Control valve utilizing mechanical beam buckling

• US 5,050,838 A
• Filed: 07/31/1990
• Issued: 09/24/1991
• Est. Priority Date: 07/31/1990
• Status: Expired due to Term

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Beatty, Christopher C., Beckmann, Jerome E.
• Primary Examiner(s): Fox, John C.
• Application Number:
  US07/560,933
• Time in Patent Office: 420 Days
• Field of Search: 251/11, 357/26, 357/28
• US Class Current: 251/11
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0005 Lift valves
• CPC Class Codes: F16K 99/0015 Diaphragm or membrane valves
• CPC Class Codes: F16K 99/004 using radiation
• CPC Class Codes: F16K 99/0044 using thermo-electric means

Abstract

A valve apparatus for controlling fluid flow comprising a substrate having a first aperture extending therethrough for defining a first fluid flow path; a beam having first and second terminal end portions mounted in fixed relationship with the substrate and having a bucklingly displaceable intermediate portion positioned in overlying relationship with the aperture for covering and uncovering the aperture for preventing or enabling fluid flow through the aperture; and a temperature control assembly for selectively controlling the temperature of the beam for selectively bucklingly displacing the intermediate portion of the beam for controlling fluid flow through the aperture.

Claims

1. A valve apparatus for controlling fluid flow comprising:

first substrate means having a first aperture extending therethrough for defining a first fluid flow path;

beam means having first and second terminal end portions mounted in fixed relationship with said substrate means and having a bucklingly displaceable intermediate portion positioned in overlying relationship with said aperture for covering and uncovering said aperture for preventing or enabling fluid flow through said aperture;

temperature control means for selectively controlling the temperature of said beam means for selectively bucklingly displacing said intermediate portion of said beam means for controlling fluid flow through said aperture;

said aperture extending between a first face surface and a second face surface of said substrate means;

said beam means first and second terminal end portions being attached to said first face surface of said substrate means;

said beam means comprising a first surface which is positioned remote from said substrate means and a second surface disposed generally parallel to said first surface and positioned proximate to said substrate means;

said beam means further comprising;

an inwardly buckled position wherein said intermediate portion is positioned in sealed covering relationship with said aperture and wherein said first surface of said beam means has a generally concave contour;

an outwardly buckled position wherein said intermediate portion is positioned in relatively widely spaced apart, uncovering relationship with said aperture and wherein said first surface of said beam means has a generally convex contour; and

a neutral position wherein said intermediate portion is positioned in relatively narrowly spaced apart, uncovering relationship with said aperture and wherein said first surface of said beam means has a relatively flat contour.

2. The invention of claim 1:

said temperature control means comprising heating means for selectively heating said beam means.

3. The invention of claim 2 said heating means composing an electrical circuit means for passing an electrical current through said beam means.

4. The invention of claim 2 said heating means comprising electrical circuit means for passing an electrical current through at least one resistor positioned adjacent to said beam means.

5. The invention of claim 1:

said valve apparatus being installed in a flow line having a relatively higher pressure upstream end and a relatively lower pressure downstream end with said first surface of said beam means positioned relatively upstream from said second surface thereof;

wherein fluid pressure in said flow line normally holds said beam means in said inwardly buckled position during a relatively low temperature state of said beam means; and

wherein said beam means is deflectable from said inwardly buckled position to said outwardly buckled position through application of heat to said beam means by said temperature control means.

6. The invention of claim 1 said first substrate means comprising a silicon substrate.

7. The invention of claim 1 wherein said beam means comprises an integrally formed portion of said first substrate means.

8. The invention of claim 1 wherein said beam means comprises a relatively large length-to-thickness ratio and wherein said temperature control means comprises modulated heating means for progressively, adjustably controlling the temperature of said beam means for progressively, adjustably controlling the flow rate of fluid through said aperture.

9. The invention of claim 8 wherein said length-to-thickness ratio is at least 100.

10. The invention of claim 1 wherein said beam means comprises a relatively small length-to-thickness ratio and wherein said temperature control means comprises pulsed heating means for rapidly changing the temperature of said beam means for rapidly, covering said aperture means or uncovering said aperture means by a preset amount for rapidly terminating or enabling flow of fluid through said flow line.

11. The invention of claim 10 wherein said length-to-thickness ratio is at most 30.

12. A method of controlling fluid flow comprising the steps of:

coating a substrate with at least one layer of coating material;

forming a beam from a portion of said coating layer, leaving opposite end portions of said beam integrally attached to said substrate;

forming an orifice extending through said substrate layer which is positioned below a midportion of said beam;

mounting said substrate with said integrally attached beam in a fluid flow line with fluid communication between upstream and downstream portions of the fluid flow line provided only by said orifice formed in said substrate; and

controlling the temperature of the beam so as to selectively deform the beam so as to selectively cover or uncover the orifice.

13. A method of making a control valve comprising the steps of:

coating a substrate with at least one layer of coating material;

forming a beam from a portion said coating layer, leaving opposite end portions of said beam integrally attached to said substrate;

forming an orifice extending through said substrate layer which is positioned below a midportion of said beam; and

providing an assembly for controllably heating the beam member.

14. A microvalve comprising:

a) a composite wafer comprising;

i) a substrate;

ii) at least one coating layer integrally bonded to said substrate;

b) said at least one coating layer being patterned to define a beam having end portions integrally bonded to said substrate and having a midportion which is deformably displaceable relative said substrate;

c) said substrate comprising an aperture extending therethrough positioned in alignment with said midportion of said beam;

d) said beam being selectively thermally deformable for covering and uncovering said aperture for terminating and initiating fluid flow through said aperture.