Sensor capsule mounting

• US 5,058,430 A
• Filed: 12/29/1989
• Issued: 10/22/1991
• Est. Priority Date: 12/29/1989
• Status: Expired due to Term

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Aske, Vernon H.
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US07/458,853
• Time in Patent Office: 662 Days
• Field of Search: 73/517 B, 73/517 R, 73/514, 73/497
• US Class Current: 73/497
• CPC Class Codes: G01P 1/023 for acceleration measuring devices

Abstract

An apparatus for effectively mounting a silicon sensor capsule within a stainless steel, or other similar material, housing of an accelerometer comprises an alignment pin and two flex pins. The alignment pin provides torsional stiffness, while the flex pins provide stiffness in a vertical plane. The apparatus is capable of being used within different housings having different temperature coefficients of expansion. The mounting pins maintain accurate alignment of the sensor capsule without inducing stress into the capsule. Such stress could easily cause bias or misalignment errors which are undesirable in navigation of aircraft or missiles, two common uses of accelerometers.

Claims

1. A mounting means for a sensor capsule of a precision integrated silicon accelerometer comprising:

a sensor capsule located in said accelerometer;

an alignment pin for mounting said capsule and providing large torsional stiffness so that a natural frequency of said capsule about a major axis of said alignment is greater than 2000 Hertz; and

two flex pins for mounting said capsule and providing stiffness in a vertical plane while allowing flexibility in two horizontal directions.

2. The apparatus as in claim 1 which further includes:

silicon sensor die and means mounted in said sensor capsule for sensing stress in flexures in said die caused by input acceleration and rebalancing said flexures for a substantially stress free condition; and

a top and a bottom silicon top for preventing overstress in said sensor die means.

3. The apparatus as in claim 2 wherein said alignment pin and said two flex pins have shoulders which align with a bottom surface of said bottom silicon stop so as to establish alignment in said vertical plane.

4. The apparatus as in claim 2 wherein said alignment pin and said two flex pins are bonded to said bottom silicon stop so as to avoid shear stress in said sensor capsule.

5. A mounting means for a sensor capsule whose sensing element is constructed of silicon, said mounting means comprising:

an alignment pin for providing large torsional stiffness so that a natural frequency of said capsule about a major axis of said alignment pin is greater than 2000 Hertz; and

two flex pins for providing stiffness in a vertical plane while allowing flexibility in two horizontal directions;

wherein said mounting means is capable of mounting said sensor capsule to a housing having a different temperature coefficient of expansion without putting undesirable stress into said sensor capsule over a wide range of temperatures.