Electrically conductive article

• US 5,047,283 A
• Filed: 09/20/1989
• Issued: 09/10/1991
• Est. Priority Date: 09/20/1989
• Status: Expired due to Fees

• Current Assignee: PPG Industries Incorporated (Nouryon BV)
• Original Assignee: PPG Industries Incorporated (Nouryon BV)
• Inventors: Russell, James A., Sin, Kee V., Leatherman, Dennis D.
• Primary Examiner(s): Ryan, Patrick J.
• Application Number:
  US07/409,853
• Time in Patent Office: 720 Days
• Field of Search: 428/137, 428/209, 428/323, 428/331, 428/457, 428/688, 428/901, 264/104, 361/397
• US Class Current: 428/209
• CPC Class Codes: B32B 9/00 Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
• CPC Class Codes: H05K 1/03 Use of materials for the substrate
• CPC Class Codes: H05K 9/0092 comprising electro-conductive pigments, e.g. paint, ink, tampon printing
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24322 Composite web or sheet
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/259 Silicic material
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

Microporous material comprising (1) a matrix consisting essentially of thermoplastic organic polymer, (2) a large proportion of finely divided water-insoluble siliceous filler, and (3) interconnecting pores is coated with electrically conductive coating and/or printed with electrically conductive printing ink. The resulting products have many uses as electrically conductive articles, including electromagnetic interference shields and printed circuit boards. Three-dimensional printed circuit boards are disclosed.

Claims

1. An electrically conductive article comprising:

(a) at least one sheet of microporous material having generally opposing sides, said microporous material on a coating-free, printing ink-free, impregnant-free and pre-bonding basis comprising;

(1) a matrix consisting essentially of substantially water insoluble thermoplastic organic polymer,

(2) finely divided substantially water-insoluble filler particles, of which at least about 50 percent by weight are siliceous particles, said filler particles being distributed throughout said matrix and constituting from about 50 to about 90 percent by weight of said microporous material,

(3) a network of interconnecting pores communicating substantially throughout said microporous material, said pores constituting at least about 35 percent by volume of said microporous material; and

(b) electrically conductive coating or electrically conductive printing ink on at least a portion of at least one of said sides.

2. The electrically conductive article of claim 1 wherein electrically conductive coating or electrically conductive printing ink is on at least a portion of the other of said sides.

3. The electrically conductive article of claim 1 wherein said substantially water-insoluble thermoplastic organic polymer comprises essentially linear ultrahigh molecular weight polyolefin which is essentially linear ultrahigh molecular weight polyethylene having an intrinsic viscosity of at least about 18 deciliters/gram, essentially linear ultrahigh molecular weight polypropylene having an intrinsic viscosity of at least about 6 deciliters/gram, or a mixture thereof.

4. The electrically conductive article of claim 1 wherein said essentially linear ultrahigh molecular weight polyolefin is essentially linear ultrahigh molecular weight polyethylene having an intrinsic viscosity of at least about 18 deciliters/gram.

5. The electrically conductive article of claim 4 wherein said pores on a coating-free, printing ink-free, impregnant-free, and pre-bonding basis constitute at least about 60 percent by volume of said microporous material.

6. The electrically conductive article of claim 4 wherein said ultrahigh molecular weight polyethylene has an intrinsic viscosity in the range of from about 18 to about 39 deciliters/gram.

7. The electrically conductive article of claim 4 wherein said siliceous particles of said microporous material constitute from about 50 percent to about 85 percent by weight of said microporous material.

8. The electrically conductive article of claim 4 wherein said siliceous particles of said microporous material are silica.

9. The electrically conductive article of claim 4 wherein said siliceous particles of said microporous material are precipitated silica particles.

10. The electrically conductive article of claim 9 wherein said precipitated silica particles have an avera§

e ultimate particle size of less than about 0.1 micrometer.

11. The electrically conductive article of claim 4 wherein on a coating-free, printing ink-free, impregnant-free, and pre-bonding basis the volume average diameter of said pores as determined by mercury porosimetry is in the range of from about 0.02 to about 50 micrometers.

12. The electrically conductive article of claim 4 wherein on a coating-free, printing ink-free, impregnant-free, and pre-bonding basis the volume average diameter of said pores as determined by mercury porosimetry is in the range of from about 0.02 to about 0.5 micrometers.

13. The electrically conductive article of claim 4 wherein high density polyethylene is present in said matrix.

14. The electrically conductive article of claim 1 wherein said electrically conductive coating or said electrically conductive printing ink is on at least a portion of one of said sides and at least one of said sides is bonded to a substrate.

