Plug-in package for microwave integrated circuit having cover-mounted antenna

• US 5,019,829 A
• Filed: 02/08/1989
• Issued: 05/28/1991
• Est. Priority Date: 02/08/1989
• Status: Expired due to Fees

• Current Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Frisco, Jeffrey A., Heckman, Douglas E., Larson, Dawn A., Haskins, David A.
• Primary Examiner(s): Lee, Benny T.
• Application Number:
  US07/307,503
• Time in Patent Office: 839 Days
• Field of Search: 333/32, 333/33, 333/247, 343/700 R, 343/700 MS, 343/701, 343/705, 343/708, 343/753, 343/775, 343/777, 343/853, 343/909, 174/52.3, 174/52.5, 361/392-394, 361/382, 342/368, 342/311-313, 357/74, 357/80
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01Q 1/286 substantially flush mounted with the skin of the craft
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

A TO-style plug-in package for MMICs and associated antenna structure is comprised of a microwave circuit component carrier having a generally cylindrically shaped conductive header upon which one or more MMICs are supported. An aperture through the header contains a conductor pin supported within a glass seal interface, so as to form a hermetically sealed matched impedance transmission line through the package. The conductor pin is connected to a bonding pad of a microwave circuit component on the header. A generally cylindrical conductive cover engages the header and encloses a cavity within which the microwave circuit components are supported. A microstrip antenna is supported on a dielectric layer overlying an outer surface of the conductive cover and is connected to a further conductor pin that extends through a glass-sealed aperture in the cover and forms a matched impedance transmission line from the antenna to the header. The interface between the further conductor pin and the header is configured to provide an effectively blind mated, matched impedance feed-through signal path, so as to facilitate attachment of the conductive cover to the header.

Claims

1. A support package for a microwave integrated circuit component and an antenna therefor comprising:

a microwave integrated circuit component carrier having a conductive support upon a generally planar surface of which said microwave integrated circuit component is mounted, said conductive support having at least one aperture therethrough extending from an interior portion of said package, whereat said microwave integrated circuit component is mounted, to an exterior portion of said package;

a conductor element supported within and extending through a respective aperture in said support, so as to form a transmission line therethrough between said interior portion of said package, whereat said microwave integrated circuit component is mounted, and said exterior portion thereof;

a cover engageable with said support and enclosing therewith a cavity within which said microwave integrated circuit component is mounted on said support;

an antenna element supported on an outer surface of a top portion of said cover, said outer surface of said top portion of said cover being parallel to the generally planar surface of said conductive support upon which said microwave circuit component is mounted, said antenna element comprising a conductive layer extending parallel to said generally planar surface, so that the launch direction of an electromagnetic wave emitted by said antenna element is orthogonal to said generally planar surface;

first means, extending through said top portion of said cover, for providing a signal path from said microwave integrated circuit component mounted within said cavity to said antenna element; and

second means for providing a conductive path between said conductor element and said microwave integrated circuit component mounted on said conductive support.

2. A support package according to claim 1, wherein said first means comprises means for providing a matched impedance transmission line through said cover between said microwave integrated circuit component and said antenna element.

3. A support package according to claim 1, further including third means, coupled with said second means and said conductor element, for providing a matched impedance transmission line therethrough between said microwave integrated circuit component mounted on said support and the exterior of said package.

4. A support package according to claim 3, further including means for providing an electrical bonding connection between a bonding pad on said microwave integrated circuit component mounted on said support and said conductor element extending through said respective aperture.

5. A support package according to claim 1, wherein said cover is hermetically sealed to said support.

6. A support package according to claim 1, wherein said antenna element includes a section of wave guide supported on said cover, the conductive layer of said antenna element being surrounded by said section of wave guide and serving as a launch probe of the electromagnetic wave emitted by said antenna element.

7. A support package according to claim 1, wherein said conductive support includes a threaded shaft portion through which said package is mounted to a separate structure.

8. A support package according to claim 1, wherein said conductor element comprises a conductor pin supported within and extending through said respective aperture in said support, said conductor pin being conductively engageable with said microwave integrated circuit component at a first portion thereof at said interior portion of said package and forming an inductive reactance component between said circuit component and the exterior of said support and wherein said second means comprises a respective dielectric insulator surrounding said pin and being mechanically coupled to said support so as to support said pin in said respective aperture.

9. A support package according to claim 8, wherein a prescribed region of said respective aperture through which said pin extends has a dielectric constant different from that of said insulator so as to form a prescribed capacitive reactance between said pin and said support, and forms with the inductive reactance component of said pin a prescribed inductive-capacitive impedance matching network between said microwave integrated circuit component and the exterior of said package.

10. A support package according to claim 9, wherein said cover comprises a conductive cover upon an outer surface of which a layer of insulator material is formed, the conductive layer of said antenna element being formed on said layer of insulator material.

