Testing of integrated circuit devices on loaded printed circuit boards

• US 5,049,813 A
• Filed: 10/25/1989
• Issued: 09/17/1991
• Est. Priority Date: 04/17/1987
• Status: Expired due to Term

• Current Assignee: Delaware Capital Formation Incorporated (Dover Corporation)
• Original Assignee: Everett/Charles Contact Products, Inc.
• Inventors: Johnston, Charles J., Swart, Mark A., Van Loan, David R.
• Primary Examiner(s): Wieder, Kenneth A.
• Assistant Examiner(s): Nguyen, Vinh P.
• Application Number:
  US07/427,932
• Time in Patent Office: 692 Days
• Field of Search: 324/158 F, 324/158 P, 324/72.5, 439/68, 439/55, 439/69, 439/70, 439/71, 439/820, 439/821, 439/822, 439/824, 439/65, 439/64
• US Class Current: 324/754.14
• CPC Class Codes: G01R 1/0425 Test clips, e.g. for IC's
• CPC Class Codes: G01R 31/316 Testing of analog circuits G01R31/2851 takes precedence

Abstract

Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.

Claims

1. A translator module for making contact with first and second rows of spaced apart leads on an integrated circuit package mounted among other electrical circuit elements on a loaded printed circuit board, to facilitate circuit verification by a test unit having an array of test probes for use in contacting test points on the board, the translator module comprising:

a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the integrated circuit package;

first and second rows of spaced apart electrical contacts arranged on a lower side of the module housing for releasable contact with corresponding leads adjacent the integrated circuit package when the module is mounted over the package;

a plurality of electrically conductive test pads disposed in a substantially common plane on the top side of the module housing and arranged for contact with individual test probes of said test unit, wherein the test pads are each generally planar and have a two-dimensional extent, substantially in said common plane on the top side of the housing, each test pad having a size greater than the size of the test probes adapted to contact the test pads; and

means for internally electrically connecting said first and second rows of contacts to corresponding test pads on the module so that contact between the individual leads adjacent the integrated circuit package and corresponding contacts on the module is translated electrically, via the test pads, to individual test probes in the test unit.

2. Apparatus according to claim 1 wherein each module contact has an end extending through the top side of the module housing;

and in which separate electrical conductors at the top side of the housing are electrically connected to the ends of the contacts, the conductors further being electrically connected to corresponding test pads.

3. Apparatus according to claim 2 wherein the top side of the housing comprises a printed wiring board having said electrical conductors and test pads.

4. Apparatus according to claim 2 wherein the test pads and conductors are a silk screen on the top side of the module.

5. Apparatus according to claim 1 wherein the module contacts each comprise a leaf spring contact supported from above on the module housing and arranged to be held under spring tension when the module is pushed down into contact with one of said leads adjacent the integrated circuit package.

6. Apparatus according to claim 1 wherein the module housing includes downwardly opening and outwardly opening spaced apart slots on opposite sides of the housing, and in which individual contacts are disposed in the slots for access from below and for being freely moved from contact with the leads.

7. Apparatus according to claim 1 in which the contacts are arranged for contact with corresponding leads comprising separate circuit traces on the circuit board adjacent corresponding leads on the integrated circuit package.

8. Apparatus according to claim 1 in which the in-line spacing between adjacent test pads in said common plane is greater than the in-line spacing between the electrical contacts in said rows of contacts.

9. Apparatus according to claim 1 in which the electrical contacts are spring contacts arranged to be biased away from the central region of the module for making a releasable spring contact with corresponding leads on the integrated circuit package.

10. Apparatus according to claim 1 in which the electrical contacts are arranged for spring biased contact with corresponding electrical leads spaced apart along an edge of the integrated circuit package, and in which the test pads on the top side of the housing have a mutual in-line spacing substantially greater than the in-line spacing between adjacent contacts in a row of contacts along the edge of the module housing.

11. Apparatus according to claim 10 in which test pads for a given row of contacts along an edge of the module housing are arranged in a two-dimensional array in said common plane on the top side of the housing.

12. Apparatus according to claim 1 in which the contacts on the module comprise rows of separate flexible spring-like fingers.

