Excimer laser ablation method and apparatus for microcircuit fabrication

• US 5,018,164 A
• Filed: 09/12/1989
• Issued: 05/21/1991
• Est. Priority Date: 09/12/1989
• Status: Expired due to Term

• Current Assignee: Hughes Electronics Corporation (AT&T, Inc.)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Zinck, Jennifer J., Brewer, Peter D.
• Primary Examiner(s): Scott, Jr., Leon
• Application Number:
  US07/405,940
• Time in Patent Office: 616 Days
• Field of Search: 372/57, 372/103, 372/109, 372/69
• US Class Current: 372/109
• CPC Class Codes: H01L 21/428 using electromagnetic radiation, e.g. laser radiation
• CPC Class Codes: H01L 21/461 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Abstract

A pulsed beam from an excimer laser is used for precision ablation of cadmium telluride (CdTe) and other materials to fabricate and delineate devices in electronic microcircuit structures. The fluence of the beam may be adjusted to selectively remove one constituent of the material, such as cadmium vs. tellurium, at a higher rate than the other constituent, while maintaining the integrity of the material surface. The beam may selectively remove an epitaxial layer of CdTe, CdZnTe, or HgCdTe from a GaAs substrate. The beam may be directed through a projection mask and optical system onto a material to form an image for patterned ablation. The optical system may focus an image of the mask on the material to form vertical sidewall patterns, or slightly defocus the image to form curved sidewall patterns and/or concave and convex lens structures for optical arrays.

Claims

1. A laser ablation method comprising the steps of:

(a) providing a solid material including at least two constituents which are ablated from the material in response to laser beam irradiation of a predetermined wavelength at respective rate which vary unequally as functions of irradiation fluence;

(b) predetermining said functions;

(c) selecting a desired proportion between the rates at which said constituents are to be ablated;

(d) irradiating the material with a laser beam of the predetermined wavelength;

(e) setting the fluence of said laser beam in accordance with said functions to a level which is greater than an ablation fluence threshold of the material and which causes the constituents to be ablated from the material at rates which are in said selected proportion to each other; and

(f) causing predetermined relative movement between the laser beam and the material such that a predetermined pattern corresponding to the predetermined relative movement is formed in a selected area of the material by ablation.

2. A method as in claim 1, in which:

step (a) further comprises forming the solid material on a substrate which has a higher ablation fluence threshold than the constituents; and

step (e) comprises setting said fluence as being lower than the ablation fluence threshold of the substrate.

3. A method as in claim 1, in which step (e) comprises setting said fluence such that the selected proportion is unity.

4. A method as in claim 1, in which step (e) comprises setting said fluence such that the selected proportion is stoichiometric.

5. A method as in claim 1, in which step (d) comprises irradiating the material for a duration selected in accordance with said rates such that predetermined respective amounts of the constituents are ablated from the selected area of the material.

6. A method as in claim 1, in which:

step (d) comprises applying the irradiation in the form of a predetermined number of pulses of predetermined duration, the number and duration being selected in accordance with said rates to cause predetermined respective amounts of the constituents to be ablated from the selected area.

7. A method as in claim 1, in which step (d) comprises irradiating the selected area of the material with a laser beam having a predetermined wavelength between approximately 157 and 351 nm.

8. A method as in claim 1, in which step (a) comprises providing the material having cadmium and tellurium as the two constituents respectively.

9. A method as in claim 1, in which:

step (a) includes providing the material having cadmium and tellurium as the two constituents respectively, with the ablation fluence threshold being approximately 15 mJ/cm² ; and

step (d) includes irradiating the selected area with a laser beam having a predetermined wavelength between approximately 157 and 351 nm, and the predetermined fluence between approximately 25 and 45 mJ/cm².

10. A method as in claim 9, in which step (a) further comprises providing the material including a third constituent selected from the group consisting of mercury and zinc.

11. A laser ablation method comprising the steps of:

(a) providing a solid material including two components in the form of separate cadmium telluride and gallium arsenide layers which have relatively low and high ablation fluence thresholds respectively in response to laser beam irradiation of a predetermined wavelength between approximately 157 and 351 nm; and

(b) irradiating a selected area of the cadmium telluride layer having the relatively low ablation fluence threshold with a laser beam of the predetermined wavelength having a predetermined fluence between approximately 15 and 100 mJ/cm² which is between the ablation fluence thresholds of the two components, the irradiation causing removal of the cadmium telluride layer having the relatively low ablation fluence threshold form the gallium arsenide layer having the relatively high ablation fluence threshold in the selected area.

