Polyester resin composition

• US 5,039,760 A
• Filed: 02/02/1990
• Issued: 08/13/1991
• Est. Priority Date: 02/07/1989
• Status: Expired due to Fees

• Current Assignee: Polyplastics Co., Ltd. (Daicel Corporation)
• Original Assignee: Polyplastics Co., Ltd. (Daicel Corporation)
• Inventors: Naka, Michiro, Nakane, Toshio, Hijikata, Kenji, Kageyama, Yukihiko, Konuma, Hiroaki
• Primary Examiner(s): Short, Patricia
• Application Number:
  US07/473,664
• Time in Patent Office: 557 Days
• Field of Search: 525/437, 525/448
• US Class Current: 525/448
• CPC Class Codes: C08G 63/20 Polyesters having been prepared in the presence of compounds having one reactive group or more than two reactive groups
• CPC Class Codes: C08K 5/353 Five-membered rings
• CPC Class Codes: C08L 67/02 Polyesters derived from dicarboxylic acids and dihydroxy compounds C08L67/06 takes precedence

Abstract

A polyester resin composition exhibiting improved heat-resistant flexibility including (A) a polyester copolymer which is the polycondensation reaction product of (a) an aromatic dicarboxylic acid or an ester-forming derivative thereof, (b) an aliphatic glycol, and (c) between 0.001 to 1.0 mole %, based upon component (a), of a branch-forming compound, and (B) between 0.1 to 10% by weight (based on the total weight of the composition) of a bisoxazoline compound.

Claims

1. A moldable heat-resistant polyester resin composition which retains its flexibility when subjected to cyclic thermal conditions, said composition comprising:

(A) a branched polyester copolymer which is the polycondensation reaction product of (a) an aromatic dicarboxylic acid or an ester-forming derivative thereof, (b) an aliphatic glycol, and (c) between 0.001 to 1.0 mole % based upon component (a), of a branch-forming compound, and

(B) between 0.1 to 10% by weight, based on the total weight of the composition, of a bisoxazoline compound which is one selected from m-phenylenebisoxazoline or p-phenylenebisoxazoline.

2. A resin composition as in claim 1, wherein said aliphatic glycol is at least one compound selected from C2 to C8 low-molecular weight glycols.

3. A resin composition as in claim 2, wherein said C2 to C8 low-molecular weight glycol is at least one glycol selected from ethylene glycol, 1,4-butylene glycol and 1,4-butene glycol.

4. A resin composition as in claim 1, wherein said branch-forming compound is a compound having at least three functional groups, in sum total, in its molecule, wherein said functional groups are selected from carboxyl and hydroxyl groups, and ester-forming derivative groups thereof.

5. A resin composition as in claim 4, wherein said branch-forming compound is at least one compound selected from trimesic acid, trimellitic acid, and pyromellitic acid, and ester-forming derivatives thereof.