Dual-Hall ferrous-article-proximity sensor

• US 5,045,920 A
• Filed: 06/28/1990
• Issued: 09/03/1991
• Est. Priority Date: 06/28/1990
• Status: Expired due to Term

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Demingware, Daniel P., Tu, Aung T., Vig, Ravi
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US07/545,168
• Time in Patent Office: 432 Days
• Field of Search: 357/27, 357/74, 307/309, 307/278
• US Class Current: 257/414
• CPC Class Codes: G01V 3/08 operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices with electromagnetic waves G01V3/12
• CPC Class Codes: H10N 52/101 Semiconductor Hall-effect devices

Abstract

A ferrous article proximity sensor package includes a dual Hall element IC chip mounted at the end of a magnet. The axis of the chip, defined as being orthogonal to the chip face and equidistant the two Hall elements, is coaxial with the outer wells of the package but spaced away from the axis of the magnet. That exact position is such that the resulting difference in magnetic field strength at the two Hall elements is just enough to compensate for all the other factors that lead to an unwanted offset voltage in the sensor output. This package is made of two mating parts, one containing the magnet being eccentric with respect to the chip axis and the other containing the chip just above one magnet pole end. To achieve the abovedescribed desired offset condition in manufacturing, the one package part is simply rotated with the magnet relative to and within the other package part until the desired condition is met, and the two parts fastened together in that position.

Claims

1. A proximity sensor assembly of a magnet and a dual Hall integrated-circuit chip comprising:

a) an integrated-circuit chip including two spaced apart Hall elements formed in one face of said chip, said chip having an axis orthogonal to said one face and equidistant from said two Hall elements, and a differential Hall voltage circuit means connected series opposing to the two outputs of said two Hall elements, respectively, for providing an output signal with one parameter that is a function of he differential voltage between said Hall element outputs;

b) a first housing having a cylindrical hole, said dual Hall chip fixedly mounted at one end of said hole with said chip axis coincident with the axis of said cylindrical hole;

c) a magnet;

d) a second housing having a cylindrical portion enclosing and holding said magnet with the north-south axis of said magnet parallel to but spaced away from the axis of said cylindrical housing;

said cylindrical portion of said second housing having been snugly fitted into and rotated in said hole of said first housing until the circuit means output signal parameter equals a predetermined target value,

said second housing being fixedly fastened to said first housing.

2. The proximity sensor assembly of claim 1 wherein a portion of the outer wall of said first housing si cylindrical with an axis that is coincident with the axis of said dual Hall chip.

3. The proximity sensor assembly of claim 1 wherein an exposed portion of the outer wall of said second housing is cylindrical with an axis that is coincident with the axis of said dual Hall chip.

4. The proximity sensor assembly of claim 1 additionally comprising a ferromagnetic pole piece mounted to a pole end of said magnet and located between said pole end and said chip, said pole piece having a variable magnetic reluctance from point to point therein to induce asymmetry about said magnet axis into the magnetic field at said pole end.

5. The proximity sensor assembly of claim 4 wherein said pole piece is a thin ferromagnetic wedge.