Method of screening A.C. performance characteristics during D.C. parametric test operation
First Claim
1. A method of implementing a process for manufacturing integrated circuits comprising the following steps:
- (1) developing specifications for the process to be implemented which characterize both A.C. and D.C. parameters associated with the process to be implemented;
(2) fabricating a multiplicity of integrated circuit devices and at least one process monitor circuit different from the integrated circuit devices in a wafer of semiconductor material utilizing the process to be implemented;
(3) generating an output signal which has an amplitude which varies with said A.C. and D.C. parameters utilizing the process monitor circuit;
(4) measuring said A.C. and D.C. parameters by detecting the amplitude of the output signal; and
(5) comparing said measured parameters with said developed specifications.
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Accused Products
Abstract
A method of characterizing A.C. performance of an integrated circuit based upon D.C. measurements utilizing a process monitor circuit. The process monitor circuit provides a D.C. output having a magnitude which varies with the frequency of an oscillator section of the monitor circuit. The frequency is a function of both A.C. and D.C. performance, therefore the process monitor output signal is indicative of such performance. Since D.C. measurements may be made while the integrated circuits are in wafer form utilizing a conventional wafer prober and parametric tester, it is possible to detect A.C. performance problems very early in the manufacturing process.
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Citations
17 Claims
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1. A method of implementing a process for manufacturing integrated circuits comprising the following steps:
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(1) developing specifications for the process to be implemented which characterize both A.C. and D.C. parameters associated with the process to be implemented; (2) fabricating a multiplicity of integrated circuit devices and at least one process monitor circuit different from the integrated circuit devices in a wafer of semiconductor material utilizing the process to be implemented; (3) generating an output signal which has an amplitude which varies with said A.C. and D.C. parameters utilizing the process monitor circuit; (4) measuring said A.C. and D.C. parameters by detecting the amplitude of the output signal; and (5) comparing said measured parameters with said developed specifications. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing integrated circuits comprising the following steps,
(1) fabricating a multiplicity of integrated circuit devices and at least one process monitor circuit means in a wafer of semiconductor material, said process monitor circuit means being a means for providing an output signal having a frequency indicative of the A.C. performance of said multiplicity of integrated circuit devices; -
(2) converting said output signal to a converted signal on the wafer having an amplitude which corresponds to the frequency of the monitor output signal; (3) measuring said converted signal amplitude and comparing the result to a predetermined specification; (4) rejecting one or more of said plurality of integrated circuit devices in the event said monitor output signal does not meet said predetermined specifications; (5) breaking the wafer of semiconductor material so as to form individual die made up of said integrated circuit devices; (6) packaging said individual die containing said integrated circuit devices which have not been rejected; and (7) performing further electrical tests on said packaged individual die. - View Dependent Claims (13, 14, 15)
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16. A method of manufacturing integrated circuits comprising the following steps;
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(1) fabricating a multiplicity of integrated circuit devices and at least one process monitor circuit means in a wafer of semiconductor material in accordance with a predetermined fabrication process, said process monitor circuit means being a means for providing an output signal having a frequency indicative of the A.C. performance of said multiplicity of integrated circuit devices; (2) converting said output signal to an amplitude signal on the wafer having an amplitude indicative of the frequency of the monitor output signal; (3) measuring said converted signal and comparing said converted signal to a predetermined specification; (4) altering said predetermined fabrication process in the event the comparison to said specification is not favorable; (5) fabricating additional integrated circuit devices, subsequent to the preceding step of altering, utilizing said predetermined fabrication process; and (6) repeating the previous fabricating step a multiplicity of times. - View Dependent Claims (17)
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Specification