein said securing means includes a hardenable resin.

8. The structure according to claim 7, wherein said electronic components include semiconductor integrated circuit devices.

9. An IC card comprising:

(a) a card substrate having a main surface in which first recess portions are formed and having plane connector terminals at an edge surface thereof;

(b) circuit modules embedded in said first recess portions and each having a base layer having a surface in which second recess portions are formed;

(c) integrated circuit chips embedded in said second recess portions and each having connection terminals;

(d) first double-layered wiring means for providing electric connection between said connection terminals of said integrated circuit chips in each of said circuit modules to thereby provide circuit module connection terminals; and

(e) second double-layered wiring means, so formed on said main surface of said card substrate as to cover said circuit modules, for providing connection between said circuit modules and connection between said circuit module connection terminals and said plane connector terminals, said second wiring means including first parallel wiring line components insulatively provided above said card substrate and extending in a selected direction, and second parallel wiring line components insulatively provided above said first wiring line components and extending in a different direction substantially perpendicular to the selected direction.

10. An IC card comprising:

(a) a card substrate having a main surface in which first recess portions are formed and having plane connector terminals at an edge surface thereof;

(b) circuit modules embedded in said first recess portions and each having a base layer having a surface in which second recess portions are formed;

(c) integrated circuit chips embedded in said second recess portions and each having connection terminals;

(d) first double-layered wiring means for realizing electric connection between said connection terminals of said integrated circuit chips in each of said circuit modules to thereby provide circuit module connection terminals; and

(e) second double-layered wiring means, so formed on said main surface of said card substrate as to cover said circuit modules, for providing connection between said circuit modules and connection between said circuit module connection terminals and said plane connector terminals, said second wiring means including first parallel wiring line components insulatively provided above said card substrate and extending in a selected direction, and second parallel wiring line components insulatively provided above said first wiring line components and extending in a different direction substantially perpendicular to the selected direction,

wherein said first double-layered wiring means comprises;

a first insulative thin film having first through holes formed to cover said surface of said base layer;

a circuit module wiring pattern formed on said first insulative thin film and having wiring lines extending in two different normal directions to be coupled to said connection terminals of said integrated circuit chips via said first through holes; and

a second insulative thin film formed on said first insulative thin film to cover said circuit module wiring pattern, and having second through holes and having said circuit module connection terminals thereon, said circuit module wiring pattern being coupled to said circuit module connection terminals via said second through holes.

11. The IC card according to claim 10, wherein said second double-layered wiring means comprises:

a first insulative layer having third through holes so formed as to cover said main surface of said card substrate;

a first card wiring pattern formed on said first insulative layer and having wiring lines serving as said first wiring line components and extending in the selected direction to be coupled to said circuit module connection terminals via said third through holes;

a second insulative layer so formed on said first insulative layer as to cover said first card wiring pattern and having fourth through holes; and

a second card wiring pattern formed on said second insulative layer and having wiring lines serving as said second wiring line components and extending in said different direction to be coupled to said plane connector terminals and coupled via said fourth through holes to said first card wiring pattern.

12. The IC card according to claim 11, wherein said wiring lines of said circuit module wiring pattern and said card wiring pattern are formed of a conductive paste.

13. The IC card according to claim 12, wherein said integrated circuit chips and said circuit modules are secured in said first and second recess portions by means of a hardenable resin.

14. The IC card according to claim 13, wherein said first and second insulative thin films and said first and second insulative layers are formed of the same resin material as that of said hardenable resin.

15. The IC card according to claim 14, wherein said second insulative layer of said second double-layered wiring means is substantially level with said plane connector terminals.

16. The IC card according to claim 15, wherein said integrated circuit chips include memory chips.

17. The IC card according to claim 16, wherein said circuit modules include a D.C. power source unit.

18. The IC card according to claim 17, wherein said card substrate has a rectangular plane shape.