Cooling system for electronic modules

• US 5,057,968 A
• Filed: 10/16/1989
• Issued: 10/15/1991
• Est. Priority Date: 10/16/1989
• Status: Expired due to Term

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Morrison, Robert A.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/422,181
• Time in Patent Office: 729 Days
• Field of Search: 211/41, 357/82, 62/418, 361/382, 361/383, 361/386-388, 361/385, 361/415, 165/80.4, 165/104.26, 165/104.33, 174/15.2, 174/16.3
• US Class Current: 361/700
• CPC Class Codes: H05K 7/1404 by edge clamping, e.g. wedges
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change
• CPC Class Codes: H05K 7/20936 Liquid coolant with phase change

Abstract

The invention is a cooling system for electronic circuit modules such as a printed circuit boards. In detail the invention comprises a housing assembly having first and second opposed plates. The opposed plates include a plurality of spaced guide rails thereon. A plurality of electronic modules each having a metallic frame, are slidably mounted in the opposed guide rails and detachably clampable thereto. A cooling system is included, which comprises: each of the guide rails having internal cooling passages, preferably in a serpentine pattern, with the cooling passages extending from the first and second ends of the rails; and each of the opposed plates having a coolant inlet passage and a coolant outlet passage coupling each end in parallel. A coolant flow control system is provided which insures that phase change cooling is accomplished within the serpentine shaped guide rails.

Claims

1. A modular electronic system comprising:

a housing assembly having first and second opposed plates, said opposed plates having a plurality of spaced guide rails thereon;

a plurality of electronic modules, each of said modules having a metallic frame, each said metallic frame being slidably mounted to said opposed guide rails and detachably (clampable) clamped thereto;

a cooling system comprising;

each of said guide rails having internal serpentine cooling passages extending substantially the entire length thereof, said internal cooling passages having first and second ends;

each of said opposed plates having a cooling inlet passage coupling said first end of said internal passages in parallel and a cooling outlet passage coupling said second ends of said internal passages in parallel; and

means for circulating cooling fluid through said plate and rail passages so as to maintain a nucleate boiling phase change of the coolant within said rail passages.

2. The system as set forth in claim 1 wherein said electronic modules are detachably (clampable) clamped to said rails by means of thermal clamps.