Process for making continuous films of ordered poly(ether ketone ketones)

• US 5,049,340 A
• Filed: 12/18/1989
• Issued: 09/17/1991
• Est. Priority Date: 12/18/1989
• Status: Expired due to Term

• Current Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Ostapchenko, George J., Moss, Arthur Z.
• Primary Examiner(s): Tentoni, Leo B.
• Application Number:
  US07/452,143
• Time in Patent Office: 638 Days
• Field of Search: 264/216, 264/237, 264/331.12, 264/331.21, 264/331.11, 528/176, 528/194, 528/206, 528/271
• US Class Current: 264/216
• CPC Class Codes: B29C 48/022 characterised by the choice of material
• CPC Class Codes: B29C 48/08 flexible, e.g. films
• CPC Class Codes: B29D 7/01 Films or sheets
• CPC Class Codes: B29K 2071/00 Use of polyethers , e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
• CPC Class Codes: C08J 2365/00 Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain C08J2307/00 - C08J2357/00, C08J2361/00 take precedence; Derivatives of such polymers
• CPC Class Codes: C08J 5/18 Manufacture of films or sheets

Abstract

A process for extruding a smooth and uniform film or sheet of an ordered poly(ether ketone ketone) having a thickness of about 2.5 to 250 micrometers, wherein the molten extrudate is quenched on a drum maintained at a temperature of about 100°-170° C.

Claims

1. A continuous process for casting a high quality amorphous structure selected from the group consisting of films and sheets (film or sheet) having a thickness of about 2.5 to 250 micrometers from an ordered poly(ether ketone ketone) resin consisting essentially of two repeating units (a) and (b) represented by the following formulas ##STR3## and ##STR4## where A is the p,p'"'"' -Ph-O-Ph- group, and Ph stands for the phenylene radical;

B is p-phenylene; and

D is m-phenylene;

where the (a) and (b) units occur at a ratio in the range of 80;

20 to 25;

75;

said resin having an inherent viscosity at 30°

C., determined for a 0.5 g/100 ml solution in concentrated sulfuric acid, or about 0.6-1.2;

said process comprising the consecutive stages of melt-extruding the resin at a temperature of at most 400°

C. through a die having lips through which the extended structure exits the die at a die pressure of at least 1.4 MPa, directing the molten extrudate onto the cylindrical surface of a rotating quench drum maintained at a temperature between 100°

C. and 170°

C. so that the resin layer forms a thin layer thereon, maintaining the molten resin layer in contact with the surface of the quench drum until the resin solidifies into the structure (a film or sheet), and removing the structure (film or sheet) from the quench drum.

2. A process of claim 1 wherein the die lip opening is about 100-500 micrometers.

3. A process of claim 2 wherein the lip opening of the die is at most 250 micrometers (or less), and the thickness of the structure (film or sheet) produced thereby is at most 125 micrometers (or less).

4. A process of claim 1 wherein the resin has an inherent viscosity of about 0.7-1.1.

5. A process of claim 4 wherein the resin has an inherent viscosity of about 0.8-1.

6. A process of claim 1 wherein the temperature of the melt in the extruder is at most 390°

C.

7. A process of claim 6 wherein the temperature of the melt in the extruder is at most 380°

C.

8. A process of claim 7 wherein the poly(ether ketone ketone) resin has diphenyl ether groups, terephthalyl groups, and isophthalyl groups, and where the ratio of terephthalyl to isophthalyl isomer is about 70:

30.

9. A process of claim 8 wherein the temperature of the melt in the extruder is about 340°

-360°

C.

10. A process of claim 9 wherein the temperature of the melt in the extruder is about 350°

-360°

C.

11. A process of claim 7 wherein the poly(ether ketone ketone) resin has diphenyl ether groups, terephthalyl groups, and isophthalyl groups, and where the ratio of terephthalyl to isophthalyl isomer is about 60:

40.

12. A process of claim 11 wherein the temperature of the melt in the extruder is about 310°

-370°

C.

13. A process of claim 12 wherein the temperature of the melt in the extruder is 330°

-360°

C.

14. A process of claim 1 wherein the extruder die pressure is at least 2.8 MPa.

15. A process of claim 14 wherein the extruder die pressure is at least 4.2 MPa.

16. A process of claim 1 wherein the quench drum temperature is aoout 110°

-160°

C.

17. A process of claim 3 wherein the poly(ether ketone ketone) resin has diphenyl ether groups, terephthalyl groups, and isophthalyl groups, and where the ratio of terephthalyl to isophthalyl isomer is about 70:

30.

18. A process of claim 3 wherein the poly(ether ketone ketone) resin has diphenyl ether groups, terephthalyl groups, and isophthalyl groups, and where the ratio of terephthalyl to isophthalyl isomer is about 60:

40.

19. A process of claim 2 wherein the quench drum temperature is about 110°

-160°

C.