13. An integrated circuit continuity test verification system for making continuity tests of circuit elements on a loaded printed circuit board having a plurality of randomly spaced apart integrated circuit packages mounted on an upper surface of the circuit board, in which electrical leads on the integrated circuit packages are spaced apart in rows along oppositely facing side edges of the integrated circuit package, the test system comprising:

a translator module adapted for releasable contact with a corresponding integrated circuit package, the module comprising a rigid housing having a top side and upright side edges, first and second rows of spaced apart electrical contacts arranged along the side edges of the module housing for releasable engagement with corresponding leads adjacent the integrated circuit package when the module housing is releasably placed over the integrated circuit package, a plurality of electrically conductive test pads in a substantially common plane on the top side of the module housing, and means on the module electrically connecting the test pads to individual ones of said contacts;

a circuit verification test unit including an array of test probes arranged for contact with individual ones of the conductive test pads on the module housing for conducting test signals used in an electrical continuity test analyzer, wherein the test pads are each generally planar and have a two-dimensional extent, substantially in said common plane on the top side of the housing, the test pads having sizes greater than the sides of the test probes adapted to contact the test pads; and

means for drawing the test probes into contact with the test pads on the module so that contact between the individual contacts on the module and corresponding leads on the circuit package can be translated electrically, via the contacts on the module, to the individual test probes in the test unit.

14. The test system according to claim 13 in which the test pads on the module housing are arranged in an array on the top side of the housing.

15. The test system according to claim 14 in which the test pads in said array are spaced apart by a greater in-line spacing than the in-line spacing between adjacent individual contacts in the row of contacts on the module.

16. The test system according to claim 15 in which the contacts on the module comprise rows of separate flexible spring-like fingers.

17. The test system according to claim 16 in which the fingers comprise a metal film facing inwardly toward the central region of the module, and flexible plastic backing sheets for supporting each metal film contact.

18. The test system according to claim 13 in which the contacts on the module comprise lead spring type contacts held under spring tension against the leads.

19. The test system according to claim 13 in which the test probes are spring biased against the test pads.

20. The test system according to claim 13 in which the contacts on the module engage leads on the circuit board which make electrical contact to corresponding leads on the integrated circuit package.

21. A method for testing electrical continuity of circuit elements on a printed circuit board in which one or more of the circuit elements comprises an integrated circuit package having rows of oppositely facing spaced apart electrical leads at least some of which are electrically connected to separate conductive leads on the printed circuit board, the test method comprising:

placing a translator module over the integrated circuit package, the translator module comprising a rigid housing having a generally planar top surface and rows of oppositely facing electrical contacts extending along opposite side edges of the housing, the electrical contacts in each row being arranged for releasable engagement with respective electrical leads adjacent the integrated circuit package, the top surface of the module housing having an array of test pads electrically connected to corresponding electrical contacts on the module housing;

providing an array of test probes in a test fixture of the test system wherein said test probes are arranged for contact with individual test pads on the upper surface of the module, wherein the test pads on the module are each generally planar and have a two-dimensional extent, substantially in a common plane on said top surface of the housing, each test pad having a size greater than the size of the test probes adapted to contact the test pads; and

drawing the array of test probes and the test pads on the module into pressure contact to establish electrical continuity from the leads on the circuit package to a corresponding test probe, via the contacts on the module housing and their corresponding electrical connections to the test pads on the housing.

22. The method according to claim 21 in which, a plurality of said translator module housings are placed over a corresponding plurality of integrated circuit packages on the circuit board, and the test probes are drawn into contact with the translator modules to simultaneously test a plurality of said integrated circuit packages.

23. The method according to claim 21 including producing a spring biased releasable engagement between the contacts on the module housing and the leads adjacent the integrated circuit package.

24. The method according to claim 23 in which the module contacts engage electrical leads on the integrated circuit package.

25. The method according to claim 23 in which the module contacts engage electrical leads on the printed circuit board which are in electrical contact with corresponding leads on the integrated circuit package.

26. The method according to claim 21 in which the in-line spacing between the pads is greater than the in-line spacing between leads adjacent the integrated circuit package.

27. A translator module for testing electrical continuity for an integrated circuit package which includes an integrated circuit having spaced apart exterior electrical leads connected to corresponding circuits on a printed circuit board, to facilitate circuit verification by a test unit, the translator module comprising:

a rigid housing adapted for releasable mounting over the integrated circuit package;

first and second rows of spaced apart electrical contacts arranged on a lower side of the module housing for releasable contact with corresponding circuits on the printed circuit board adjacent respective leads of the integrated circuit package;

a plurality of generally planar electrically conductive test pads disposed in a substantially common plane on an upper portion of the housing for making electrical contact with individual test probes of said test unit, wherein the test pads are each generally planar and have a two-dimensional extent, substantially in said common plane on the housing, each test pad having a size greater than the size of the test probes adapted to contact the test pads; and

means for internally electrically connecting said first and second rows of contacts to corresponding test pads on the module housing so that contact between the individual circuits on the printed circuit board and corresponding contacts on the module is translated electrically via the test pads to individual test probes in the test unit.

28. Apparatus according to claim 27 in which the module contacts are spring biased for being held under spring tension against the circuits on the printed circuit board.

29. Apparatus according to claim 27 in which the in-line spacing between the test pads on the upper portion of the housing is greater than the in-line spacing between the leads on the integrated circuit package.

