Miniaturized solid state imaging device

• US 5,021,888 A
• Filed: 12/15/1988
• Issued: 06/04/1991
• Est. Priority Date: 12/18/1987
• Status: Expired due to Term

• Current Assignee: Toshiba Corporation
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kondou, Yuu, Izumi, Mamoru
• Primary Examiner(s): Brinich, Stephen
• Application Number:
  US07/284,610
• Time in Patent Office: 901 Days
• Field of Search: 358/93, 358/98, 358/213.11, 358/209
• US Class Current: 348/76
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence

Abstract

The invention is concerned with the miniaturization of construction of solid state imaging devices used in electric cameras, endoscopes or the like. A flexible printed circuit board assembled with some peripheral components thereon is attached to a side surface of a solid state imaging element to expose the element directly to incident light. The element is composed of a CCD chip and a light transparent cover sized about same as the CCD chip, and both are electrically connected using conduction bumps.

Claims

1. A solid state imaging device for detecting incident light from a predetermined direction relative to the device, comprising:

solid state image means including a light incident surface for receiving the incident light and a plurality of side surfaces each of said side surfaces being in a plane which is perpendicular to the plane of said incident light surface; and

printed circuit board means connected using an electro-conductive anisotropic film to at least one of said side surfaces of the imaging means, and elongated in back of the light incident surface and perpendicular to said light incident surface.

2. A solid state imaging device, comprising:

a light transparent cover having electro-conductive patterns thereon;

a solid state imaging chip having a light receiving surface, and electrode patterns formed on the light receiving surface;

connection bumps for connecting between the electro-conductive patterns of the light transparent cover and the electrode patterns of the imaging chip; and

a light transparent resin between the light transparent cover and the solid state imaging chip.

3. The solid state imaging device of claim 2 wherein each connection bump includes multi-layers, each layer of the multi-layers including a different material.

4. The solid state imaging device of claim 2 wherein further comprises an adhesive agent for sealing on the back of the imaging chip.

5. The solid state imaging device of claim 4 wherein further comprises leads being connected to the electro-conductive patterns of the light transparent cover.

6. The solid state imaging device of claim 5 wherein each lead is bent with 90 degrees.

7. The solid state imaging device of claim 6 wherein each lead is additionally bent with 90 degrees.

8. The solid state imaging device of claim 7 wherein each lead is bent U-like groove surrounding on the light transparent cover.