Half bridge device package, packaged devices and circuits

• US 5,043,859 A
• Filed: 12/21/1989
• Issued: 08/27/1991
• Est. Priority Date: 12/21/1989
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Korman, Charles S., Yerman, Alexander J., El-Hamamsy, Sayed-Amr A., Neugebauer, Constantine A.
• Primary Examiner(s): Stephan, Steven L.
• Assistant Examiner(s): VOELTZ, EMANUEL T
• Application Number:
  US07/454,550
• Time in Patent Office: 614 Days
• Field of Search: 363/132, 363/147, 361/395, 361/397, 361/400, 361/401, 361/402, 361/403, 361/406, 361/409, 361/412, 361/417, 361/418, 361/420, 361/421, 174/260, 174/261, 174/52.1, 174/52.2, 174/52.4, 357/41
• US Class Current: 363/147
• CPC Class Codes: H01L 2223/665 Bias feed arrangements
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 23/5386 Geometry or layout of the interconnection structure
• CPC Class Codes: H01L 23/64 Impedance arrangements
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/06 of a plurality of bonding areas
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A package for a two-switching-device half bridge circuit comprises an insulating substrate having first, second and third external power terminals along with control terminals bonded to the substrate. The power terminals are configured to provide a straight-through-the package current path from the first external power terminal to the second or common external power terminal and from the second or common external power terminal to the third external power terminal. The control terminals are preferably Kelvin terminal pairs in order to minimize feedback from the power current paths to the control circuits. The power devices are preferably bonded to the first external power terminal and the second external power terminal, respectively, with their connections respectively to the second power terminal and third power terminal substantially identical in order to provide power current paths through the package having substantially identical electrical and thermal impedances. This half bridge package is appropriate for use in high performance, high frequency, half bridge circuits.

Claims

1. A semiconductor device package comprising:

an electrically insulating substrate;

first, second and third external power terminals each bonded to said substrate;

a first semiconductor switching device mounted on, and electrically connected to, said first external power terminal; and

a second semiconductor switching device mounted on, and electrically connected to, said second external power terminal;

said first and third external power terminals being disposed in opposed relation to said second external power terminal, said first semiconductor switching device further being electrically connected to said second power terminal and said second semiconductor switching device further being electrically connected to said third power terminal, so that said package exhibits minimal inductance.

2. The package recited in claim 1 wherein:

said package is configured to contain said first and second switching devices in a half bridge circuit;

said first and third external power terminals are the supply terminals for said half bridge circuit; and

said second external power terminal is the output terminal for said half bridge circuit.

3. The package recited in claim 2 wherein:

said first, second and third external power terminals each extend beyond an edge of said substrate.

4. The package recited in claim 3, further comprising:

first and second control terminals each bonded to said substrate.

5. The package recited in claim 4 wherein:

said first and second control terminals each extend beyond an edge of said substrate.

6. The package recited in claim 4 wherein:

said first and second control terminals each comprise a pair of Kelvin terminals.

7. The package recited in claim 2 wherein:

said first external power terminal is configured for said first switching device to be bonded directly thereto; and

said second external power terminal is configured for said second switching device to be bonded directly thereto.

8. The package recited in claim 2 wherein:

said second external power terminal is configured for said second power terminal of said first switching device to be bonded direct thereto and for said first power terminal of said second switching device to be bonded direct thereto;

said first external power terminal is configured for said first power terminal of said first switching device to be bonded thereto; and

said third external power terminal is configured for said second power terminal of said second switching device to be bonded thereto, all without the use of wire bonds.

9. The package recited in claim 1 wherein:

said substrate has first through fourth edges, said first and second edges being opposed and said third and fourth edges being opposed;

said first and third external terminals being disposed adjacent said first edge;

said second external terminal being disposed adjacent said second edge; and

said package further comprises first and second external control terminals, each bonded to said substrate and disposed adjacent said third and fourth edges thereof, respectively.

10. A packaged half bridge circuit comprising:

an electrically insulating substrate having first, second and third external power terminals and first and second external control terminals each bonded to said substrate;

said first and third external power terminals being disposed in opposed relation to said second external power terminal;

first and second switching devices;

said first switching device being a semiconductor device having a control terminal and first and second power terminals, said first power terminal of said first device being bonded to said first external power terminal, said second power terminal of said first device being connected to said second external power terminal and said control terminal of said first device being connected to said first external control terminal;

said second switching device being a semiconductor device having a control terminal and first and second power terminals, said first power terminal of said second device being bonded to said second external power terminal, said second power terminal of said second device being connected to said third external power terminal and said control terminal of said second device being connected to said second external control terminal.