15. The electrically conductive article of claim 14 wherein said sides are substantially planar in form.

16. The electrically conductive article of claim 14 wherein said sides are three dimensional surfaces in form.

17. A printed circuit comprising:

(a) at least one sheet of microporous material having generally opposing sides, said microporous material on a coating-free, printing ink-free, impregnant-free, and pre-bonding basis comprising;

(1) a matrix consisting essentially of substantially water insoluble thermoplastic organic polymer,

(2) finely divided substantially water-insoluble filler particles, of which at least about 50 percent by weight are siliceous particles, said filler particles being distributed throughout said matrix and constituting from about 50 to about 90 percent by weight of said microporous material,

(3) a network of interconnecting pores communicating substantially throughout said microporous material, said pores constituting at least about 35 percent by volume of said microporous material; and

(b) electrically conductive printing ink on at least a portion of at least one of said sides.

18. The printed circuit of claim 17 wherein additional electrically conductive printing ink is on at least a portion of the other of said sides.

19. The printed circuit of claim 17 wherein said substantially water-insoluble thermoplastic organic polymer comprises essentially linear ultrahigh molecular weight polyolefin which is essentially linear ultrahigh molecular weight polyethylene having an intrinsic viscosity of at least about 18 deciliters/gram, essentially linear ultrahigh molecular weight polypropylene having an intrinsic viscosity of at least about 6 deciliters/gram, or a mixture thereof.

20. The printed circuit of claim 17 wherein said essentially linear ultrahigh molecular weight polyolefin is essentially linear ultrahigh molecular weight polyethylene having an intrinsic viscosity of at least about 18 deciliters/gram.

21. The printed circuit of claim 20 wherein said pores on a coating-free, printing ink-free, impregnant-free, and pre-bonding basis constitute at least about 60 percent by volume of said microporous material.

22. The printed circuit of claim 20 wherein said ultrahigh molecular weight polyethylene has an intrinsic viscosity in the range of from about 18 to about 39 deciliters/gram.

23. The printed circuit of claim 20 wherein said siliceous particles of said microporous material constitute from about 50 percent to about 85 percent by weight of said microporous material.

24. The printed circuit of claim 20 wherein said siliceous particles of said microporous material are silica.

25. The printed circuit of claim 20 wherein said siliceous particles of said microporous material are precipitated silica particles.

26. The printed circuit of claim 25 wherein said precipitated silica particles have an average ultimate particle size of less than about 0.1 micrometer.

27. The printed circuit of claim 20 wherein on a coating-free, printing ink-free, impregnant-free, and pre-bonding basis the volume average diameter of said pores as determined by mercury porosimetry is in the range of from about 0.02 to about 50 micrometers.

28. The printed circuit of claim 20 wherein on a coating-free, printing ink-free, impregnant-free, and pre-bonding the volume average diameter of said pores as determined by mercury porosimetry is in the range of from about 0.02 to about 0.5 micrometers.

29. The printed circuit of claim 20 wherein high density polyethylene is present in said matrix.

30. The printed circuit of claim 20 which is flexible.

31. The printed circuit of claim 20 which is substantially rigid.

32. The printed circuit of claim 20 wherein said electrically conductive printing ink was applied to at least a portion of at least one of said sides by thick film screen printing.

33. The printed circuit of claim 20 wherein said electrically conductive printing ink is on at least a portion of one of said sides and at least one of said sides is bonded to a substrate.

34. The printed circuit of claim 33 wherein said other of said sides is fusion bonded to said substrate.

35. The printed circuit of claim 34 wherein said substrate comprises organic polymer in contact with said microporous material.

36. The printed circuit of claim 20 which is a substantially planar printed circuit board.

37. The printed circuit of claim 20 which is a three-dimensional printed circuit board.

38. A method for producing a three-dimensional printed circuit board comprising:

(a) printing electrically conductive printing ink upon at least one side of a sheet of microporous material having generally opposing sides, said microporous material on a coating-free, printing ink-free, impregnant-free, and pre-bonding basis comprising;

(1) a matrix consisting essentially of substantially water insoluble thermoplastic organic polymer,

(2) finely divided substantially water-insoluble filler particles, of which at least about 50 percent by weight are siliceous particles, said filler particles being distributed throughout said matrix and constituting from about 50 to about 90 percent by weight of said microporous material,

(3) a network of interconnecting pores communicating substantially throughout said microporous material, said pores constituting at least about 35 percent by volume of said microporous material;

(b) molding the printed microporous material with organic polymer to bond said printed microporous material to said organic polymer and to form said three-dimensional printed circuit board.

39. The method of claim 38 wherein said substantially water-insoluble thermoplastic organic polymer comprises essentially linear ultrahigh molecular weight polyolefin which is essentially linear ultrahigh molecular weight polyethylene having an intrinsic viscosity of at least about 18 deciliters/gram, essentially linear ultrahigh molecular weight polypropylene having an intrinsic viscosity of at least about 6 deciliters/gram, or a mixture thereof.

40. The method of claim 38 wherein said essentially linear ultrahigh molecular weight polyolefin is essentially linear ultrahigh molecular weight polyethylene having an intrinsic viscosity of at least about 18 deciliters/gram.

41. The method of claim 40 wherein said siliceous particles of said microporous material are precipitated silica particles.

42. The method of claim 40 wherein high density polyethylene is present in said matrix.