Method and apparatus for dampening resonant modes in packaged microwave circuits

• US 5,030,935 A
• Filed: 05/11/1989
• Issued: 07/09/1991
• Est. Priority Date: 05/11/1989
• Status: Expired due to Fees

• Current Assignee: Ball Corporation
• Original Assignee: Ball Corporation
• Inventors: Hayden, Larry G., Williams, Dylan F.
• Primary Examiner(s): LEE, BENNY T
• Application Number:
  US07/350,341
• Time in Patent Office: 789 Days
• Field of Search: 333/246, 333/247, 333/238, 333/251, 333/22 R, 361/399
• US Class Current: 333/246
• CPC Class Codes: H01P 1/162 absorbing spurious or unwanted modes of propagation

Abstract

Dampening of unwanted resonant modes in a conductive enclosure for microwave circuitry carried on a conductive ground plane is provided by interrupting the ground plane at one or more locations about the microwave circuitry and providing electical resistance by either a resistive film or resistor spanning the one or more interruptions in the ground plane to thereby dampen one or more dominant resonant moded in the enclosure. One or more interruptions or openings for electrical resistance may be preferably located at locations of maximum current flow of the one or more dominant resonant modes excited by the operation of the microwave circuit, or may comprise a single space or gap provided in the ground plane surrounding the microwave circuitry with a plurality of resistors located about the circuitry to dampen the dominant resonant modes. The electrical resistance for dampening can be calculated with the computer program of Appendix 1.

Claims

1. A method of providing damping of resonant modes in a conductive enclosure for microwave circuitry carried on a conductive ground plane, comprising:

interrupting the electrical continuity of the ground plane in at least one location located between the microwave circuitry and the conductive enclosure; and

providing electrical resistance spanning the at least one interruption in the ground plane.

2. The method of claim 1 comprising the further steps of positioning the at least one location to interrupt a maximum current flow for at least one resonant mode of operation of the microwave circuitry and providing said electrical resistance at the position of maximum current flow.

3. The method of claim 1 wherein the resistance is provided by disposing a resistive film at said interruption.

4. The method of claim 1 wherein the resistance is provided by disposing at least one resistor spanning said at least one interruption.

5. The method of claim 1 wherein said ground plane is interrupted by a single small gap surrounding said microwave circuitry.

6. The method of claim 1 wherein said ground plane is interrupted by a plurality of non-conductive openings spaced about said microwave circuitry.

7. A microwave assembly, comprising:

a substrate of dielectric material;

a conductive ground plane carried by said substrate;

microwave circuitry carried by said ground plane; and

a conductive enclosure for said microwave circuitry with a connection between said conductive enclosure and said conductive ground plane, a single non-conductive space formed in the ground plane to surround the microwave circuitry between said microwave circuitry and said conductor enclosure, said non-conductive space being provided with a plurality of resistors spanning said non-conductive space at locations spaced about the microwave circuitry.

8. A method of providing damping of resonant modes in a conductive enclosure for microwave circuitry carried on a conductive ground plane, comprising:

interrupting the electrical continuity of the ground plane by providing a single small gap therein surrounding the microwave circuitry; and

providing electrical resistance in the ground plane by disposing a plurality of resistors spanning the small gap at a plurality of locations surrounding said microwave circuitry.

9. A method of providing damping of resonant modes in a conductive enclosure for at least one microwave element carried on a conductive ground plane within the conductive enclosure,

determining the locations of maximal current flow in said ground plane for at least one resonant mode excited by operation of the at least one microwave element;

interrupting the electrical continuity of the ground plane at at least one of said locations of maximal current flow of said at least one resonant mode in said ground plane; and

providing resistance for maximal damping at said at least one location of said interruption.

10. A microwave assembly, comprising:

a substrate of dielectric material;

a conductive ground plane carried by said substrate;

microwave circuitry carried by said ground plane; and

a conductive enclosure for said microwave circuitry with a connection between said conductive enclosure and said conductive ground plane, at least one interruptive space positioned in said ground plane between said microwave circuitry and said conductive enclosure, said interruptive space being provided with electrical resistance adapted to dampen at least one resonant mode.

11. The microwave assembly of claim 10 wherein said at least one space is provided in said ground plane and said electrical resistance comprises an electrically resistive film in said space.

