Method for manufacturing a high efficiency heat transfer surface and the surface so manufactured

• US 5,018,573 A
• Filed: 12/18/1989
• Issued: 05/28/1991
• Est. Priority Date: 12/18/1989
• Status: Expired due to Fees

• Current Assignee: Carrier Corporation (Carrier Global Corporation)
• Original Assignee: Carrier Corporation (Carrier Global Corporation)
• Inventors: Lewis, Richard C., Zohler, Steven R.
• Primary Examiner(s): Hepperle, Stephen M.
• Assistant Examiner(s): LEO, LEONARD R
• Application Number:
  US07/451,683
• Time in Patent Office: 526 Days
• Field of Search: 165/133, 427/373
• US Class Current: 165/133
• CPC Class Codes: C23C 4/18 After-treatment
• CPC Class Codes: F28F 13/187 especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites

Abstract

A method for manufacturing a heat transfer surface and the surface so manufactured. The porous surface is produced by flame spraying a metal substrate with a mixture of metallic and nonmetallic powder particles. The surface is then heated, causing the nonmetallic powder particles to oxidize into gases which diffuse from the surface, leaving voids where the nonmetallic powder particles were located. The voids provide nucleate boiling sites for a liquid being heated by the surface.

Claims

1. A heat transfer surface comprising:

a metallic substrate;

a first coating of metallic powder particles deposited on said metallic substrate so that parts of said metallic powder particles are fused to said metallic substrate and to each other with interstitial voids among said metallic powder particles; and

a second coating of metallic powder particles deposited on said first coating of metallic powder particles so that parts of said metallic powder particles of said second coating are fused to said metallic powder particles of said first coating and to each other with interstitial voids among said metallic powder particles of said second coating, said interstitial voids of said second coating having a finer or smaller pore or cavity structure relative to said interstitial voids of said first coating.

2. The heat transfer surface of claim 1 in which said metallic substrate comprises a copper tube, and said metallic powder particles of said first coating and said metallic powder particles of said second coating are comprised of copper.