Method of manufacturing an insulating arrangement for optical insulation of integrated components

• US 5,037,507 A
• Filed: 02/09/1990
• Issued: 08/06/1991
• Est. Priority Date: 02/19/1988
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Matz, Richard, Zirrgiebel, Jutta
• Primary Examiner(s): Zimmerman, John J.
• Application Number:
  US07/478,021
• Time in Patent Office: 543 Days
• Field of Search: 156/647, 156/648, 156/643, 156/659.1, 156/662, 219/121.68, 250/578, 250/211 R, 357/16, 357/48, 357/52, 357/84, 357/30, 357/17, 428/596, 428/614, 428/620, 428/642, 428/615
• US Class Current: 216/94
• CPC Class Codes: G02B 6/122 Basic optical elements, e.g. light-guiding paths
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/12528 Semiconductor component
• CPC Class Codes: Y10T 428/12681 Ga-, In-, Tl- or Group VA metal-base component

Abstract

An isolating arrangement for isolating a portion of a substrate from the remaining portions of the substrate, characterized by the arrangement comprising a pair of obliquely extending slots which merge with each other in the interior of the substrate to isolate a portion or region of the substrate from the remaining portion, except at least at one end of the portion extending between the slots. The slots are preferably formed by a laser-induced, wet-chemical etching and, subsequent to forming the slots, they can be filled with a material, such as metal or a ternary absorber material, to increase the isolation of the substrate region or portion.

Claims

1. A method for manufacturing an insulating means for insulating a portion of a substrate from the remaining portion of a substrate, said method comprising the steps of providing a substrate having a surface, laser-induced, wet-chemically etching the surface with two laser rays being directed onto the substrate surface obliquely in a direction toward one another to impinge the substrate surface only in strip-shaped regions at a fixed spacing to each other to form slots in the substrate surface, continuing the etching to a depth at which the slots intersect one another in the interior of the substrate to isolate the material between the slots from the remaining portion of the substrate.

2. A method according to claim 1, which includes, prior to the step of laser-induced, wet-chemical etching, providing a shadow mask on the surface of the substrate, said shadow mask having strip-shaped openings defining the strip-shaped regions and then proceeding with the laser-induced, wet-chemical etching.

3. A method according to claim 2, which further includes, subsequent to etching the slots, subsequently filling the slots with a metal.

4. A method according to claim 2, which includes, subsequent to the wet-chemical etching of the slots, filling the slots with a ternary absorber material.

5. A method according to claim 1, which includes, subsequent to the wet-chemical etching of the slots, filling the slots with metal.

6. A method according to claim 1, which includes, subsequent to the step of wet-chemically etching the slots, filling the slots with a ternary absorber material.