Micro-cable interconnect

• US 5,052,105 A
• Filed: 06/05/1990
• Issued: 10/01/1991
• Est. Priority Date: 06/05/1990
• Status: Expired due to Fees

• Current Assignee: Hutchinson Technology Incorporated (TDK Corporation)
• Original Assignee: Hutchinson Technology Incorporated (TDK Corporation)
• Inventors: Hokanson, John M., Mertens, Steven P., Devries, Wallace J., Mische, Hans A., Klima, Daniel J.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US07/533,131
• Time in Patent Office: 483 Days
• Field of Search: 29/857, 29/883, 427/117, 427/120, 427/54.1, 134/38, 118/325, 118/420, 118/641, 174/117 F, 156/55
• US Class Current: 29/883
• CPC Class Codes: A61B 1/00018 using electrical cables
• CPC Class Codes: H01R 43/28 for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/4922 with molding of insulation

Abstract

A micro-cable interconnect comprises a single exterior flexible insulative coating internally containing a plurality of terminally prepared, precisely spaced conductors. The conductors are arranged with a spacing and pitch to identically match spacing and pitch of interconnect zones operatively connected to an integrated circuit or connector, with the conductors constructed and arranged for bonding to the interconnect zones. A method of forming a micro-cable interconnect comprises the steps of:

(a) providing a continuous formation of conductors of precisely controlled spacing and tension to identically match spacing of interconnect zones operatively connected to an integrated circuit or connector to which the conductors are constructed and arranged for attachment;

(b) applying coating precursor to selected lengths of the formation of conductors and providing curing to the selected lengths to provide cured and uncured portions; and

(c) cutting the conductors at the uncured portions to form micro-cable interconnect.

Claims

1. A method of forming a micro-cable interconnect comprising the steps of:

(a) providing a continuous formation of conductors of precisely controlled spacing and tension to identically match spacing of interconnect zones operatively connected to an integrated circuit or connector to which said conductors are constructed and arranged for attachment;

(b) applying synthetic resin coating precursor to selected lengths of said formation of conductors and providing curing to said selected lengths to provide cured and uncured portions; and

(c) cutting said conductors at said uncured portions to form micro-cable interconnect adapted and arranged for connection to said connector or to said integrated circuit.

2. A method according to claim 1, wherein cured and uncured portions are formed in step (b) by applying UV curable coating precursor to said continuous formation of conductors, providing UV curing to selected areas of said coating precursor to provide cured and uncured coating portions, and removing uncured portions of coating

3. A method according to claim 1, additionally comprising pre-cleaning the conductor wires prior to step (a) to provide a uniform receptive surface for application of coating precursor.

4. A method according to claim 3, wherein pre-cleaning comprises passing the conductor wires through a first cleaning section for removal of organic contamination, followed by DI water rinse.

5. A method according to claim 2, wherein tension is provided by tension sensors for each conductor and spacing is provided by a fixed guide assembly to establish spacing for a mid-section of micro-cable interconnect and by a moving guide assembly to establish spacing for a fanned array at a terminal end of micro-cable interconnect.

6. A method according to claim 5, wherein the fixed guide assembly is made of shims with precise thickness dimensions, laminated together to form a laminate with varying thicknesses to establish precision slots within the laminate.

7. A method according to claim 5, wherein the moving guide is formed of a guide plate with slots at acute angles to each other to guide the conductors into a fanned array and guide pins to hold the conductors in a direction perpendicular to the fanned array.

8. A method according to claim 5, wherein the moving guide comprises means for moving each conductor linearly responsive to digital control.

9. A method according to claim 1, wherein in step (b) the coating precursor application is by an dispensing the coating precursor onto the conductor wire droplets and curing is b UV irradiation.

10. A method according to claim 1, additionally comprising providing inspection for conductor spacing, planarity, continuity, coating consistency and coating edge quality, and optionally, final coating curing, immediately prior to step (c).