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Apparatus for cooling circuits

  • US 5,040,381 A
  • Filed: 04/19/1990
  • Issued: 08/20/1991
  • Est. Priority Date: 04/19/1990
  • Status: Expired due to Fees
First Claim
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1. An apparatus for cooling a circuit module comprising:

  • a heat sink,a thermo-electric device comprising a series of semiconductor regions sandwiched between first and second electrically conductive layers,a thin polymer-based dielectric layer having a first face bonded to said heat sink, and a second face bonded to said first electrically conductive layer, for conducting heat from said thermo-electric device towards said heat sink, andsaid second electrically conductive layer coupled to thermally receive heat from said circuit module.

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