12. The microwave assembly of claim 10 wherein said at least one space is provided in said ground plane and said electrical resistance comprises at least one resistor spanning said space.

13. The microwave assembly of claim 10 wherein said at least one space comprises a plurality of spaces provided at locations of maximum current flow in said ground plane for at least one resonant mode of operation of the microwave circuitry and said electrical resistance provides maximal damping of said at least one resonant mode.

14. The microwave assembly of claim 13 wherein said plurality of spaces surround said microwave circuitry.

15. The microwave assembly of claim 10 wherein said at least one space comprises a plurality of spaces arranged in said ground plane around the microwave circuitry and provided with said electrical resistance.

16. A microwave assembly, comprising:

a substrate of dielectric material;

a conductive ground plane, having electrical continuity, carried by said substrate;

microwave circuitry carried by said ground plane; and

a conductive enclosure for said microwave circuitry, said ground plane'"'"'s electrical continuity being interrupted at a plurality of locations, said ground plane being provided with electrical resistance at said plurality of locations.

17. The microwave assembly of claim 16 wherein said plurality of locations provided with electrical resistance comprises non-conductive openings in the ground plane and electrical resistance spaced about said microwave circuitry.

18. A microwave assembly, comprising:

a substrate of dielectric material;

a conductive ground plane carried by said substrate;

microwave circuitry carried by said ground plane; and

a conductive enclosure for said microwave circuitry with a connection between said conductive enclosure and said conductive ground plane, at least one non-conductive space positioned in said ground plane between said microwave circuitry and said conductive enclosure, said at least one non-conductive space being provided with electrical resistance comprising at least one lumped resistor spanning said at least one non-conductive space.

19. A microwave circuit package, comprising:

a carrier substrate of dielectric material;

a metallic ground plane carried by said carrier substrate;

at least one microwave circuit element carried by said ground plane; and

a metallic cover for said at least one circuit element electrically and mechanically connected with said ground plane;

said conductive ground plane being provided with at least one non-conductive opening between said microwave circuit element and said metallic cover, said at least one non-conductive opening being provided with electrical resistance in said ground plane, said opening and said electrical resistance being positioned within said metallic cover to damp at least one resonant mode within the metallic cover.

20. The package of claim 19 wherein said carrier substrate has a metallized side and wherein said at least one opening comprises at least two non-conductive openings formed in said metallized side of the carrier substrate spaced about said at least one microwave circuit element, and said metallic cover is soldered to said metallized side of the carrier substrate surrounding said at least one circuit element.

21. The package of claim 19 wherein said carrier substrate is mounted on a metal base and has a metallized top surface to provide said ground plane, and said metallic cover has a peripheral portion that contacts said metallized top surface of said carrier upon assembly of said package.

22. The package of claim 19 wherein said at least one non-conductive opening comprises a single non-conductive space formed in said metallic ground plane and surrounding said at least one circuit element and said electrical resistance is a plurality of resistors spanning said space, each of said resistors being located at a different location of a plurality of locations surrounding the at least one circuit element.

23. The package of claim 19 wherein said conductive cover is rectilinear with two opposed longer edges and two opposed short edges and said at least one opening comprises two non-conductive openings, one opening one each side of said one microwave circuit element, said non-conductive openings being substantially rectangular with two long sides and two short sides, the long sides being about ten times the length of the short sides, said non-conductive openings being provided with a resistive film having a resistivity of about 20 ohms per square.

24. The package of claim 19 wherein said conductive cover is rectilinear having two opposed longer edges and two opposed shorter edges and said at least one opening comprises a plurality of non-conductive openings along the four rectilinear edges of the enclosure, said plurality of non-conductive openings comprising (a) a pair of long rectangular openings along each of the two opposed longer edges of the enclosure and provided with a resistive film therein having a resistance of about 25 ohms per square, each of said long rectangular openings having two longer sides and two shorter sides with the longer sides having a length equal to about six times a length of their shorter sides and about one-half the wavelength of an operating frequency of the at least one microwave circuit element on the carrier substrate, and (b) a pair of short rectangular openings along each of the two opposed shorter edges of the enclosure and provided with a resistive film therein having a resistance of about 30 ohms per square, each of said short rectangular openings having two longer sides and two shorter sides with the longer sides having length equal to about three times a length of their shorter sides and slightly less than one-quarter wavelength of said operating frequency of the microwave elements in the carrier substrate.