Micro-cable interconnect
First Claim
1. A method of forming a micro-cable interconnect comprising the steps of:
- (a) providing a continuous formation of conductors of precisely controlled spacing and tension to identically match spacing of interconnect zones operatively connected to an integrated circuit or connector to which said conductors are constructed and arranged for attachment;
(b) applying synthetic resin coating precursor to selected lengths of said formation of conductors and providing curing to said selected lengths to provide cured and uncured portions; and
(c) cutting said conductors at said uncured portions to form micro-cable interconnect adapted and arranged for connection to said connector or to said integrated circuit.
1 Assignment
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Accused Products
Abstract
A micro-cable interconnect comprises a single exterior flexible insulative coating internally containing a plurality of terminally prepared, precisely spaced conductors. The conductors are arranged with a spacing and pitch to identically match spacing and pitch of interconnect zones operatively connected to an integrated circuit or connector, with the conductors constructed and arranged for bonding to the interconnect zones. A method of forming a micro-cable interconnect comprises the steps of:
(a) providing a continuous formation of conductors of precisely controlled spacing and tension to identically match spacing of interconnect zones operatively connected to an integrated circuit or connector to which the conductors are constructed and arranged for attachment;
(b) applying coating precursor to selected lengths of the formation of conductors and providing curing to the selected lengths to provide cured and uncured portions; and
(c) cutting the conductors at the uncured portions to form micro-cable interconnect.
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Citations
10 Claims
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1. A method of forming a micro-cable interconnect comprising the steps of:
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(a) providing a continuous formation of conductors of precisely controlled spacing and tension to identically match spacing of interconnect zones operatively connected to an integrated circuit or connector to which said conductors are constructed and arranged for attachment; (b) applying synthetic resin coating precursor to selected lengths of said formation of conductors and providing curing to said selected lengths to provide cured and uncured portions; and (c) cutting said conductors at said uncured portions to form micro-cable interconnect adapted and arranged for connection to said connector or to said integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification