Space-saving two-sided microwave circuitry for hybrid circuits

• US 5,057,798 A
• Filed: 06/22/1990
• Issued: 10/15/1991
• Est. Priority Date: 06/22/1990
• Status: Expired due to Term

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Moye, Christopher A., Owens, Joseph N.
• Primary Examiner(s): GENSLER, PAUL L
• Application Number:
  US07/542,239
• Time in Patent Office: 480 Days
• Field of Search: 333/33, 333/238, 333/246, 333/247, 455/325, 455/327
• US Class Current: 333/33
• CPC Class Codes: H01P 3/003 Coplanar lines
• CPC Class Codes: H01P 3/084 Suspended microstriplines
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence

Abstract

A space-saving, two-sided microwave transmission line for hybrid circuits is disclosed, wherein a microstrip or coplanar waveguide RF line is formed on the front side and a microstrip or coplanar waveguid RF transmission line is formed on the backside of a hybrid circuit board containing other components. The RF line is formed on the top side of the circuit board to facilitate connections to other circuit boards and/or RF components, but is routed underneath the board to traverse the areas of the board occupied by other components. When the RF line is on the top side of the substrate, the groundplane is established by the metal layer on the bottom of the substrate for a microstrip line and by a top metal layer for a coplanar waveguide line, and when the RF line is on the bottom of the substrate, the groundplane is established with the metal layer on top of the substrate for a microstrip line, and with the bottom metal layer for a coplanar waveguide line. The connection from the topside and backside RF lines is accomplished by low VSWR plated via holes through the substrate.

Claims

1. A space-saving two-sided microwave transmission line for a hybrid circuit having RF circuits and dc circuits mounted on a common substrate, comprising:

a substrate comprising an insulating layer having first and second substantially planar surfaces;

a first coplanar waveguide having a first characteristic impedance and comprising a first transmission line conductor formed on said first surface of said substrate and further characterized by corresponding first planar conductive areas formed on said first surface and spaced from said first line conductor;

a second coplanar waveguide having a second characteristic impedance equal to said first characteristic impedance and comprising a second transmission line conductor formed on said second surface of said substrate and further characterized by corresponding second planar conductive areas formed on said second surface and spaced from said second line conductor;

a line-connecting via opening formed through said substrate and comprising means for electrically connecting said first transmission line conductor to said second transmission line conductor through said via opening; and

matching means for substantially matching the via opening impedance to said characteristic impedances of said first and second coplanar waveguides.

2. The transmission line of claim 1 wherein said matching means comprises a plurality of spaced ground via openings through said substrate to interconnect corresponding first and second groundplanes formed on said first and second surfaces of said substrate to provide shunt capacitance to said line-connecting via opening.

3. The transmission line of claim 1, further comprising a housing structure for supporting portions of the second surface of the substrate, the housing structure having a recessed region formed therein adjacent the second microwave conductor line.

4. The transmission line of claim 2 further comprising means for establishing a low inductance ground path between the respective groundplanes, said means comprising a plurality of groundplane connecting vias through via openings in said substrate.

5. A hybrid circuit having RF circuits and dc circuits, mounted on a common substrate, comprising:

a substrate comprising an insulating layer having first and second substantially planar surfaces;

a circuit housing structure for supporting edges of the second surface of said substrate;

said dc circuits being mounted on a first region of said substrate first surface;

a first microwave conductor line formed on said first surface of said substrate and terminating at a first conductor line end adjacent one side of said first region;

a second microwave conductor line formed on said second surface of said substrate beneath said first region and terminating in a second conductor line end at said one side of said first region;

a via opening formed through said substrate to connect said first line end to said second line end; and

impedance matching means for matching the via opening impedance to the characteristic impedance of said first and second microwave transmission lines.

6. The hybrid circuit of claim 5 wherein said matching means comprises a plurality of spaced ground via openings through said substrate to interconnect corresponding first and second groundplanes formed on corresponding areas of said first and second surfaces to provide shunt capacitance to said transmission line interconnecting via opening.

7. The hybrid circuit of claim 5 wherein said housing structure has a recessed region formed therein adjacent the second microwave conductor line.

8. The hybrid circuit of claim 5 wherein said dc circuits comprise one or more discrete circuit devices and one or more layers of interconnecting circuitry for interconnecting said discrete circuit devices and located within said first region of said substrate first surface.

9. The hybrid circuit of claim 8 wherein said discrete circuit devices are arranged to provide heat dissipation from said circuit devices to said housing, wherein circuit devices characterized by high heat generation are disposed on said substrate first surface directly over a region of the housing which is in contact with the second surface of the substrate.