12. A laser ablation method comprising the steps of:

(a) providing a solid material including two constituents which are ablated from the material in response to laser beam irradiation of a predetermined wavelength at respective rates which vary unequally as functions of irradiation fluence;

(b) predetermining said functions;

(c) selecting a first desired proportion between the rates at which said constituents are to be ablated;

(d) irradiating a first selected area of the material with a laser beam of the predetermined wavelength;

(e) setting the fluence of said laser beam in accordance with said functions to a first level which is greater than an ablation fluence threshold of the material and which causes the constituents to be ablated from the first selected area at rates which are in said first selected proportion to each other;

(f) selecting a second desired proportion between the rates at which said constituents are to be ablated;

(g) irradiating a second selected area of the material which is adjacent to the first selected area with the laser beam of the predetermined wavelength; and

(h) setting the fluence of said laser beam in accordance with said functions to a second level which is different from the first level, greater than the ablation fluence threshold of the material, and which causes the constituents to be ablated from the second selected area at rates which are in said second selected proportion to each other.

13. A laser ablation method comprising the steps of:

(a) a providing a solid cadmium telluride material;

(b) predetermining rates at which cadmium and tellurium are ablated from the material in response to irradiation with a laser beam as functions of wavelength and fluence;

(c) selecting a desired proportion between the rates at which the cadmium and tellurium are to be ablated;

(d) irradiating a selected area of the material with a laser beam having a predetermined wavelength between approximately 157 and 351 nm; and

(e) setting the fluence of said laser beam in accordance with said functions to a level between 25 and 45 mJ/cm² and which causes cadmium and tellurium to be ablated from the selected area at rates which are in said selected proportion to each other.

14. A method as in claim 13, in which step (e) comprises setting said fluence such that the selected proportion is unity.

15. A method as in claim 13, in which step (d) comprises irradiating the material for a duration selected in accordance with said rates such that predetermined respective amounts of the constituents are ablated from the selected area.

16. A method as in claim 13, in which step (d) comprises applying the irradiation in the form of a predetermined number of pulses of predetermined duration, the number and duration being selected in accordance with said rates to cause predetermined respective amounts of the constituents to be ablated from the selected area.

17. A laser ablation method comprising the steps of:

(a) providing a projection mask having areas of high and low optical density;

(b) directing a laser beam having a predetermined fluence through the mask onto a material, thereby irradiating the material with an image of the mask to ablate portions of the material, the material having an ablation fluence threshold which is lower than a fluence of the image in an area corresponding to the low optical density area of the mask, and providing optical means between the mask and the material for de-foccusing the image of the mask onto the material for de-foccusing the image of the mask onto the material to obtain spatial ablation gradients in the material.

18. A method as in claim 17, in which step (b) comprises selecting the predetermined fluence of the laser beam such the fluence of the image in the area corresponding to the high optical density area of the mask is lower than the ablation fluence threshold of the material.

19. A method as in claim 17, in which step (b) comprises providing the material as including cadmium telluride, and the laser beam having a wavelength between 157 and 351 nm, the predetermined fluence being selected such that the fluence of the image in an area corresponding to the low optical density area of the mask is between approximately 25 and 45 mJ/cm².

20. A method as in claim 17, in which step (a) comprises providing the high optical density area of the mask as including a circular area;

the material being ablated in step (b) by irradiation with the image of the mask such that a circular convex shape is formed on an area of the material corresponding to the circular area of the image.

21. A method as in claim 17, in which step (a) comprises providing the low optical density area of the mask as including a circular area;

the material being ablated in step (b) by irradiation with the image of the mask such that a circular concave shape is formed in an area of the material corresponding to the circular area of the image.

22. A laser ablation apparatus, comprising:

a laser;

a projection mask having area of high and low optical density;

a material having a predetermined ablation fluence threshold; and

optical means provided between the mask and the material for de-foccusing the image of the mask onto the material to obtain spatial ablation gradients in the material;

the laser being disposed to direct a beam having a predetermined fluence through the mask onto the material, thereby irradiating the material with an image of the mask to ablate portions of the material, a fluence of the image in an area corresponding to the low optical density area of the mask being higher than the ablation fluence threshold of the material.

23. An apparatus as in claim 22, in which the predetermined fluence of the laser beam is selected such that the fluence of the image in the area corresponding to the high optical density area of the mask is lower than the ablation fluence threshold of the material.

24. An apparatus as in claim 22, in which the material comprises cadmium telluride, the laser beam having a wavelength between 157 and 351 nm, the predetermined fluence being selected such that the fluence of the image in an area corresponding to the low optical density area of the mask is between approximately 25 and 45 mJ/cm².

25. An apparatus as in claim 22, in which the optical means comprises a converging lens.

26. An apparatus as in claim 22, in which the high optical density area of the mask comprises a circular area;

the material being ablated by irradiation with the image of the mask such that a circular convex shape is formed on an area of the material corresponding to the circular area of the image.

27. An apparatus as in claim 22, in which the low optical density area of the mask comprises a circular area;

the material being ablated by irradiation with the image of the mask such that a circular concave shape is formed in an area of the material corresponding to the circular area of the image.