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Spoked susceptor support for enhanced thermal uniformity of susceptor in semiconductor wafer processing apparatus

  • US 5,044,943 A
  • Filed: 08/16/1990
  • Issued: 09/03/1991
  • Est. Priority Date: 08/16/1990
  • Status: Expired due to Term
First Claim
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1. In an apparatus for processing semiconductor wafers for the construction of integrated circuit structures thereon, wherein a semiconductor wafer is supported on the upper surface of a susceptor, heated by heating means in said apparatus the improvement comprising:

  • support means for peripherally supporting said susceptor in said apparatus to provide thermal uniformity across said susceptor resulting in more even heating of a semiconductor wafer placed thereon, said support means comprising;

    (a) a central hub spaced from the center of said susceptor and positioned in said apparatus coaxial to said susceptor; and

    (b) a series of spokes radiating from said central hub and positioned between said susceptor and said heating means to engage an undersurface of said susceptor at positions adjacent the perimeter of said susceptor.

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