10. The hybrid circuit of claim 5 further comprising means for establishing a low inductance ground path from corresponding groundplanes defined on said first and second surfaces, said means comprising a plurality of groundplane connecting vias through via openings in said substrate.

11. The transmission line of claim 5 wherein said first microwave transmission line conductor comprises a first microstrip transmission line further characterized by a corresponding first groundplane formed on corresponding areas of the second surface of said substrate.

12. The transmission line of claim 11 wherein said second microwave transmission line conductor comprises a second microstrip transmission line further characterized by a corresponding second groundplane formed on corresponding areas of said first surface of said substrate.

13. The transmission line of claim 5 wherein said second microwave transmission line conductor comprises a coplanar waveguide conductor transmission line further characterized by a corresponding regions of second surface spaced from said coplanar waveguide conductor transmission line.

14. A space-saving two-sided microstrip transmission line for a hybrid circuit comprising RF circuits mounted on a common substrate, comprising:

a substrate comprising an insulating layer having a first and second substantially planar surfaces;

a first microstrip conductor formed on said first surface of said substrate with a corresponding first groundplane formed on corresponding areas of said second surface of said substrate, said first conductor and ground plane comprising a first microstrip transmission line characterized by a first characteristic impedance;

a second microstrip conductor formed on said second surface of said substrate with a corresponding second ground plane formed on corresponding area of said first surface of said substrate, said second conductor and groundplane comprising a second microstrip transmission line characterized by a second characteristic impedance equal to said first characteristic impedance;

a via opening formed through said substrate to connect said first microstrip transmission line to said second microstrip transmission line; and

matching means for matching the via opening impedance to said characteristic impedances of said first and second microstrip transmission lines.

15. The microstrip transmission line of claim 14 wherein said matching means comprises a plurality of spaced ground via openings through said substrate to interconnect said first and second groundplanes to provide shunt capacitance to said transmission line interconnecting via opening.

16. The microstrip transmission line of claim 14 wherein said matching means comprises fringing capacitance between the end of said first microstrip conductor and surrounding portions of said first groundplane.

17. The microstrip transmission line of claim 14 further comprising a housing structure for supporting portions of the second surface of the substrate, the housing structure having a recessed region formed therein adjacent the second microstrip conductor line.

18. The microstrip transmission line of claim 14 further comprising means for establishing a low inductance ground path from the first groundplane to the second groundplane, said means comprising a plurality of groundplane connecting vias through via openings in said substrate.

19. A hybrid circuit having RF circuits and dc circuits, mounted on a common substrate, comprising:

a substrate comprising an insulating layer having first and second substantially planar surfaces;

a circuit housing structure for supporting edges of the second surface of said substrate;

said dc circuits being mounted on a first region of said substrate first surface;

a first microstrip conductor line formed on said first surface of said substrate and terminating at a first conductor line end adjacent one side of said first region;

a second microstrip conductor line formed on said second surface of said substrate beneath said first region and terminating in a second conductor line end at said one side of said first region;

a second groundplane formed on said first surface of said substrate within said first region;

a via opening formed through said substrate to connect said first line end to said second line end; and

impedance matching means for matching the via opening impedance to the characteristic impedance of said first and second microwave transmission lines.

20. The hybrid circuit of claim 19 wherein said matching means comprises a plurality of spaced ground via openings through said substrate to interconnect said first and second ground planes to provide shunt capacitance to said transmission line interconnecting via opening.

21. The hybrid circuit of claim 19 wherein said matching means comprises fringing capacitance between the end of said first microstrip conductor and surrounding portions of said first groundplane.

22. The hybrid circuit of claim 19 wherein said housing structure has a recessed region formed therein adjacent the second microstrip conductor line.

23. The hybrid circuit of claim 19 wherein said dc circuits comprise one or more discrete circuit devices and one or more layers of interconnecting circuitry for interconnecting said discrete circuit devices and located within said first region of said substrate first surface.

24. The hybrid circuit of claim 23 wherein said discrete circuit devices are arranged to provide heat dissipation from said circuit devices to said housing, wherein circuit devices characterized by high heat generation are disposed on said substrate first surface directly over a region of the housing which is in contact with the second surface of the substrate.

25. The microstrip transmission line of claim 19 further comprising means for establishing a low inductance ground path from the first groundplane to the second groundplane, said means comprising a plurality of groundplane connecting vias through via openings in said substrate.