Flip-chip package for integrated circuits

• US 5,019,673 A
• Filed: 08/22/1990
• Issued: 05/28/1991
• Est. Priority Date: 08/22/1990
• Status: Expired due to Term

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Juskey, Frank J., Miles, Barry M., Papageorge, Marc V.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): LEDYNH, BOT L
• Application Number:
  US07/570,751
• Time in Patent Office: 279 Days
• Field of Search: 361/397, 361/400, 361/417, 361/418, 361/420, 357/72, 357/80, 174/52.2, 174/52.4
• US Class Current: 174/527
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

A flip-chip package for integrated circuits is provided by over-molding an integrated circuit assembly which includes a flip-chip mounted to a very thin chip carrier. The flip-chip includes an array of bumped pads which fill an array of matching conductive through holes on the chip carrier and securely couple thereto. The chip carrier includes an array of bumped contacts on its back surface which correspond to the bumped pads of the flip-chip. The transfer over molding of the integrated circuit assembly provides a layer of epoxy around the exposed surfaces of the flip-chip providing an environmentally protected and removable integrated circuit package.

Claims

1. An integrated circuit package, comprising:

an integrated circuit assembly including;

a flip-chip having an array of bumped pads positioned on a bottom surface for providing terminals of an integrated circuit formed within said flip-chip;

a chip carrier being coupled to said flip-chip on a top major surface having through-holes being filled with said bumped pads of said flip-chip, said chip carrier includes an arrangement of contact pads formed on a major bottom surface which are correspondingly coupled to said bumped pads;

said integrated circuit assembly being molded with a curable epoxy to provide a protective layer around exposed surfaces of said flip-chip.

2. The integrated circuit package of claim 1, wherein said contact pads comprise bumped pads.