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Testing of integrated circuit devices on loaded printed circuit boards

  • US 5,049,813 A
  • Filed: 10/25/1989
  • Issued: 09/17/1991
  • Est. Priority Date: 04/17/1987
  • Status: Expired due to Term
First Claim
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1. A translator module for making contact with first and second rows of spaced apart leads on an integrated circuit package mounted among other electrical circuit elements on a loaded printed circuit board, to facilitate circuit verification by a test unit having an array of test probes for use in contacting test points on the board, the translator module comprising:

  • a rigid housing having top and bottom sides, the housing being adapted for releasable mounting over the integrated circuit package;

    first and second rows of spaced apart electrical contacts arranged on a lower side of the module housing for releasable contact with corresponding leads adjacent the integrated circuit package when the module is mounted over the package;

    a plurality of electrically conductive test pads disposed in a substantially common plane on the top side of the module housing and arranged for contact with individual test probes of said test unit, wherein the test pads are each generally planar and have a two-dimensional extent, substantially in said common plane on the top side of the housing, each test pad having a size greater than the size of the test probes adapted to contact the test pads; and

    means for internally electrically connecting said first and second rows of contacts to corresponding test pads on the module so that contact between the individual leads adjacent the integrated circuit package and corresponding contacts on the module is translated electrically, via the test pads, to individual test probes in the test unit.

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