Integration of ceramic capacitor

• US 5,031,069 A
• Filed: 12/28/1989
• Issued: 07/09/1991
• Est. Priority Date: 12/28/1989
• Status: Expired due to Fees

• Current Assignee: Sundstrand Corporation (Rtx Corporation)
• Original Assignee: Sundstrand Corporation (Rtx Corporation)
• Inventors: Anderson, Kyle
• Primary Examiner(s): GRIFFIN, DONALD
• Application Number:
  US07/458,407
• Time in Patent Office: 558 Days
• Field of Search: 361/306, 361/321, 361/320, 361/386, 361/401, 174/52 FP, 357/51, 357/74, 357/75, 357/80
• US Class Current: 361/321.1
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49 of a plurality of wire connectors
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/1301 Thyristor
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/09309 : Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 3/403 : Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: Y10S 257/916 : Narrow band gap semiconductor material, <<1ev

Abstract

A power module consisting of electronic components disposed within a hollowed-out, hermetically-sealed, multi-layered ceramic capacitor formed of spaced side walls of stacked alternating layers of conductors and dielectrics, the side walls being covered by top and bottom covers.

Claims

1. A hermetically sealed power module device comprising:

side walls formed of spaced sections which bound an opening, at least one such wall comprising a capacitor of stacked alternating layers of conductors and dielectrics;

electrical components disposed within said opening;

a first conductor element disposed on an outer peripheral edge of said capacitor side wall;

a second conductor element disposed on an outer peripheral edge of another of said side walls; and

top and bottom covers each disposed on said side walls hermetically sealing said components within said opening, at least one of said covers being made of a conductive material and having a plurality of lips contacting said conductor elements.

2. The device of claim 1 in which said capacitor includes means for dissipating heat build-up in said capacitor.

3. The device of claim 2 in which said dissipating means includes said spaced sections.

4. The module of claim 1 in which said dielectric layers are made of ceramic.

5. The module of claim 1 in which at least one cover is made of molybdenum.

6. The module of claim 1 in which a circuit board having one or more electric components serves as one of said covers.

7. The module of claim 1 in which a cover is attached by means of solder to a wall formed by the capacitor body.

8. The module of claim 1 in which one side of said capacitor is covered with solder.

9. The module of claim 1 in which a heat sink is mounted on an outside surface of said module.

10. The module of claim 1 in which a heat exchanger device is attached to an outside surface of a cover.

11. The one module of claim 1 in which electric circuitry elements are disposed within said opening;

said elements being adapted to connect said electric components into the desired circuit configuration.

12. The module of claim 11 in which the electric circuitry elements include means for controlling the function of the components disposed within the module.

13. The module of claim 11 in which the electric circuitry elements include a feed-through conductor passing through one of said side walls from said opening inside the module walls to outside the module.

14. The module of claim 13 in which the feed-through conductor is made of a material having a coefficient of thermal expansion approximating the coefficient of thermal expansion of said ceramic material.

15. The module of claim 1 in which one of said electrical components is mounted on a small conductive plate, said plate being attached to the inner surface of and electrically insulated from a cover.

16. The module of claim 1 in which said components comprise a power converter configured as a full phase switching assembly.

17. The module of claim 16 in which said capacitor functions as a DC link capacitor.

18. The module of claim 16 in which a plurality of said components are disposed within said opening and said components include a power switch, a flyback diode, a resistor, and a snubber capacitor.

19. The module of claim 16 and further comprising a positive current lead, a negative current lead, and a phase lead.

20. The module of claim 16 which has control leads comprising a drive control lead, an internal power supply control lead or an overload protection control lead.

21. The module of claim 16 in which said power switches comprise insulated gate bipolar transistors, bipolar transistors, thyristors or power FETs.