Electronic endoscope with a mask bump bonded to an image pick-up device

• US 5,040,069 A
• Filed: 05/25/1990
• Issued: 08/13/1991
• Est. Priority Date: 06/16/1989
• Status: Expired due to Term

• Current Assignee: Fuji Photo Optical Co. Ltd (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Optical Co. Ltd (Fujifilm Holdings Corporation)
• Inventors: Shiino, Makoto, Matsumoto, Seiji
• Primary Examiner(s): Britton, Howard W.
• Assistant Examiner(s): Ho, Tuan V.
• Application Number:
  US07/528,488
• Time in Patent Office: 445 Days
• Field of Search: 358/98, 358/213.11, 358/209, 357/80, 357/74, 357/79, 250/239, 250/578.1
• US Class Current: 348/76
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

Described herein is a solid image pickup assembly for use in an electronic endoscope, including a substrate having a mask defining a masked area bearing wiring patterns and an image pickup area in the form of a light transmitting window, and a solid image pickup device. Also, the solid image pickup device is mounted on the substrate with the light receiving surface thereof in alignment with the transparent window by directly bump bonding electrodes of the image pickup device to the corresponding electrodes on the part of the substrate.

Claims

1. A solid image pickup assembly for use in an electronic endoscope comprising:

a solid image pickup device having an image pickup area and electrodes on the same surface;

a substrate having a masking means defining an image pickup area in the form of a light transmitting transparent window;

said masking means bearing a wiring pattern and electrodes on a surface opposite to said image pickup device; and

at least one electrode of said image pickup device and at least one respective electrode of said masking means being bump bonded to one another.

2. A solid image pickup assembly as defined in claim 1, wherein said substrate is composed of an opaque substrate sheet having an opening in said image pickup area and a transparent sheet fitted in said opening.

3. A solid image pickup assembly as defined in claim 1, wherein said substrate is composed of a transparent support member and a thin film substrate member adhered to said transparent support member.

4. A solid image pickup assembly as defined in claim 1, wherein said substrate is composed of a transparent support member and a masking layer formed on one side of said transparent support member.

5. A solid image pickup assembly as defined in claim 3, wherein said thin film substrate member is provided with peripheral extensions projecting outward from peripheral edge portions of said transparent support member, said wiring patterns being extended to said peripheral extensions for connection to a cable.