Method of molding an optical simulator

• US 5,039,456 A
• Filed: 03/23/1990
• Issued: 08/13/1991
• Est. Priority Date: 03/23/1990
• Status: Expired due to Fees

• Current Assignee: AMP Incorporated (Johnson Controls International plc)
• Original Assignee: AMP Incorporated (Johnson Controls International plc)
• Inventors: Bowen, Terry P., Reitz, Paul R., Stape, William J.
• Primary Examiner(s): Lowe, James
• Application Number:
  US07/498,072
• Time in Patent Office: 508 Days
• Field of Search: 264/1.5, 264/1.2, 264/1.7, 264/2.7, 264/162, 350/96.20
• US Class Current: 264/1.25
• CPC Class Codes: B29D 11/0075 Connectors for light guides
• CPC Class Codes: G02B 6/264 with optical elements between opposed fibre ends which perform a function other than beam splitting having lens focusing means G02B6/32; utilising prism or grating G02B6/34
• CPC Class Codes: G02B 6/3827 Wrap-back connectors, i.e. containing a fibre having an U shape
• CPC Class Codes: G02B 6/3865 fabricated by using moulding techniques shaping techniques of plastic materials in general B29C; producing plastic optical fiber connectors B29D11/0075
• CPC Class Codes: G02B 6/3897 Connectors fixed to housings, casing, frames or circuit boards G02B6/44528 takes precedence
• CPC Class Codes: G02B 6/4248 Feed-through connections for the hermetical passage of fibres through a package wall see provisionally also G02B6/4428
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: G02B 6/4295 coupling with semiconductor devices activated by light through the light guide, e.g. thyristors, phototransistors

Abstract

An optical simulator 10, shaped to be interchangeable with a complimentary connector 7 that intermates with an optical connector housing 6 having an optical emitter 4 and an optical detector 5, comprises an alignment fixture with connectors for intermating with the optical emitter 4 and the optical detector 5. Included is an optical fiber 11 formed in a loop and installed within the alignment fixture 12 with a first end face 15 of the loop 11 aligned with the emitter 4 and a second end face 16 of the loop 11 aligned with the detector 5 of the optical connector 6. The simulator 10 is a solid molded body of an electrically insulating material. The optical fiber formed in a loop 11 further comprises an optical fiber having a rigid thin coating of electroplated metal 14.

Claims

1. A process for producing an optical simulator, said process comprising the steps of:

depositing a relatively thin rigid coating of metal by electro-less plating on an optical fiber;

depositing a relatively thick electroplated coating of metal over the relatively thin rigid coating on the optical fiber;

forming the plated optical fiber in a loop with a first end face and a second end face;

molding the plated optical fiber together with an alignment fixture of electrically insulative material, said alignment fixture having a first connector aligned with the first end face of inter-mating with an optical emitter and a second connector aligned with the second end face for intermating with an optical detector; and

applying to an end face of the plated optical fiber attenuation inducing means for providing attenuation of optical power to the optical detector, said attenuation including means comprising a compact device.

2. The process of claim 1 wherein the end faces of plated optical fibers of a multiplicity of simulators are arranged into an array of faces and gang polished by a single polishing step.

5. The process recited in claim 1 wherein the attenuation inducing means includes an optically thin film.

6. The process recited in claim 1 wherein the attenuation inducing means includes an optical filter.

7. The process recited in claim 1 wherein the attenuation inducing means is a core diameter mismatch or numerical aperture mismatch between the end face and the detector.

8. The process recited in claim 1 wherein the relatively thin electro-less coating is of gold, and the relatively thick electroplated coating is of nickel.

3. The process of claim 10 wherein said electrically insulating material is selected from the group consisting of ceramics, thermoset polymers and high temperature thermoplastic materials.

4. The process of claim 3 wherein said high temperature thermoplastic materials are selected from the group consisting of polysulfone, polyetherimide, polyethersulfone, polyphenylene sulfide, and polyetheretherketone.