Programmable connector module

• US 5,044,964 A
• Filed: 07/30/1990
• Issued: 09/03/1991
• Est. Priority Date: 07/30/1990
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Barnard, Larry R., Minerd, Timothy M., Schroll, Ross E., Lavery, Lawrence P.
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US07/559,241
• Time in Patent Office: 400 Days
• Field of Search: 439/68-73, 439/43, 439/49, 439/52, 439/189, 439/516, 439/67, 439/77, 439/492, 439/493, 439/498, 439/535, 439/925, 439/67
• US Class Current: 439/67
• CPC Class Codes: H01R 12/675 with contacts having at least a slotted plate for penetration of cable insulation, e.g. insulation displacement contacts for round conductor flat cables
• CPC Class Codes: H01R 12/78 connecting to other flexible printed circuits, flat or ribbon cables or like structures
• CPC Class Codes: H01R 29/00 Coupling parts for selective co-operation with a counterpart in different ways to establish different circuits, e.g. for voltage selection, for series-parallel selection, programmable connectors
• CPC Class Codes: Y10S 439/925 Floor mounted, e.g. under carpet

Abstract

A programmable connector module is equipped with a molded plastic base on which an IC chip is mounted. The plastic base is wired with programmable inputs which can be used to provide a logic 1 or a logic 0 to each input of the IC chip. Tabs or punch holes located on the plastic base can be broken to disconnect an input circuit from ground to allow a logic 1 to be programmed. Two inputs are used to program the configuration of the module and four inputs are used to program the address of the module. The programmable module can be positioned anywhere along a multiplex wire bus and is equipped with connectors for transmitting and receiving data to and from electrical loads along the bus.

Claims

1. A programmable connector module for transmitting data between a multi-wire bus and a plurality of loads comprising:

a molded plastic base having first and second oppositely facing surfaces, said second surface having contacts attachable to an IC chip thereon, said plastic base including a thinned-out section wherein a distance between said first and second surfaces is reduced so as to be frangible, said thinned-out section forming an indentation on said first surface;

first connecting means, located on one of said first and second surfaces, for electrically connecting to a plurality of wires in a multi-wire bus;

second connecting means, located on the opposite one of said first and second surfaces from said first connecting means, for electrically connecting to at least one electrical load;

the one of said first and second connecting means which is located on said first surface including electrical connections which extend through said plastic base from said first surface to said second surface;

input/output circuitry located on said second surface and attaching said first and second connecting means to said contacts, said input/output circuitry including a plurality of conductive portions which extend over said thinned-out sections and which also connect to some of said contacts, wherein said conductive portions can be selectively broken so as to program an IC chip mounted on said contacts.

2. The module of claim 1, wherein said thinned-out section is a plurality of cylindrical recesses formed in said first surface and extending toward said second surface, each of said conductive portions being located on said second surface over a corresponding one of said cylindrical recesses.

3. The module of claim 1, wherein said plastic base includes a plurality of tabs which extend outwardly therefrom, each of said conductive portions being located on a corresponding one of said tabs, with said thinned-out section being located between each of said tabs and said plastic base, wherein said tabs are breakable away from said plastic base to program the IC chip.

4. The module of claim 1, wherein said input/output circuitry is conductive traces unitarily formed with said plastic base.

5. The module of claim 1, further comprising:

a cover, lockingly engageable with said plastic base, for pressing and engaging the wires of the bus with said first connecting means.

6. The module of claim 5, wherein an edge of said cover is unitarily attached to said plastic base by a living hinge, an opposite edge of said cover including a latch engageable with said plastic base for locking said cover thereto.

7. The module of claim 5, wherein said cover includes a plurality of spring member son an engaging surface thereof which engages the bus, said spring members corresponding in number to said plurality of bus wires and arranged on said engaging surface to individually engage a corresponding one of the bus wires for pressing the bus wires against said first connecting means.

8. The module of claim 7, wherein said first connecting means is a plurality of insulation displacement connectors.

9. The module of claim 5, further comprising:

a second cover for pressing and engaging wires of load connectors with said second connecting means.

10. The module of claim 9, wherein said second cover includes a plurality of spring members located on an engaging surface thereof which engages the load connectors, said spring members corresponding in number to a number of wires contained in the load connectors, and arranged on said engaging surface to individually engage a corresponding one of the load connector wires for pressing the load connector wires against said second connecting means.

11. The module of claim 1, wherein said electrical connectors which extend through said plastic base are stackable linear pins secured in apertures in said plastic base by conductive epoxy.

12. A programmable connector module for transmitting data between a multi-wire bus and a plurality of loads comprising:

a molded plastic base having first and second oppositely facing surfaces, said second surface having contacts attachable to an IC chip thereon;

first connecting means located on one of said first and second surfaces, for electrically connecting to a plurality of wires in a multi-wire bus;

second connecting means, located on the opposite one of said first and second surfaces from said first connecting means, for electrically connecting to a plurality of electrical loads;

the one of said first and second connecting means which is located on said first surface including electrical connections which extend through said plastic base from said first surface to said second surface;

input/output circuitry located on said second surface and attaching said first and second connecting means to said contacts, said input/output circuitry including a plurality of conductive portions which also connect to some of said contacts, said conductive portions being selectively severable to program an IC chip mounted on said contacts, said input/output circuitry being conductive traces unitarily formed with said plastic base.

13. The module of claim 12, further comprising:

a cover, lockingly engageable with said plastic base, for pressing and engaging the wires of the bus with said first connecting means.

14. The module of claim 13, wherein an edge of said cover is unitarily attached to said plastic base by a living hinge, an opposite edge of said cover including a latch engageable with said plastic bore for locking said cover thereto.