11. A support package according to claim 10, wherein said first means comprises a further conductor pin supported within and extending through a respective aperture in said conductive cover, said further conductor pin being conductively engageable with said antenna element at a first portion thereof and forming an inductive reactance component between said antenna element and an interior portion of said package and wherein said first means further comprises a respective dielectric insulator surrounding said further conductor pin and being mechanically coupled to said cover so as to support said further conductor pin in said respective aperture in said cover.

12. A support package according to claim 11, wherein a prescribed region of said respective aperture in said conductive cover through which said further conductor pin extends has a dielectric constant different from that of said dielectric insulator so as to form a prescribed capacitive reactance between said further conductor pin and said conductive cover and forms with the inductive reactance component of said further conductor pin a prescribed inductive capacitive impedance matching network between said antenna element and the interior of said package.

13. A support package according to claim 11 wherein said first means further includes a transmission line capacitive reactance network coupled between a second portion of said further conductor pin and a bonding pad on said circuit component.

14. A support package according to claim 13, wherein said transmission line capacitive reactance network comprises a semiconductor chip capacitor having a first conductive link coupled to said second portion of said further conductor pin and a second conductive link coupled to said bonding pad on said circuit component.

15. A support package according to claim 13, wherein said support comprises a conductive support and said transmission line capacitive reactance network comprises a layer of dielectric material overlying said conductive support and includes a first conductive link coupled to said second portion of said further conductor pin and a second conductive link coupled to said bonding pad on said circuit component.

16. A support package according to claim 15, wherein said first conductive link comprises a spring tab against which said further conductor pin is urged by the engagement of said cover with said support.

17. A support package according to claim 1, wherein said first means comprises means for providing a matched impedance transmission line between said microwave integrated circuit component and said antenna element for a plurality of rotational positions of engagement between said cover and said support about an axis of said conductive support.

18. A support package according to claim 7, wherein said cover comprises a conductive cover upon an outer surface of which a layer of insulator material is formed, the conductive layer of said antenna element being formed on said layer of insulator material.

19. A support package according to claim 18, wherein said first means comprises a conductor pin supported within and extending through said respective aperture in said conductive cover, said conductor pin being conductively engaged with said antenna element at a first portion thereof and forming an inductive reactance component between said antenna element and an interior portion of said package, and wherein said first means further comprises a respective dielectric insulator surrounding said conductor pin and being mechanically coupled to said cover so as to support said conductor pin in said respective aperture in said cover.

20. A support package according to claim 19, wherein a prescribed region of said respective aperture in said conductive cover through which said conductor pin extends has a dielectric constant different from that of said dielectric insulator so as to form a prescribed capacitive reactance between said conductor pin and said conductive cover, and forms, with the inductive reactance component of said conductor pin, a prescribed inductive-capacitive impedance matching network between said antenna element and the interior of said package.

21. A support package according to claim 20, wherein said first means further includes a transmission line capacitive reactance network coupled between a second portion of said conductor pin and a bonding pad on said circuit component.

22. A support package according to claim 21, wherein said antenna element includes a section of wave guide supported on and conductively coupled with said cover, the conductive layer of said antenna element being surrounded by said section of wave guide and serving as a launch probe for the electromagnetic wave emitted by said antenna element.

23. A support package according to claim 22, wherein said layer of conductive material is disposed within the interior of one end of said section of waveguide and provides an electromagnetic wave interface between said section of waveguide and said first means.

24. A support package according to claim 21, wherein said support comprises a conductive support and said transmission line capacitive reactance network comprises a layer of dielectric material overlying said conductive support and includes a first conductive link coupled to said second portion of said conductor pin and a second conductive link coupled to a bonding pad on said circuit component.

25. A support package according to claim 24, wherein said first conductive link comprises a region of reflowed solder between an end of said conductor pin and said conductive layer formed on said layer of dielectric material.

26. A support package according to claim 24, wherein said first conductive link comprises a conductive spring coupled between an end of said conductor pin and said conductive layer formed on said layer of dielectric material.

27. A support package according to claim 24, wherein said first conductive link comprises a conductive bellows coupled between an end of said conductor pin and said conductive layer formed on said layer of dielectric material.

28. A support package according to claim 18, further including means for electrically coupling said conductive cover to a portion of said conductive support interior to the portion thereof whereat said cover engages said support.

29. A support package according to claim 28, wherein said electrically coupling means comprises a conductive member extending through the aperture in said cover and a conductive spring member engaging said conductive member and said conductive support.

30. A support package according to claim 1, wherein said first means comprises means for providing a hermetically sealed matched impedance transmission line feed through said cover between said microwave integrated circuit component and said antenna element.

31. A support package according to claim 30, wherein said first means comprises means for providing a matched impedance transmission line feed through said cover between said circuit component and said antenna element.

