Three-dimensional microwave circuit carrier and integral waveguide coupler

• US 5,045,820 A
• Filed: 12/10/1990
• Issued: 09/03/1991
• Est. Priority Date: 09/27/1989
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Munier, Scott D., Oehlerking, Michele G., Mitzlaff, James E., Mathews, Douglas J., Malone, Hugh R., Scott, Vernon R., Leicht, John L.
• Primary Examiner(s): GENSLER, PAUL L
• Application Number:
  US07/624,946
• Time in Patent Office: 267 Days
• Field of Search: 333/33-35, 333/238, 333/246, 333/247, 333/26
• US Class Current: 333/26
• CPC Class Codes: H01L 2223/6633 Transition between different waveguide types
• CPC Class Codes: H01L 2223/6683 for monolithic microwave integrated circuit [MMIC]
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/119 Details of rigid insulating substrates therefor, e.g. three-dimensional details H05K1/117 takes precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 3/42 Plated through-holes or plated via connections

Abstract

A non-hermetic, three-dimensional, microwave semiconductor device carrier with integral waveguide couplers is disclosed. A molded plastic substrate having a suitable dielectric constant and varying thicknesses comprises plated conductors and locations for receiving GaAs MMIC'"'"'s. MMIC'"'"'s are mounted to a metal backplate and die bonded to the plated conductors. The waveguide couplers are integrally molded as part of the carrier substrate, and comprise plated through cylindrical members. Signals from a waveguide cavity are coupled to the MMIC'"'"'s by inserting the waveguide couplers into a waveguide port. The carrier and integral waveguide coupler together with a plated molded cover forms a non-hermetic package providing pseudo-shielding cavities about the resident multiple semiconductor GaAs die. Transmission line impedance control is enhanced varying the substrate thickness on a per conductor basis. Frequency of operation exceeds 12 gigahertz.

Claims

1. A microwave circuit carrier, comprising:

(a) substrate means located in a first plane for receiving at least one electronic device which processes microwave signals; and

(b) waveguide coupler means integrally molded with the substrate means for coupling microwave signals between the at least one electronic device and a waveguide, the waveguide having a wall located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane.

2. The microwave circuit carrier of claim 1 wherein the waveguide coupler means comprises:

(a) a projecting means for projecting into the waveguide; and

(b) a conductor, disposed on a surface of the substrate means, coupled to the projecting means.

3. The microwave circuit carrier of claim 2 wherein the projecting means comprises a plated through hole whereby microwave energy can be coupled between the at least one electronic device and the waveguide.

4. The microwave circuit carrier of claim 1 wherein the substrate means comprises dielectric composite material.

5. The microwave circuit carrier of claim 4 wherein the dielectric composite material comprises at least one of the following materials:

ceramics and polymers.

6. The microwave circuit carrier of claim 1 wherein the waveguide coupler means comprises impedance matching means for varying the impedance characteristic between the at least one electronic device and the waveguide.

7. The microwave circuit carrier of claim 6 wherein the waveguide coupler means comprises a dielectric composite material.

8. The microwave circuit carrier of claim 7 wherein the dielectric composite material comprises at least one of the following materials:

ceramics and polymers.

9. The microwave circuit carrier of claim 7 wherein the varied impedance characteristic is the thickness of the dielectric composite material.

10. The microwave circuit carrier of claim 2 wherein the substrate comprises another surface with a conductor disposed thereon arranged such that the two surface conductors are on substantially opposite surfaces of the substrate means thereby forming a transmission line.

11. A microwave circuit carrier, comprising:

(a) a backplate located in a first plane, the first plane further comprising a wall of a waveguide;

(b) a first substrate coupled to the backplate, the first substrate being located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane, comprising

(i) means for receiving at least one electronic device which processes microwave signals; and

(ii) waveguide coupler means integrally molded with the means for receiving for coupling microwave signals between the at least one electronic device and the waveguide; and

(c) a second substrate coupled to the first substrate such that a cavity is provided about the means for receiving.

12. The microwave circuit carrier of claim 11 wherein the waveguide coupler means comprises:

(a) a projecting means for projecting into the waveguide; and

(b) a conductor, disposed on a surface of the first substrate, coupled to the projecting means.

13. The microwave circuit carrier of claim 12 wherein the projecting means comprises a plated through hole whereby microwave energy can be coupled between the at least one electronic device and the waveguide.

