Method and apparatus for dampening resonant modes in packaged microwave circuits
First Claim
1. A method of providing damping of resonant modes in a conductive enclosure for microwave circuitry carried on a conductive ground plane, comprising:
- interrupting the electrical continuity of the ground plane in at least one location located between the microwave circuitry and the conductive enclosure; and
providing electrical resistance spanning the at least one interruption in the ground plane.
1 Assignment
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Accused Products
Abstract
Dampening of unwanted resonant modes in a conductive enclosure for microwave circuitry carried on a conductive ground plane is provided by interrupting the ground plane at one or more locations about the microwave circuitry and providing electical resistance by either a resistive film or resistor spanning the one or more interruptions in the ground plane to thereby dampen one or more dominant resonant moded in the enclosure. One or more interruptions or openings for electrical resistance may be preferably located at locations of maximum current flow of the one or more dominant resonant modes excited by the operation of the microwave circuit, or may comprise a single space or gap provided in the ground plane surrounding the microwave circuitry with a plurality of resistors located about the circuitry to dampen the dominant resonant modes. The electrical resistance for dampening can be calculated with the computer program of Appendix 1.
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Citations
24 Claims
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1. A method of providing damping of resonant modes in a conductive enclosure for microwave circuitry carried on a conductive ground plane, comprising:
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interrupting the electrical continuity of the ground plane in at least one location located between the microwave circuitry and the conductive enclosure; and providing electrical resistance spanning the at least one interruption in the ground plane. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A microwave assembly, comprising:
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a substrate of dielectric material; a conductive ground plane carried by said substrate; microwave circuitry carried by said ground plane; and a conductive enclosure for said microwave circuitry with a connection between said conductive enclosure and said conductive ground plane, a single non-conductive space formed in the ground plane to surround the microwave circuitry between said microwave circuitry and said conductor enclosure, said non-conductive space being provided with a plurality of resistors spanning said non-conductive space at locations spaced about the microwave circuitry.
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8. A method of providing damping of resonant modes in a conductive enclosure for microwave circuitry carried on a conductive ground plane, comprising:
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interrupting the electrical continuity of the ground plane by providing a single small gap therein surrounding the microwave circuitry; and providing electrical resistance in the ground plane by disposing a plurality of resistors spanning the small gap at a plurality of locations surrounding said microwave circuitry.
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9. A method of providing damping of resonant modes in a conductive enclosure for at least one microwave element carried on a conductive ground plane within the conductive enclosure,
determining the locations of maximal current flow in said ground plane for at least one resonant mode excited by operation of the at least one microwave element; -
interrupting the electrical continuity of the ground plane at at least one of said locations of maximal current flow of said at least one resonant mode in said ground plane; and providing resistance for maximal damping at said at least one location of said interruption.
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10. A microwave assembly, comprising:
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a substrate of dielectric material; a conductive ground plane carried by said substrate; microwave circuitry carried by said ground plane; and a conductive enclosure for said microwave circuitry with a connection between said conductive enclosure and said conductive ground plane, at least one interruptive space positioned in said ground plane between said microwave circuitry and said conductive enclosure, said interruptive space being provided with electrical resistance adapted to dampen at least one resonant mode. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A microwave assembly, comprising:
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a substrate of dielectric material; a conductive ground plane, having electrical continuity, carried by said substrate; microwave circuitry carried by said ground plane; and a conductive enclosure for said microwave circuitry, said ground plane'"'"'s electrical continuity being interrupted at a plurality of locations, said ground plane being provided with electrical resistance at said plurality of locations. - View Dependent Claims (17)
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18. A microwave assembly, comprising:
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a substrate of dielectric material; a conductive ground plane carried by said substrate; microwave circuitry carried by said ground plane; and a conductive enclosure for said microwave circuitry with a connection between said conductive enclosure and said conductive ground plane, at least one non-conductive space positioned in said ground plane between said microwave circuitry and said conductive enclosure, said at least one non-conductive space being provided with electrical resistance comprising at least one lumped resistor spanning said at least one non-conductive space.
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19. A microwave circuit package, comprising:
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a carrier substrate of dielectric material; a metallic ground plane carried by said carrier substrate; at least one microwave circuit element carried by said ground plane; and a metallic cover for said at least one circuit element electrically and mechanically connected with said ground plane; said conductive ground plane being provided with at least one non-conductive opening between said microwave circuit element and said metallic cover, said at least one non-conductive opening being provided with electrical resistance in said ground plane, said opening and said electrical resistance being positioned within said metallic cover to damp at least one resonant mode within the metallic cover. - View Dependent Claims (20, 21, 22, 23, 24)
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Specification