Electrolytic capacitor with codeposited noble metal/base metal cathode element and method for making

• US 5,043,849 A
• Filed: 10/23/1990
• Issued: 08/27/1991
• Est. Priority Date: 04/17/1990
• Status: Expired due to Term

• Current Assignee: Tansistor Electronics Incorporated
• Original Assignee: Tansistor Electronics Incorporated
• Inventors: Libby, Stuart E.
• Primary Examiner(s): GRIFFIN, DONALD
• Application Number:
  US07/602,928
• Time in Patent Office: 308 Days
• Field of Search: 29/25.03, 29/25.42, 361/503, 361/504, 361/517, 361/532, 361/533, 361/535
• US Class Current: 361/516
• CPC Class Codes: H01G 9/0425 specially adapted for cathode
• CPC Class Codes: H01G 9/08 Housing; Encapsulation

Abstract

Codeposited noble metal/base metal cathode elements provide electrolytic capacitors with high volumetric efficiencies. The requisite codeposition is obtained by electrodeposition of the metals onto the interior surface of capacitor cases from solutions of the metal salts.

Claims

1. An electrolytic capacitor having a volumetric efficiency greater than about 2500 microfarad-volts per cubic centimeter, said capacitor comprising, in cooperative combination, a metal case having at least one open end and having first lead means attached thereto, a noble metal/base metal electrode element codeposited on the interior of said case from a solution of the metal salts including a molar ratio of noble metal ion to base metal ion between about 0.5 and 1.2, an electrolyte substantially filling the case, a second electrode disposed within said case and separated therefrom by an insulating support, said second electrode having second lead means attached thereto, and means for sealing said open end.

2. A capacitor of claim 1 in which the noble metal is selected from the platinum family.

3. A capacitor of claim 2 in which the noble metal is palladium or platinum.

4. A capacitor of claim 2 in which the noble metal/base metal electrode element is formed by electrodeposition from solution.

5. A capacitor of claim 1 in which the base metal is selected from copper, iron, silver, lead, cobalt, and tin.

6. A capacitor of claim 5 in which the base metal is copper.

7. A capacitor of claim 5 in which the base metal is iron.

8. A capacitor of claim 5 in which the base metal is lead.

9. A capacitor of claim 5 in which the base metal is tin.

10. A capacitor of claim 1 in which the noble metal is palladium and the base metal is copper.

11. A capacitor of claim 1 in which the metal case is a tantalum case.

12. A capacitor of claim 8 in which the tantalum case is pretreated to destroy its propensity to passivate.

13. A capacitor of claim 1 in which the metal case is a silver case.

14. A capacitor of claim 1 in which the metal case is pretreated to destroy its propensity to passivate.

15. A capacitor of claim 1 in which said noble metal/base metal electrode element is codeposited on the interior o said case from a solution including an approximately equimolar ratio of noble metal ion to base metal ion.

16. An electrolytic capacitor having a volumetric efficiency greater than about 2500 microfarad-volts per cubic centimeter, said capacitor comprising, in cooperative combination, a metal case having at least one open end and having cathode lead means attached thereto, a platinum family metal/base metal cathode element codeposited on the interior of said case from a solution of the metal salts including a molar ratio of noble metal ion to base metal ion between about 0.5 and 1.2, an electrolyte substantially filling the case, an anode disposed within said case and separated therefrom by an insulating support, said anode having anode lead means attached thereto, and means for sealing said open end.

17. A capacitor of claim 16 in which the base metal is selected from copper, tin, cobalt, silver, lead, and iron.

18. A capacitor of claim 16 in which the base metal is copper, the platinum family metal is palladium or platinum, the metal case is a silver or tantalum case, the electrolyte is sulfuric acid, and the anode is a porous tantalum anode.

19. A counterelectrode for electrolytic devices having a volumetric efficiency greater than about 2500 microfarad-volts per cubic centimeter, said devices comprising a platinum family metal/base metal counterelectrode element codeposited on a valve metal support from a solution of the metal salts including a molar ratio of noble metal ion to base metal ion between about 0.5 and 1.2.

20. A process for preparing a counterelectrode having a platinum family metal/base metal element codeposited on a metal support, comprising:

a.) preparing a deposition solution of platinum family metal salt, base metal salt, and electrolyte;

b.) contacting said metal support with the deposition solution;

c.) electrolyzing the deposition solution for a time and at a current density sufficient to cause codeposition of the platinum family metal and the base metal onto the metal support from a solution of the metal salts including a molar ratio of noble metal ion to base metal ion between about 0.5 and 1.2; and

d.) removing the counterelectrode from the residual deposition solution.

21. A process of claim 20 in which the metal support is in the form of a can to which the deposition solution is added.

22. A process of claim 21 in which the platinum family metal is palladium or platinum, the base metal is copper, and the metal support is silver or tantalum.

23. A process of claim 22 in which the electrolysis is effected for a period of from about 3 to about 7 minutes at a current density of from about 5 to about 20 mA per cm².

24. A counterelectrode produced by the process of claim 20.

25. A capacitor having as one element a cathode produced by the process of claim 20.