Electro-optical multiple connection arrangement

• US 5,054,870 A
• Filed: 04/03/1990
• Issued: 10/08/1991
• Est. Priority Date: 04/03/1989
• Status: Expired due to Term

• Current Assignee: Alcatel SA (Nokia Corporation)
• Original Assignee: Alcatel NV (Nokia Corporation)
• Inventors: Florjancic, Matjaz, Losch, Kurt
• Primary Examiner(s): FONT, FRANK G
• Application Number:
  US07/504,550
• Time in Patent Office: 553 Days
• Field of Search: 350/96.20, 350/96.21, 350/96.22, 350/96.11, 357/49, 357/70, 357/75, 357/80, 174/52.4, 361/397, 361/398, 361/421, 250/227.24, 250/551
• US Class Current: 385/14
• CPC Class Codes: G02B 6/12 of the integrated circuit kind electric integrated circuits H01L27/00
• CPC Class Codes: G02B 6/3817 containing optical and electrical conductors cables including electrical and optical conductors H01B11/22; G02B6/3816 takes precedence
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto

Abstract

For the connection of an electro-optical chip (5) to a substrate (4), optical and electrical connecting elements (1, 8) are produced on a flexible interconnect member (2) and connected, using a film bonding process previously known only for purely electrical connections, both with connector elements of the chip and with connector paths or optical waveguides (3) on the substrate. If the optical connecting elements (1) are positioned physically between the electrical connecting elements (8), they are secured and located by the soldering connections produced on both sides of the electrical connecting elements. In addition to electrical test adapter connectors, optical test loops which link optical inputs and outputs with each other and which are removed during a later stamping process can also be provided on the flexible interconnect member (2).

Claims

1. Multiple connection arrangement for connecting a substrate to an integrated circuit comprising at least one optical component, the connection arrangement comprising:

a flexible interconnect member between the integrated circuit and the substrate, and

at least one optical waveguide extending across the flexible interconnect member and optically coupled to a corresponding said optical component.

2. A multiple connection arrangement as claimed in claim 1, further comprising

a plurality of electrically conductive traces also extending across the flexible interconnect member,

wherein said optical waveguide is positioned on and secured to the flexible interconnect member between two adjacent said electrical connecting traces.

3. A multiple connection arrangement as claimed in claim 1, wherein each said optical waveguide is secured to the flexible interconnect member.

4. A multiple connection arrangement as claimed in claim 1, wherein each said optical waveguide is formed on the flexible interconnect member using photolithographic techniques.

5. A multiple connection arrangement as claimed in claim 1, wherein the flexible interconnect member supports at least one optical functional element selected from the group consisting of splitters, directional couplers, and waveguide terminations.

6. Multiple connection arrangement as claimed in claim 5, wherein the flexible interconnect member is produced from a larger flexible circuit board supporting not only the electrical traces and said at least one optical functional element but also at least one temporary functional element selected from the group consisting of test-adapter connections and optical test loops which are adapted to be removed prior to the connection of the interconnection member to the substrate.

7. Multiple connection arrangement as claimed in claim 6, wherein said at least one temporary functional element is removed from said larger flexible circuit board by stamping.

8. Multiple connection arrangement as claimed in claim 6, wherein said at least one temporary functional element is removed from said larger flexible circuit board by etching.

9. Multiple connection arrangement as claimed in claim 3, wherein the optical waveguide is secured to the flexible interconnect by means of an adhesive.

10. Multiple connection arrangement as claimed in claim 3, wherein the optical waveguide is embedded in a layer of optical sealing compound between the flexible interconnect member and the waveguide.

11. Multiple connection arrangement as claimed in claim 6, wherein the flexible interconnect member is stamped out of the larger flexible circuit board.

12. Multiple connection arrangement as claimed in claim 6, wherein the boundary between the flexible interconnect member and the remainder of the larger flexible circuit board is defined during a subsequent etching operation.