Wafer-level burn-in testing of integrated circuits
First Claim
1. A wafer containing an array of integrated circuit dice,wherein the dice are separated by scribe lanes in which the wafer may be cut to dice the wafer into individual die;
- andwherein individual integrated circuits of the array include contact pads that extend from only said individual integrated circuit into the scribe lanes for use during burn-in testing of the integrated circuits while they are contained in the wafer.
3 Assignments
0 Petitions
Accused Products
Abstract
A wafer containing an array of integrated circuit dice, wherein the dice are separated by scribe lanes in which the wafer may be cut to dice the wafer into individual die, is so constructed as to enable burn-in testing of the integrated circuits while they are still in the wafer. In this wafer, individual integrated circuits of the array include contact pads that extend into the scribe lanes for use during burn-in testing of the integrated circuits while they are contained in the wafer. A system for testing such a wafer includes a testing station for applying and monitoring burn-in test signals for individual integrated circuits; and contact probes for coupling the testing station to the contact pads for a plurality of the individual integrated circuits to enable separate burn-in tests to be conducted simultaneously for a plurality of the individual integrated circuits while they are contained in the wafer. Control means are coupled to the testing means for discontinuing the application of burn-in test signals to a given individual integrated circuit when the monitored test signals for the given integrated circuit indicate that the given integrated circuit has failed the burn-in test.
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Citations
9 Claims
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1. A wafer containing an array of integrated circuit dice,
wherein the dice are separated by scribe lanes in which the wafer may be cut to dice the wafer into individual die; - and
wherein individual integrated circuits of the array include contact pads that extend from only said individual integrated circuit into the scribe lanes for use during burn-in testing of the integrated circuits while they are contained in the wafer. - View Dependent Claims (2)
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3. A system for testing a wafer containing an array of integrated circuit dice, wherein the dice are separated by scribe lanes in which the wafer may be cut to dice the wafer into individual die, and wherein individual integrated circuits of the array include contact pads that extend from only said individual integrated circuit into the scribe lanes for use during burn-in testing of the integrated circuits while they are contained in the wafer, the system comprising
testing means for simultaneously applying and separately monitoring burn-in test signals for individual integrated circuits; - and
contact means for coupling said testing means to said contact pads for a plurality of said individual integrated circuits to enable separate burn-in tests to be conducted simultaneously for a plurality of said individual integrated circuits while they are contained in the wafer. - View Dependent Claims (4, 5, 6, 7)
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8. A method of testing a wafer containing an array of integrated circuit dice, wherein the dice are separated by scribe lanes in which the wafer may be cut to dice the wafer into individual die, and wherein individual integrated circuits of the array include contact pads that extend from only said individual integrated circuit into the scribe lanes for use during burn-in testing of the integrated circuits while they are contained in the wafer, the method comprising the steps of
(a) coupling testing means for applying and monitoring burn-in test signals for individual integrated circuits to said contact pads for a plurality of said individual integrated circuits to enable separate burn-in tests to be conducted simultaneously for said plurality of individual integrated circuits while they are contained in the wafer; -
(b) simultaneously applying burn-in test signals to the coupled plurality of individual integrated circuits while they are contained in the wafer; and (c) separately monitoring burn-in test signals for the coupled individual integrated circuits while they are contained in the wafer. - View Dependent Claims (9)
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Specification