11. The packaged half bridge circuit recited in claim 10 wherein:

said first, second and third external power terminals each extend beyond an edge of said substrate.

12. The packaged half bridge rectifier recited in claim 10 wherein:

said first and third external power terminals are the supply terminals for said half bridge circuit; and

said second external power terminal is the output terminal for said half bridge circuit.

13. The packaged half bridge circuit recited in claim 10 wherein:

said second device is rotated 180 degrees with respect to said first device.

14. The packaged half bridge circuit recited in claim 10 wherein:

said substrate has first through fourth edges, said first and second edges being oppose and said third and fourth edges being opposed.

15. The packaged half bridge circuit recited in claim 14 wherein:

said first and third external power terminals are disposed adjacent said first edge of said substrate;

said second external power terminal is disposed adjacent said second edge of said substrate;

said first and second external control terminals are disposed adjacent said third and fourth edges of said substrate, respectively; and

said first external power terminal is disposed between said third external power terminal and said third edge of said substrate.

16. The packaged half bridge circuit recited in claim 15 wherein:

each of said first and second external control terminals comprises a pair of Kelvin terminals.

17. The packaged half bridge circuit recited in claim 10 wherein:

the connection between said second power terminal of said first power device and said second external power terminal comprises either a plurality of wire bonds or a relatively wide, flat strap; and

the connection between said second power terminal of said second power device and said third external power terminal comprises either a plurality of wire bonds or a relatively wide, flat strap.

18. The packaged half bridge circuit recited in claim 10 wherein:

said second power terminal of said first device is bonded to said second external power terminal;

said control terminal of said first device is bonded to said first external control terminal;

said second power terminal of said second device is bonded to said third external power terminal; and

said control terminal of said second device is bonded to said second external control terminal.

19. A half bridge circuit for converting dc power to ac power comprising:

an electrically insulating substrate having first, second and third external power terminals and first and second external control terminals each bonded to said substrate;

said first and third external power terminals being disposed in opposed relation to said second external power terminal;

said first and second external control terminals being disposed in opposed relation;

first and second switching devices;

said first switching device being a semiconductor device having a control terminal and first and second power terminals, said first power terminal of said first device being bonded to said first external power terminal, said second power terminal of said first device being connected to said second external power terminal and said control terminal of said first device being connected to said first external control terminal;

said second switching device being a semiconductor device having a control terminal and first and second power terminals, said first power terminal of said second device being bonded to said second external power terminal, said second power terminal of said second device being connected to said third external power terminal and said control terminal of said second device being connected to said second external control terminal;

a dc voltage connected across said first and third external power terminals of said package; and

a load connected between said second external power terminal and a reference potential.

20. The packaged half bridge circuit recited in claim 19 wherein:

said second power terminal of said first device is bonded to said second external power terminal;

said control terminal of said first device is bonded to said first external control terminal;

said second power terminal of said second device is bonded to said third external power terminal; and

said control terminal of said second device is bonded to said second external control terminal.

21. A half bridge circuit for converting, dc power to ac power comprising:

an electrically insulating substrate having first, second and third external power terminals and first and second external control terminals each bonded to said substrate;

said first and third external power terminals being disposed in opposed relation to said second external power terminal;

said first and second external control terminals being disposed in opposed relation;

first and second switching devices;

said first switching device being a semiconductor device having a control terminal and first and second power terminals, said first power terminal of said first device being bonded to said first external power terminal, said second power terminal of said first device being connected to said second external power terminal and said control terminal of said first device being connected to said first external control terminal;

said second switching device being a semiconductor device having a control terminal and first and second power terminals, said first power terminal of said second device being bonded to said second external power terminal, said second power terminal of said second device being connected to said third external power terminal and said control terminal of said second device being connected to said second external control terminal;

a dc voltage connected across said first and third external power terminals of said package; and

a load connected between said second external power terminal and a reference potential.

22. The packaged half bridge circuit recited in claim 21 wherein:

said circuit further comprises a power transformer having a center-tapped output winding;

said first and third external power terminals of said package are connected to the ends of said center-tapped output winding; and

said load is connected between said second external power terminal and the center tap of said output winding.

23. The packaged half bridge circuit recited in claim 21 wherein:

said second power terminal of said first device is bonded to said second external power terminal;

said control terminal of said first device is bonded to said first external control terminal;

said second power terminal of said second device is bonded to said third external power terminal; and

said control terminal of said second device is bonded to said second external control terminal.