32. A support package according to claim 31, wherein said cover comprises a conductive cover upon an outer surface of which a layer of insulator material is formed, the conductive layer of said antenna element comprising a microstrip radiation element formed on said layer of insulator material.

33. A support package according to claim 28, wherein said electrically coupling means comprises a plurality of conductive walls extending between and interior surface of said conductive cover and a surface of said conductive support upon which said microwave integrated circuit component is supported.

34. A support package according to claim 33, wherein said electrically coupling means comprises a conductive spring member having a plurality of spring tab portions arranged to form said plurality of conductive walls, said conductive spring member being retained between said cover and said support, so as to provide a plurality of electrically isolated compartments within said cavity.

35. A support package according to claim 1 wherein said conductive support contains multiple surface tiers, said microwave circuit components being supported on a first of said surface tiers and a further circuit component, having a thickness different from the thickness of said microwave circuit component, being supported on a second of said surface tiers, so that circuit components of different thicknesses may be supported by said conductive support for connections therebetween at effectively the same height, thereby minimizing interconnection inductance therebetween.

36. A support package according to claim 35, wherein said first of said tiers is located at a generally central portion of said conductive support and said second of said tiers is generally annularly shaped, surrounding said first tier.

37. A support package according to claim 19, wherein said first means further includes a transmission line capacitive coupling coupled between a second portion of said conductor pin and a bonding pad on said circuit component.

38. A support package according to claim 37, wherein said transmission line capacitive coupling comprises a first dielectric layer disposed on an interior portion of said conductive cover and a second dielectric layer disposed on said support, and further including first and second respective conductive layers formed on said first and second dielectric layers and being spaced apart from one another by a gap therebetween, said first conductive layer being electrically coupled to said conductor pin and said second conductive layer being electrically coupled to said circuit component.

39. A support package according to claim 38, wherein said conductive support contains multiple surface tiers, said microwave circuit component being supported on a first of said surface tiers and said second dielectric layer and second conductive layer formed thereon being supported on a second of said surface tiers, said second dielectric layer having a thickness different from the thickness of said microwave circuit component.

40. A support package according to claim 39, wherein said first of said tiers is located at a generally central portion of said conductive support and said second of said tiers is generally annularly shaped, surrounding said first tier

41. A TO-type plug-in package for a microwave integrated circuit component and an antenna therefor comprising:

a microwave circuit component carrier having a conductive header upon which said microwave circuit component is supported said header having at least one aperture therethrough extending from an interior portion of said package whereat said microwave circuit component is supported to an exterior portion of said package;

at least one conductor pin supported within and extending through a respective aperture in said header, so as to form a transmission line therethrough between said interior portion of said package whereat said microwave circuit component is supported and an exterior portion thereof;

a conductive cover engageable with said conductive header and enclosing therewith a cavity within which a microwave circuit component is supported;

an antenna element supported on a dielectric layer overlying an outer surface of said conductive cover;

first means, extending through said cover, for providing a matched impedance feed-through signal path, from a microwave circuit component supported by said header within said cavity, to said antenna element; and

second means for providing a conductive path between said conductor pin and a microwave circuit component supported by said header.

42. A TO-type plug-in package according to claim 41, further including third means, coupled with said second means and said conductor pin, for providing a matched impedance transmission line therethrough between said microwave circuit element supported on said header and the exterior of said package.

43. A TO-type plug-in package according to claim 42, wherein said first means comprises a further conductor pin supported within and extending through a respective aperture in said conductive cover, said further conductor pin being conductively engaged with said antenna element at a first portion thereof and forming an inductive reactance component between said antenna element and an interior portion of said package, and wherein said first means further comprises a respective dielectric insulator surrounding said further conductor pin and being mechanically coupled to said cover so as to support said further conductor pin in said respective aperture in said cover.

44. A TO-type plug-in package according to claim 43, further including means for providing an electrical bonding connection between a bonding pad on said microwave circuit component mounted on said header and a conductor pin extending through said respective aperture.

45. A TO-type plug-in package according to claim 44, further including means for electrically coupling said conductive cover to a portion of said header interior to the portion thereof whereat said cover engages said header.

46. A TO-type plug-in package according to claim 45, wherein said electrically coupling means comprises a plurality of conductive walls extending between and interior surface of said conductive cover and a surface of said conductive header upon which said microwave circuit component is supported.

47. A TO-type plug-in package according to claim 46, wherein said electrically coupling means comprises a conductive spring member having a plurality of spring tab portions arranged to form said plurality of conductive walls, said conductive spring member being retained between said cover and said header, so as to provide a plurality of electrically isolated compartments within said cavity.

