Semiconductor device having a vertical power MOSFET fabricated in an isolated form on a semiconductor substrate
First Claim
1. A semiconductor device comprising:
- a semiconductor substrate having a high concentration layer of one conductivity type and a low concentration layer formed on said high concentration layer;
a first electrode formed on an upper surface of said low concentration layer;
a second electrode formed on a bottom surface of said high concentration layer;
a vertical MOSFET formed in said semiconductor substrate for switching a current flowing between said first electrode and said second electrode said vertical MOSFET having a source and a base, and said source and said base being electrically connected to said first electrode;
at least one circuit element formed in said low concentration layer within a first depth; and
a diffused region of the other conductivity type formed in said low concentration layer between said vertical MOSFET and said circuit element with a second depth deeper than said first depth, said diffused region being electrically connected to said first electrode.
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Abstract
A semiconductor device includes an N-type semiconductor substrate, an N-channel type vertical MOSFET formed in the semiconductor substrate, a source electrode connected to a source region of the vertical MOSFET formed in the upper surface of the semiconductor substrate, a drain electrode of the vertical MOSFET formed on the bottom surface of the semiconductor substrate, a CMOS circuit formed in the upper surface of the semiconductor substrate to control the operation of the vertical MOSFET and a P-type diffused region formed between the vertical MOSFET and the CMOS circuit. The drain electrode is to be connected to a first power line, the source electrode being to be connected to a load connected to a second power line.
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Citations
11 Claims
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1. A semiconductor device comprising:
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a semiconductor substrate having a high concentration layer of one conductivity type and a low concentration layer formed on said high concentration layer; a first electrode formed on an upper surface of said low concentration layer; a second electrode formed on a bottom surface of said high concentration layer; a vertical MOSFET formed in said semiconductor substrate for switching a current flowing between said first electrode and said second electrode said vertical MOSFET having a source and a base, and said source and said base being electrically connected to said first electrode; at least one circuit element formed in said low concentration layer within a first depth; and a diffused region of the other conductivity type formed in said low concentration layer between said vertical MOSFET and said circuit element with a second depth deeper than said first depth, said diffused region being electrically connected to said first electrode. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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a semiconductor substrate of one conductivity type having a front surface and a back surface, said semiconductor substrate having a high concentration portion with a bottom face forming said back surface and a low concentration portion formed on said high concentration portion with an upper face forming said front surface; a first electrode formed on said front surface of said semiconductor substrate to be connected to a first power line of a first power voltage through a load; a second electrode formed on said back surface of said semiconductor substrate to be connected to a second power line of a second power voltage; a vertical MOSFET formed in said semiconductor substrate for switching a current flowing between said first electrode and said second electrode, said vertical MOSFET having a source and a base, said source and said base being electrically connected to said first electrode;
a control circuit formed in said low concentration portion for controlling said vertical MOSFET; anda diffused region of the other conductivity type formed in said low concentration portion between said vertical MOSFET and said control circuit, said diffused region being disposed over said high concentration portion and having a depth deeper than that of said control circuit, and said diffused region being electrically connected to said first electrode. - View Dependent Claims (8, 9, 10, 11)
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Specification