14. The microwave circuit carrier of claim 11 wherein the first and second substrate comprise dielectric composite material.

15. The microwave circuit carrier of claim 14 wherein the dielectric composite material comprises at least one of the following materials:

ceramics and polymers.

16. The microwave circuit carrier of claim 11 wherein the waveguide coupler means comprises impedance matching means for varying the impedance characteristic between the at least one electronic device and the waveguide.

17. The microwave circuit carrier of claim 16 wherein the waveguide coupler means comprises a dielectric composite material.

18. The microwave circuit carrier of claim 17 wherein the dielectric composite material comprises at least one of the following materials:

ceramics and polymers.

19. The microwave circuit carrier of claim 17 wherein the varied impedance characteristic is the thickness of the dielectric composite material.

20. The microwave circuit carrier of claim 12 wherein the first substrate comprises another surface with a conductor disposed thereon arranged such that the two surface conductors are on substantially opposite surfaces of the first substrate thereby forming a transmission line.

21. The microwave circuit carrier of claim 11 wherein:

(a) the first substrate comprises a surface with a conductor disposed thereon; and

(b) the second substrate comprises a surface with a conductor disposed thereon whereby a substantial electromagnetic energy shielding cavity is provided about the means for receiving.

22. The microwave circuit module of claim 11 wherein the backplate is electrically conductive.

23. A microwave circuit module, comprising:

(a) a backplate located in a first plane, the first plane further comprising a wall of a waveguide;

(b) a first substrate coupled to the backplate, the first substrate being located in a second plane adjacent and substantially parallel to the first plane wherein one of the first and second planes is substantially disposed above the other plane, comprising

(i) means for receiving at least one electronic device which processes microwave signals; and

(ii) waveguide coupler means integrally molded with the means for receiving for coupling the microwave signals between the at least one electronic device and the waveguide;

(c) at least one electronic device coupled to the means for receiving; and

(d) a second substrate coupled to the first substrate such that a cavity is provided about the means for receiving.

24. The microwave circuit module of claim 23 wherein the waveguide coupler means comprises:

(a) a projecting means for projecting into the waveguide; and

(b) a conductor, disposed on a surface of the first substrate, coupled to the projecting means.

25. The microwave circuit module of claim 24 wherein the projecting means comprises a plated through hole whereby microwave energy can be coupled between the at least one electronic device and the waveguide.

26. The microwave circuit module of claim 23 wherein the first and second substrate comprise dielectric composite material.

27. The microwave circuit module of claim 26 wherein the dielectric composite material comprises at least one of the following materials:

ceramics and polymers.

28. The microwave circuit module of claim 23 wherein the waveguide coupler means comprises impedance matching means for varying the impedance characteristic between the at least one electronic device and the waveguide.

29. The microwave circuit module of claim 28 wherein the waveguide coupler means comprises a dielectric composite material.

30. The microwave circuit module of claim 29 wherein the dielectric composite material comprises at least one of the following materials:

ceramics and polymers.

31. The microwave circuit module of claim 29 wherein the varied impedance characteristic is the thickness of the dielectric composite material.

32. The microwave circuit module of claim 24 wherein the first substrate comprises another surface with a conductor disposed thereon arranged such that the two surface conductors are on substantially opposite surfaces of the first substrate thereby forming a transmission line.

33. The microwave circuit module of claim 23 wherein:

(a) the first substrate comprises a surface with a conductor disposed thereon; and

(b) the second substrate comprises a surface with a conductor disposed thereon whereby a substantial electromagnetic energy shielding cavity is provided about the means for receiving.

34. The microwave circuit module of claim 23 wherein the backplate is electrically conductive.

35. The microwave circuit module of claim 34 wherein the first substrate is coupled to the backplate by an attachment member which is electrically conductive.

36. The microwave circuit module of claim 23 wherein the backplate is thermally conductive.

37. The microwave circuit module of claim 36 wherein the first substrate is coupled to the backplate by an attachment member which is thermally conductive.

38. The microwave circuit module of claim 23 wherein the at least one electronic device is a semiconductor die.

39. The microwave circuit module of claim 38 wherein the semiconductor die is comprised of gallium arsenide.

40. The microwave circuit module of claim 38 wherein the semiconductor die operates at a frequency of at least 12 gigahertz.