Pressure sensor and method of manufacturing same

• US 5,050,034 A
• Filed: 08/21/1990
• Issued: 09/17/1991
• Est. Priority Date: 01/22/1990
• Status: Expired due to Term

• Current Assignee: Endress U Hauser GmbH U Company
• Original Assignee: Endress U Hauser GmbH U Company
• Inventors: Hegner, Frank, Frank, Manfred, Klahn, Thomas
• Primary Examiner(s): GRIFFIN, DONALD
• Application Number:
  US07/570,312
• Time in Patent Office: 392 Days
• Field of Search: 361/283, 73/718, 73/720, 228/121, 228/122, 29/25.42, 29/25.41
• US Class Current: 361/283.4
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

The substrate (12) and/or the diaphragm (11) of the pressure sensor (10) are made of ceramic, glass, or a single-crystal material. The side of the diaphragm (11) facing the substrate (12) is covered with a layer of silicon carbide, niobium, or tantalum which, in turn, is covered with a protective layer (21) and serves as one capacitor electrode (14). The side of the substrate (12) facing the diaphragm (11) is covered with at least one additional layer of any one of said materials which, in turn, is covered with an additional protective layer (22) and serves as the second capacitor electrode (15). Substrate (12) and diaphragm (11) are soldered together by a formed part of active solder (20) which also serves as a spacer.

This pressure sensor can be manufactured in a single soldering step. The maximum load capacity of the diaphragm is determined not by the strength of the joint, but only by the strength of the diaphragm material. The pressure sensor can be used at higher temperatures than pressure sensors with glass-frit joints.

Claims

1. Pressure sensor comprising a substrate and a diaphragm which are joined together, particularly in a defined spaced relationship and parallel to each other, forming a chamber sealed at least at the edge, wherein

the substrate and/or the diaphragm are made of ceramic, glass, or a single-crystal material,

the side of the diaphragm facing the substrate is covered with a layer of silicon carbide, niobium, or tantalum which, in turn, is covered with a protective layer and serves as one capacitor electrode,

the side of the substrate facing the diaphragm is covered within the chamber with at least one additional layer of any one of said materials which, in turn, is covered with an additional protective layer and serves as the second capacitor electrode, and

the substrate and the diaphragm are soldered together by a formed part of active solder which also serves as a spacer.

2. A pressure sensor as claimed in claim 1, wherein the diaphragm is completely covered with said one capacitor electrode.

3. A pressure sensor as claimed in claim 1 wherein the capacitor electrodes are formed from tantalum, and wherein the protective layers are formed from said capacitor electrodes by thermal or anodic oxidation.

4. A pressure sensor as claimed in claim 1 wherein electrical contact is made to the capacitor electrodes from the side of the substrate facing away from the diaphragm by means of active-solder insets extending to the second, capacitor electrode and the active solder, respectively, with each capacitor electrode of the substrate having at the contact point a capillary stopper in the form of a flare of the hole containing the active-solder inset.

5. Method of manufacturing a pressure sensor as claimed in claim 4, with the substrate having suitable holes, which are flared where necessary, comprising the steps of

depositing the capacitor electrodes on the diaphragm and the substrate,

forming the protective layers on the capacitor electrodes,

introducing the active-solder insets into the holes in the substrate,

heating the coated and loaded substrate, the coated diaphragm, and the interposed formed part of active solder, preferably in a vacuum, until the active solder has melted through, and

allowing this assembly to cool down.

6. A pressure sensor as claimed in claim 1 with a ductile active solder based on a silver-copper alloy preferably containing titanium as a reactive element.

7. A pressure sensor as claimed in claim 1 with a brittle active solder based on copper/zirconium, nickel/zirconium, or copper/titanium.