30. A method for testing electrical continuity of circuit elements on a printed circuit board in which one or more of the circuit elements comprises an integrated circuit package having rows of spaced apart exterior electrical leads, at least some of which are electrically connected to electrical circuits on the printed circuit board, the test method comprising:

releasably securing a translator module over the integrated circuit package, the translator module comprising a rigid housing having a top surface extending laterally and longitudinally over a two-dimensional surface area, with rows of electrical contacts extending along opposite side edges of the housing, the electrical contacts being adapted for connection with corresponding electrical circuits on the surface of the circuit board adjacent corresponding electrical leads on the integrated circuit package, the top surface of the module housing having an array of electrically conductive test pads spaced apart laterally and longitudinally across said top surface and disposed in a substantially common plane on the top surface of the housing and arranged for contact with individual test probes of a test unit, wherein the test pads are each generally planar and have a two-dimensional extent, substantially in said common plane, greater than the size of the test probes adapted to contact the test pads;

providing electrical contact between the test pads on the upper surface of the housing and the test probes;

the translator module housing being mounted over the integrated circuit package so that the contacts on the module housing are in pressure contact with the circuits on the circuit board to electrically translate test signals from the circuits on the board, through the test probes.

31. The method according to claim 30 in which the array of test pads are electrically connected internally to corresponding contacts on the module housing;

and including the steps of providing an array of test probes in a test unit fixture arranged for contact with individual test pads on the upper surface of the module; and

drawing the array of test probes and the test pads on the module into pressure contact to establish the electrical circuit continuity.

32. The method according to claim 31 in which the contact between the module contacts and the circuits on the board is spring biased, and the contact between the test probes and the test pads is spring biased.

33. The method according to claim 30 in which the module contacts comprise separate leaf springs for engaging the circuits on the board substantially vertically and for being held against them under spring tension.

34. A translator module for making contact with first and second rows of spaced apart leads on an integrated circuit package mounted among other electrical circuit elements on a loaded printed circuit board, to facilitate circuit verification of a test unit having an array of test probes for use in contacting test points on the board, the translator module comprising:

a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the integrated circuit package;

first and second rows of spaced apart electrical contacts arranged on a lower side of the module housing for releasable contact with corresponding leads adjacent the integrated circuit package when the module is mounted over the package;

a plurality of electrically conductive test pads disposed in a substantially common plane on the top side of the module housing and arranged for contact with individual test probes of said test unit, wherein each contact has an end extending through the top side of the module housing, and in which separate electrical conductors at the top side of the housing are electrically connected to the ends of the contacts, the conductors further being electrically connected to corresponding test pads on the top side of the module housing, and wherein the top side of the housing comprises a printed wiring board having said electrical conductors and test pads;

said first and second rows of module contacts being internally electrically connected to corresponding test pads on the module so that contact between the individual leads adjacent the integrated circuit package and the corresponding contacts on the module is translated electrically, via the test pads, to individual test probes in the test unit.

35. A translator module for making contact with first and second rows of spaced apart leads on an integrated circuit package mounted among other electrical circuit elements on a loaded printed circuit board, to facilitate circuit verification of a test unit having an array of test probes for use in contacting test points on the board, the translator module comprising:

a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the integrated circuit package;

first and second rows of spaced apart electrical contacts arranged on a lower side of the module housing for releasable contact with corresponding leads adjacent the integrated circuit package when the module is mounted over the package;

a plurality of electrically conductive test pads disposed in a substantially common plane on the top side of the module housing and arranged for contact with individual test probes of said test unit, wherein each contact has an end extending through the top side of the module housing, in which separate electrical conductors at the top side of the housing are electrically connected to the ends of the contacts, the conductors being electrically connected to corresponding test pads, and in which the electrical conductors and test pads are formed as a silk screen on the top side of the module housing; and

means for internally electrically connecting said first and second rows of contacts to corresponding test pads on the module so that contact between the individual leads adjacent the integrated circuit package and corresponding contacts on the module is translated electrically, via the test pads, to individual test probes in the test unit.

36. A translator module for making contact with first and second rows of spaced apart leads on an integrated circuit package mounted among other electrical circuit elements on a loaded printed circuit board, to facilitate circuit verification of a test unit having an array of test probes for use in contacting test points on the board, the translator module comprising:

a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the integrated circuit package;

first and second rows of spaced apart electrical contacts arranged on a lower side of the module housing for releasable contact with corresponding leads adjacent the integrated circuit package when the module is mounted over the package;

a plurality of electrically conductive test pads disposed in a substantially common plane on the top side of the module housing and arranged for contact with individual test probes of said test unit, in which the module contacts each comprise a leaf spring contact supported from above on the module housing and arranged to be held under spring tension when the module is pushed down into contact with one of said leads adjacent the integrated circuit package; and

means for internally electrically connecting said first and second rows of contacts to corresponding test pads on the module so that contact between the individual leads adjacent the integrated circuit package and corresponding contacts on the module is translated electrically, via the test pads, to individual test probes in the test unit.

