Thermal heat sink encapsulated integrated circuit

• US 5,057,903 A
• Filed: 11/08/1990
• Issued: 10/15/1991
• Est. Priority Date: 07/17/1989
• Status: Expired due to Fees

• Current Assignee: Microelectronics and Computer Technology Corporation
• Original Assignee: Microelectronics and Computer Technology Corporation
• Inventors: Olla, Michael A.
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Nguyen, Viet Q.
• Application Number:
  US07/611,391
• Time in Patent Office: 341 Days
• Field of Search: 357/74, 357/80, 357/81, 357/72
• US Class Current: 257/707
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

An encapsulated integrated circuit which includes an integrated circuit die having a plurality of electric leads extending from the die. A thermal heat sink is positioned adjacent the die. The heat sink includes a thermoplastic material having a plurality of thermoconductive particles molded therein. A non-electrically conductive plastic material is sealably connected to the heat sink and encloses the die and seals around the leads. The heat sink plastic material is filled approximately 50 percent with metal particles, preferably in the form of powder. The particles may be from a group consisting of copper, aluminum, iron, carbon, aluminum nitride, silicon carbide, and boron nitride. The heat sink and the non-conductive plastic material have coacting interlocking interfaces.

Claims

1. An encapsulated integrated circuit comprising,

an integrated circuit die having a plurality of electrical leads extending from the die,

a thermal heat sink positioned adjacent the die, but out of contact from the leads, said heat sink including a thermoplastic material having a plurality of thermoconductive particles molded therein wherein the heat sink is filled approximately 40 to 60 percent with metal particles,

a non-electrically conductive thermoplastic material sealably bonded to the heat sink, said plastic material forming a housing enclosing the die and said leads sealably extending through the thermoplastic material, and

wherein the heat sink and the second thermoplastic material have coacting interlocking mating interfaces for mechanically locking the heat sink to the thermoplastic material.

2. The encapsulated integrated circuit of claim 1 wherein the thermoconductive particles are from a group of consisting of copper, aluminum, iron, carbon, aluminum nitride, silicon carbide, and boron nitride.

3. The encapsulated integrated circuit of claim 1 wherein the metal particles are in the form of metal powder.