Process for making masks with structures in the submicron range

• US 5,055,383 A
• Filed: 10/12/1989
• Issued: 10/08/1991
• Est. Priority Date: 11/17/1988
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Meissner, Klaus, Zapka, Werner, Trumpp, Hans-Joachim, Muhl, Reinhold, Koblinger, Otto
• Primary Examiner(s): Bowers, Jr., Charles L.
• Assistant Examiner(s): Chea, Thorl
• Application Number:
  US07/420,870
• Time in Patent Office: 726 Days
• Field of Search: 430/5, 430/312, 430/316, 430/317, 156/644, 156/643, 156/659.1
• US Class Current: 430/312
• CPC Class Codes: G03F 7/0035 Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
• CPC Class Codes: G03F 7/094 Multilayer resist systems, e.g. planarising layers
• CPC Class Codes: H01L 21/0271 comprising organic layers
• CPC Class Codes: H01L 21/30608 Anisotropic liquid etching H01L21/3063 takes precedence
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/3081 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/31144 using masks

Abstract

In the course of the process for making masks with structures in the submicrometer range, initially structures of photoresist or polymer material with horizontal and substantially vertical sidewalls are produced on a silicon substrate covered with an oxide layer. This is followed by a layer of silicon nitride which is deposited by LPCVD. The resultant structure is planarized with a photoresist which is etched back until the start of the vertical edges of the sidewall coating formed by the nitride layer is bared on the photoresist structures. In a photolithographic step, a trimming mask is produced on the surface of the nitride layer and the planarizing resist. The bared regions of the nitride layer are then removed by isotropic etching. The dimensions A-B of the openings defined after removal of the nitride layer from the vertical surfaces of the photoresist structures are transferred to the oxide layer by anisotropic etching. Concurrently with these structures of minimum line width, registration marks are generated which allow the adjustment necessary for a further photolithographic step to be carried out with maximum accuracy. After removal of the trimming mask, the planarizing resist, the photoresist structures and the remainder of the nitride layer, structures with coarser line widths are defined in a further photolithographic step, which are also transferred to the oxide layer. Using the oxide layer as a mask, trenches of the desired depth are produced in the silicon substrate by anisotropic etching. The mask is thinned by anisotropic etching, and the oxide layers are removed from the front and the back side by wet etching.

Claims

1. A process for making a structure including features in the submicron dimension range comprising the steps of:

a) providing a substrate;

b) forming a first layer of material on said substrate;

c) forming a mesa including at least one vertical surface on a selected region of said first layer;

d) forming a second layer of material over said mesa and the uncovered portions of said first layer, said second layer forming a sidewall over each vertical surface of said mesa;

e) forming a planarizing layer on said second layer, said planarizing layer leaving uncovered the top of said second layer on said mesa;

f) forming a mask on said second and planarizing layers, said mask leaving uncovered the top of a sidewall;

g) removing the uncovered sidewall with an isotropic etchant to form a first pattern defining a submicron dimension;

h) transferring said first pattern to said first insulting layer;

i) removing said mask, planarizing layer, second layer, and mesa to leave said first layer defining said first pattern;

j) photolithographically defining a second pattern on said first layer;

k) transferring said second pattern to said first layer; and

transferring said first and second patterns from said first layer into said silicon substrate.

2. A method in accordance with claim 1 wherein said step of forming said mesa includes the steps of:

forming a bottom layer of photoresist or polyimide over said first layer;

forming a middle layer of silicon dioxide or silicon nitride over said bottom layer;

forming a top layer of photoresist over said middle layer;

exposing and developing said top layer of photoresist to define said mesa; and

transferring said mesa first to said middle layer, then to said bottom layer.

3. A method in accordance with claim 2 wherein:

said bottom layer is about 1.1 μ

m in thickness and comprises a resist based on phenolic resin with a diester of a 1-oxo-2-naphthalene sulfonic acid with an unsymmetrical primary or secondary alphatic diol as a sensitizer;

said middle layer comprising silicon nitride about 0.1 μ

m in thickness; and

said top layer comprising a photoresist in the range of about 0.5-1.0 μ

m in thickness.

4. A process in accordance with claim 3 wherein:

said mesa is transferred from said top layer to said middle layer by reactive ion etching using a CF₄ plasma; and

said mesa is transferred from said middle layer to said bottom layer by reactive ion etching using oxygen.

5. A process according to claim 1 wherein said substrate comprises a monocrystalline silicon with a thickness of about 400 to 600 μ

m which is doped with a P+ conductivity producing dopant.

6. A process according to claim 1, wherein said first layer comprises a thermally grown silicon dioxide.

7. A process according to claim 1 wherein said second layer comprises silicon nitride with a thickness of about 100 to 500 nm.

8. A process according to claim 1 wherein said step of forming said planarizing layer comprises the steps of:

depositing a layer of photoresist material conformally over said second layer and said mesa; and

blanket etching said last-recited layer of photoresist material until the start of a sidewall is uncovered.

9. A process according to claim 1 wherein said first pattern is defined by the spacing formed by removing the second layer sidewall from the vertical surface of the mesa.

10. A process according to claim 1 and further including the step of forming, concurrently with the first pattern, registration marks in said first layer.

11. A process according to claim 1 wherein said step of transferring said first pattern to said first layer is performed using reactive ion etching.

12. A process according to claim 1 wherein said step of transferring said first and second patterns to said substrate is performed using reactive ion etching.

13. A process according to claim 1 and further including the step of thinning said substrate from the back side.

14. A process according to claim 1 and further including the step of removing said first layer from said substrate.