Automated method for the manufacture of transponder devices by winding around a bobbin
First Claim
1. An automated method for manufacturing a passive transponder device, comprising:
- providing a leadframe including a plurality of individual assembly sites each having a plurality of leads;
bonding an electronic identification device comprised of at least one integrated circuit chip to each said site;
electrically connecting each said identification device to said leads at each said site;
molding a cap around each said identification device and first portions of the leads at the site such that second portions of the leads protrude from said cap;
severing the second portions of said leads thereby disassociating each said cap from said leadframe;
attaching a bobbin to said second portion of said leads protruding from each said cap;
winding a conductive wire around each said bobbin; and
conductively connecting each wire to the corresponding leads.
4 Assignments
0 Petitions
Accused Products
Abstract
An improved automated method for the manufacture of alternatively sized passive transponder devices is presented which utilizes a single leadframe design and manufacturing process, including automated coil winding and wire-to-lead termination. A specially designed leadframe is prepared, with augmented leads, and is coated with a thin layer of silver. One or more semiconductor chips are bonded to individual assembly sites on the leadframe, after which the lead-die assembly is encapsulated by transfer molding. The cap and leads are singulated, and a bobbin is attached to the leads, which extend laterally from each individual molded cap. In an automated process, a conductive wire is attached to a first of the protruding leads, fly-wound around the bobbin core, and terminated by connection to a second of the protruding leads.
26 Citations
17 Claims
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1. An automated method for manufacturing a passive transponder device, comprising:
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providing a leadframe including a plurality of individual assembly sites each having a plurality of leads; bonding an electronic identification device comprised of at least one integrated circuit chip to each said site; electrically connecting each said identification device to said leads at each said site; molding a cap around each said identification device and first portions of the leads at the site such that second portions of the leads protrude from said cap; severing the second portions of said leads thereby disassociating each said cap from said leadframe; attaching a bobbin to said second portion of said leads protruding from each said cap; winding a conductive wire around each said bobbin; and conductively connecting each wire to the corresponding leads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An automated method for manufacturing passive transponder devices, comprising the steps of:
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preparing a leadframe including a plurality of individual assembly sites, each site having a plurality of leads fabricated such that said leads can be cut to different predetermined sizes; bonding an electronic identification device comprising at least one integrated circuit chip at each said site; electrically connecting each said identification device to said leadframe; molding a cap around each said identification device at each said site such that said leads extend laterally from each said cap; severing said leads thereby disassociating each said cap from said leadframe and forming a plurality of singulated electronic devices; affixing a bobbin to each said singulated device; attaching first ends to lengths of conductive winding wire to a first lead extending from each singulated device; winding each said length of wire around the corresponding bobbin; and attaching a second end of said lengths of wire to a second lead extending from each singulated device. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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Specification