48. A TO-type plug-in package according to claim 41, wherein said conductive header contains multiple surface tiers, said microwave circuit component being supported on a first of said surface tiers and a further circuit component, having a thickness different from the thickness of said microwave circuit component, being supported on a second of said surface tiers, so that circuit components of different thicknesses are supported by said conductive header for connections therebetween at effectively the same height, thereby minimizing interconnection inductance therebetween.

49. A TO-type plug-in package according to claim 48, wherein said first of said tiers is located at a generally central portion of said conductive header and said second of said tiers is generally annularly shaped, surrounding said first tier.

50. A TO-type plug-in package according to claim 43, wherein said first means further includes a transmission line capacitive coupling coupled between a second portion of said further conductor pin and a bonding pad on said microwave circuit component.

51. A TO-type plug-in package according to claim 50, wherein said transmission line capacitive coupling comprises a first dielectric layer disposed on an interior portion of said conductive cover and a second dielectric layer disposed on said header, and further including first and second respective conductive layers formed on said first and second dielectric layers and being spaced apart from one another by a gap therebetween, said first conductive layer being electrically coupled to said further conductor pin and said second conductive layer being electrically coupled to said microwave circuit component.

52. A TO-type plug-in package according to claim 51, wherein said conductive header contains multiple surface tiers, said microwave circuit component being supported on a first of said surface tiers and said second dielectric layer and second conductive layer formed thereon being supported on a second of said surface tiers, said second dielectric layer having a thickness different from the thickness of said microwave circuit component.

53. A TO-type plug-in package according to claim 52, wherein said first of said tiers is located at a generally central portion of said conductive header and said second of said tiers is generally annularly shaped, surrounding said first tier.

54. A TO-type plug-in package for microwave integrated circuit components and an antenna therefor comprising:

a conductive header upon which at least one first microwave circuit component is supported, said conductive header having at least one aperture therethrough extending from an interior portion of said package, whereat said first microwave circuit component is supported, to an exterior portion of said package;

at least one conductor supported within and extending through a respective aperture in said header so as to form a transmission line therethrough between said interior portion of said package, whereat said first microwave circuit component is supported, and an exterior portion thereof;

a conductive cover engaging with said conductive header and enclosing therewith a cavity;

at least one second microwave circuit component supported on an interior surface portion of said cover within said cavity;

an antenna element supported on a dielectric layer overlying an outer surface of said conductive cover;

first means, extending through said cover, for providing a matched impedance feed-through signal path, from a first microwave circuit component supported by said header within said cavity, to said antenna element;

second means for providing a conductive path between said conductor and said first microwave circuit component supported by said header; and

third means for providing an electrical connection between said second microwave circuit component supported on the interior surface of said cover and said first microwave circuit component supported by said header.

55. A TO-type plug-in package according to claim 54, wherein said first means comprises means for providing a hermetically sealed matched impedance transmission line feed through said cover between said first microwave circuit component and said antenna element.

56. A TO-type plug-in package according to claim 55, wherein said first means comprises means for providing a matched impedance transmission line feed through said cover between said first microwave circuit component and said antenna element.

57. A multi-component antenna mounted to a vehicle structure comprising:

a transmission line structure integrally supported with said vehicle structure; and

a plurality of microwave signal processing/antenna modules supported adjacent to and coupled with said transmission line structure, each of said microwave signal processing/antenna modules including

a microwave circuit component carrier having a conductive support upon a generally planar surface of which a microwave integrated circuit component is mounted, said support having at least one aperture therethrough extending from an interior portion of said module whereat said microwave circuit component is mounted to an exterior portion of said module,

a conductor element supported within and extending through a respective aperture in said conductive support, so as to form a transmission line therethrough between said interior portion of said module, whereat said microwave circuit component is mounted, and an exterior portion thereof, said conductor element being coupled to a portion of said transmission line structure,

a cover engageable with said support and enclosing therewith a cavity within which said microwave circuit component is mounted on said conductive support,

an antenna element supported on an outer surface of a top portion of said cover, said outer surface of said top portion of said cover being parallel to the generally planar surface of said conductive support upon which said microwave circuit component is mounted, said antenna element comprising a conductive layer extending parallel to said generally planar surface, so that the launch direction of an electromagnetic wave emitted by said antenna is orthogonal to said generally planar surface,

first means, extending through said top portion of said cover, for providing a signal path from said microwave circuit component mounted within said cavity to said antenna element, and

second means for providing a conductive path between said conductor element and said microwave circuit component mounted on said conductive support.

58. A multi-component antenna according to claim 57, further comprising a frequency selective surface structure overlying said plurality of signal processing/antenna modules.

59. A multi-component antenna according to claim 57, wherein said vehicle comprises an aircraft.

60. A multi-component antenna according to claim 57, wherein said transmission line structure includes a thermally and electrically conductive plate structure containing a matrix of transmission line channels and means for applying a cooling medium to said plate structure for controlling the temperature of operation of said signal processing/antenna modules.