37. A method for testing electrical continuity of circuit elements on a printed circuit board in which one or more of the circuit elements comprises an integrated circuit package having rows of spaced apart exterior electrical leads, at least some of which are electrically connected to electrical circuits on the printed circuit board, the test method comprising:

releasably securing a translator module over the integrated circuit package, the translator module comprising a rigid housing having a top surface with rows of electrical contacts extending along opposite side edges of the housing, the electrical contacts being adapted for connection with corresponding electrical circuits on the surface of the circuit board adjacent corresponding electrical leads on the integrated circuit package, the top surface of the module housing having electrically conductive test pads disposed in a substantially common plane on the top surface of the housing and arranged for contact with individual test probes of a test unit; and

producing electrical contact between the test pads on the upper surface of the housing and the test probes;

the translator module housing being mounted over the integrated circuit package so that the contacts on the module housing are in pressure contact with the circuits on the circuit board to electrically translate test signals from the circuits on the board, through the test probes,

in which the module contacts comprise separate leaf springs for engaging the circuits on the board substantially vertically and for being held against them under spring tension.

38. A translator module for making contact with first and second rows of spaced apart leads on an integrated circuit package mounted among other electrical circuit elements on a loaded printed circuit board, to facilitate circuit verification by a test unit having an array of test probes for use in contacting test points on the board, the translator module comprising:

a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the integrated circuit package, the top side of the housing having a fixed upper surface;

first and second rows of spaced apart spring-biased electrical contacts affixed to a lower side of the module housing, the contacts each being formed as individual spring members which are independently compliant and movable relative to the housing for releasable contact under spring tension independently with corresponding leads adjacent the integrated circuit package when the module is mounted over the package;

a plurality of electrically conductive test pads on the upper surface of the housing and disposed thereon in fixed positions with respect to each other and with respect to the contacts on the housing, the test pads lying in a substantially common plane on the fixed upper surface of the module housing and arranged thereon for pressure contact with individual test probes of said test unit; and

means for internally electrically connecting said first and second rows of module contacts to corresponding test pads on the housing so that contact between the individual leads adjacent the integrated circuit package and corresponding contacts on the housing is translated electrically, via the test pads, to individual test probes in the test unit.

39. Apparatus according to claim 38 in which each module contact has an end extending through the top side of the module housing, in which separate electrical conductors at the top side of the housing are electrically connected to ends of the contacts, the conductors further being electrically connected to corresponding test pads, and in which the top side of the housing comprises a printed wiring board having said electrical conductors and test pads.

40. Apparatus according to claim 38 in which the module contacts each comprise a leaf spring contact supported from above on the module housing and arranged to be held under spring tension when the module is pushed down into contact with one of said leads adjacent the integrated circuit package.

41. Apparatus according to claim 38 in which the test pads are each generally planar and have a two-dimensional extent, substantially in said common plane on the top side of the housing, each test pad having a size greater than the size of the test probes adapted to contact the test pads.

42. Apparatus according to claim 38 in which the in-line spacing between adjacent test pads in said common plane is greater than the in-line spacing between the electrical contacts in said rows of contacts.

43. A translator module for making contact with first and second rows of spaced apart leads on an integrated circuit package mounted among other electrical circuit elements on a loaded printed circuit board, to facilitate circuit verification of a test unit having an array of test probes for use in contacting test points on the board, the translator module comprising:

a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the integrated circuit package, the top side of the housing having a fixed upper surface extending across a surface area having a length and width;

first and second rows of spaced apart spring-biased electrical contacts affixed to a lower side of the module housing, the contacts each being formed as individual spring members which are independently compliant and movable relative to the housing for releasable contact under spring tension independently with corresponding leads adjacent the integrated circuit package when the module is mounted over the integrated circuit package;

a plurality of electrically conductive test pads on the fixed upper surface of the housing, the pads being disposed thereon in fixed positions with respect to each other in a two-dimensional array in which the test pads are spaced apart across the length and width of said fixed upper surface; and

means for internally electrically connecting the first and second rows of contacts to corresponding test pads so that contact between the individual leads adjacent the integrated circuit package and corresponding contacts on the housing is translated electrically, via contact between the test pads and corresponding individual test probes in the test unit.

44. Apparatus according to claim 43 in which the module contacts each comprise a leaf spring contact supported at a fixed position on the housing and extending away therefrom to provide spring tension when the contact engages one of the leads adjacent the integrated circuit package.

45. Apparatus according to claim 43 in which the test pads are each generally planar and have a two-dimensional extent in common plane defined by the fixed upper surface of the housing.