Method of producing IC cards
First Claim
1. A method of making a card in which an IC module is embedded comprising:
- preparing at least two similar resin core sheets by forming a through hole in at least a first of said resin core sheets in which an IC module may be disposed, at least a second of said resin core sheets not containing a through hole;
disposing a thermally softenable adhesive sheet having an area that is smaller than that of said core sheets and larger than that of said through hole and having a shape that covers said through hole to cover said through hole in said first resin core sheet;
bringing said first and second resin core sheets into contact with each other with said adhesive sheet therebetween covering said through hole;
inserting an IC module into said through hole;
heating said resin core sheets and said adhesive sheet to soften said adhesive sheet and pressing said resin core sheets, said adhesive sheet, and said IC module so that said softened adhesive sheet flows between said first and second core sheets toward the through hole to fill voids, if any, between the through hole and said IC module and away from the through hole to form an integral structure;
applying at least one surface protection sheet to a side of said integral structure; and
heating and pressing said protection sheet and said integral structure to adhere said
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Accused Products
Abstract
A method of producing an IC card in which an IC module is embedded, the method including preparing at least one first resin core sheet having a through hole at a position at which the IC module is to be embedded and at least one second resin core sheet having no hole at a position corresponding to the through hole, disposing adhesive sheet having an area greater than that of the through hole on the first resin core sheet covering the through hole, superposing the first and second resin core sheets with the adhesive sheet therebetween, fitting the IC module into the through hole of the first resin core sheet, heating and pressing the IC module and the resin core sheets to form an integral structure, and applying at least one surface protection sheet to the integral structure to complete the card.
64 Citations
9 Claims
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1. A method of making a card in which an IC module is embedded comprising:
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preparing at least two similar resin core sheets by forming a through hole in at least a first of said resin core sheets in which an IC module may be disposed, at least a second of said resin core sheets not containing a through hole; disposing a thermally softenable adhesive sheet having an area that is smaller than that of said core sheets and larger than that of said through hole and having a shape that covers said through hole to cover said through hole in said first resin core sheet; bringing said first and second resin core sheets into contact with each other with said adhesive sheet therebetween covering said through hole; inserting an IC module into said through hole; heating said resin core sheets and said adhesive sheet to soften said adhesive sheet and pressing said resin core sheets, said adhesive sheet, and said IC module so that said softened adhesive sheet flows between said first and second core sheets toward the through hole to fill voids, if any, between the through hole and said IC module and away from the through hole to form an integral structure; applying at least one surface protection sheet to a side of said integral structure; and heating and pressing said protection sheet and said integral structure to adhere said - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification