Test device for testing integrated circuits
First Claim
1. A test device for testing the logic units of an integrated circuit formed on a semiconductor wafer comprising:
- a support for a wafer to be tested, said wafer having integrated circuit logic units including electrical devices and circuitry and contact points formed thereon;
a flexible tester surface having a thickness of no greater than 15 microns and having a number of probe points corresponding to said contact points of said wafer;
means for electrically interconnecting said probe points of said flexible tester surface and said contact points of said wafer; and
means for supplying programmable input/output diagnostic signals to said flexible tester surface for testing the electrical devices and circuitry of said wafer.
3 Assignments
0 Petitions
Accused Products
Abstract
Each transistor or logic unit on an integrated circuit wafer is tested prior to interconnect metallization. By CAD, the transistor or logic units placement net list is revised to substitute redundant defect-free logic units for defective ones. Then the interconnect metallization is laid down and patterned under control of CAD. Each die in the wafer thus has its own interconnect scheme, although each die is functionally equivalent, and yields are much higher than with conventional testing at the completed circuit level. The individual transistor or logic unit testing is accomplished by a specially fabricated flexible tester surface made in one embodiment of several layers of flexible silicon dioxide, each layer containing vias and conductive traces leading to thousands of microscopic metal probe points on one side of the test surface. The probe points electrically contact the contacts on the wafer under test by fluid pressure. The tester surface traces are then connected, by means of multiplexers, to a conventional tester signal processor.
165 Citations
14 Claims
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1. A test device for testing the logic units of an integrated circuit formed on a semiconductor wafer comprising:
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a support for a wafer to be tested, said wafer having integrated circuit logic units including electrical devices and circuitry and contact points formed thereon; a flexible tester surface having a thickness of no greater than 15 microns and having a number of probe points corresponding to said contact points of said wafer; means for electrically interconnecting said probe points of said flexible tester surface and said contact points of said wafer; and means for supplying programmable input/output diagnostic signals to said flexible tester surface for testing the electrical devices and circuitry of said wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A test device for testing the logic units of an integrated circuit formed on a semiconductor wafer comprising:
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a support for a wafer to be tested, said wafer having integrated circuit logic units including electrical devices and circuitry and contact points formed thereon; a flexible tester surface having at least one thousand probe points corresponding to said contact points of said wafer; means for electrically interconnecting said probe points of said flexible tester surface and said contact points of said wafer; and means for supplying programmable input/output diagnostic signals to said flexible tester surface for testing the electrical devices and circuitry of said wafer.
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12. A test device for testing the logic units of an integrated circuit formed on a semiconductor wafer comprising:
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a support for a wafer to be tested, said wafer having integrated circuit logic units including electrical devices and circuitry and contact points formed thereon; a flexible tester surface, said flexible tester surface having a number of probe points corresponding to said contact points of said wafer, wherein each probe point has a diameter not greater than four microns; means for electrically interconnecting said probe points of said flexible tester surface and said contact points of said wafer; and means for supplying programmable input/output diagnostic signals to said flexible tester surface for testing the electrical devices and circuitry of said wafer.
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13. A test device for testing the logic units of an integrated circuit formed on a semiconductor wafer comprising:
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a support for a wafer to be tested, said wafer having integrated circuit logic units including electrical devices and circuitry and contact points formed thereon; a flexible tester surface having a number of probe points corresponding to said contact points of said wafer; means for electrically interconnecting said probe points of said flexible tester surface and said contact points of said wafer; programmable input/output circuitry formed on the flexible tester surface for supplying diagnostic signals to each of said probe points for testing the electrical devices and circuitry of said wafer.
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14. A test device for testing the logic units of an integrated circuit formed on a semiconductor wafer comprising:
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a support for a wafer to be tested, said wafer having integrated circuit logic units including electrical devices and circuitry and contact points formed thereon; a tester surface disposed on said support, said tester surface having a number of probe points corresponding to said contact points of said wafer; means for electrically interconnecting said probe points of said tester means and said contact points of said wafer; means for supplying programmable input/output diagnostic signals to said tester surface for testing the electrical devices and circuitry of said wafer; and interconnect circuitry formed on the tester surface for connecting the means for supplying to said probe points and including at least two conductive layers separated by an insulating layer.
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Specification