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Flip-chip package for integrated circuits

  • US 5,019,673 A
  • Filed: 08/22/1990
  • Issued: 05/28/1991
  • Est. Priority Date: 08/22/1990
  • Status: Expired due to Term
First Claim
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1. An integrated circuit package, comprising:

  • an integrated circuit assembly including;

    a flip-chip having an array of bumped pads positioned on a bottom surface for providing terminals of an integrated circuit formed within said flip-chip;

    a chip carrier being coupled to said flip-chip on a top major surface having through-holes being filled with said bumped pads of said flip-chip, said chip carrier includes an arrangement of contact pads formed on a major bottom surface which are correspondingly coupled to said bumped pads;

    said integrated circuit assembly being molded with a curable epoxy to provide a protective layer around exposed surfaces of said flip-chip.

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