Building and method for manufacture of integrated circuits

• US 5,058,491 A
• Filed: 08/27/1990
• Issued: 10/22/1991
• Est. Priority Date: 08/27/1990
• Status: Expired due to Term

• Current Assignee: Meissner & Wurst GmbH & Co. (Jenoptik AG), Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wiemer, Klaus C., Buhler, James E., Simon, Rudolf O., Laub, Helmut A.
• Primary Examiner(s): Makay, Albert J.
• Assistant Examiner(s): DOERRLER, WILLIAM CHARLES
• Application Number:
  US07/572,880
• Time in Patent Office: 421 Days
• Field of Search: 98/33.1, 98/115.3, 98/31.5, 98/31.6, 98/34.5, 98/34.6, 98/36, 55/385.2
• US Class Current: 454/187
• CPC Class Codes: F24F 3/167 Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed air distribution by perforated walls F24F7/10
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67727 using a general scheme of a conveying path within a factory

Abstract

A building for the manufacture of integrated circuits which includes a manufacturing equipment floor with processing equipment for the manufacture of integrated circuits, a floor under the manufacturing floor has supporting equipment associated with each of the processing equipment, and an upper floor above the manufacturing floow supports a plenum system that provides at least two classes of clean air circulation to the manufacturing floor. Each piece of processing equipment is enclosed with means to separate it from the surrounding air. A clean air input of the highest class of clean air purity is provided to the processing equipment in the enclosure. The air/gas exhaust is directed through an air/gas handling system. Means are also provided to provide the surrounding areas a clean air input of a lower class of clean air purity from the plenum system and the air/gas exhaust directed to an air/gas handling system. Interchangeable means are provided that are associated with the plenum system which quickly allow the change of air purity to another class of clean air purity whereby the processing equipment can be removed, replaced with another processing equipment or a new piece of processing equipment inserted without undue down time of the manufacturing of the integrated circuits.

Claims

1. A building for the manufacture of integrated circuits comprising:

a manufacturing equipment floor with processing equipment for the manufacture of said integrated circuits supported thereon;

a lower floor under said manufacturing equipment floor with supporting equipment associated with each of said processing equipment;

a ceilling over the top of said manufacturing equipment floor for supporting a plenum system that provides at least two classes of clean air circulation to said manufacturing floor;

means for enclosing from surrounding areas each piece of said processing equipment and for providing said enclosure with a clean air input of said highest class of clean air purity from said plenum system and an air/gas exhaust to an air/gas handling system;

means for providing the said surrounding areas a clean air input of a lower class of clean air purity from said plenum system and an air/gas exhaust to said air/gas handling system;

means in said air/gas handling system for separately handling said air/gas exhaust from within said processing equipment; and

interchangeable means associated with said plenum system which quickly allow the change of location of the input of clean air from one class of clean air purity to another class of clean air purity whereby said processing equipment can be removed, replaced with another processing equipment or a new piece of processing equipment inserted without undue down time of the manufacturing of said integrated circuits.

2. The building of claim 1 wherein said manufacturing equipment floor includes a waffle slab floor with a pedestal floor supported thereby and processing equipment supported by said pedestal floor, and wherein said pedestal floor covers all of those areas of the equipment floor upon which said processing equipment could be positioned.

3. The building of claim 1 wherein the said means in said air/gas handling system for separately handling said air/gas exhaust includes multiple ringed branch headers which allow connection to exhaust from said processing equipment positioned at any desired position on said manufacturing floor and connected to said exhaust.

4. The building of claim 3 and further comprising separate trenches in the lower floor for at least toxic gases and air that has moved through said air/gas handling system;

and vertical headers connecting said multiple ringed branch headers to the appropriate said trenches.

5. The building of claim 1 wherein the said supporting equipment associated with each of said processing equipment is so constructed that the connections to said processing equipment can quickly be made and said supporting equipment moved whereby said processing equipment can be changed without undue down time of the manufacturing of said integrated circuits.

6. The building of claim 1 wherein the said interchangeable means include filter and blank plates which are interchangeable;

said filter plates includes high performance filter which can produce clean air of the highest class of clean air purity and said blank plates prevent air from entering said manufacturing floor.

7. The building of claim 6 wherein said high performance filter plate including a ULPA 99.99995% efficiency filter packing.

8. The building of claim 4 and further comprising means for returning the said air from said separate air trench to said plenum system;

scrubber means for said toxic gases and means for connecting the said toxic gases separate trench to said scrubber means.

9. The building of claim 1 wherein said manufacturing equipment floor is constructed of a waffle slab;

said waffle slab in the central region of said floor is substantially thicker than the said waffle slab in the peripheral region of said floor;

the said processing equipment involved with lithography are located on that said central region and the other processing equipment are located in said peripheral regions.

10. The building of claim 9 wherein the said waffle slab floor supports a raised floor upon which said processing equipment rests.

11. The building of claim 1 and further comprising a raised walkway above said lower floor at appropriate locations for easily reaching said air/gas handling system, other piping and electrical systems.

12. The method of manufacturing integrated circuits with only the processing equipment maintained at the highest class of clean air while the surrounding areas are at a lower class of clean air and with availability of quickly moving or adding/removal of processing equipment comprising:

providing a manufacturing equipment floor having processing equipment for the manufacture of said integrated circuits supported thereon;

providing a lower floor under said manufacturing equipment floor with supporting equipment associated with each of said processing equipment;

providing a ceiling over the top of said manufacturing equipment floor for supporting a plenum system that has at least two classes of clean air for circulation to said manufacturing floor;

enclosing from surrounding areas each piece of said processing equipment;

providing said enclosure with a clean air input of said highest class of clean air purity from said plenum system and exhausting air/gas from said processing equipment to an air/gas handling system;

providing to the said surrounding areas a clean air input of a lower class of clean air purity from said plenum system and exhausting the air/gas from said processing equipment to said air/gas handling system;

moving the exhausting air/gas from said processing equipment through appropriate portions of the said air/gas handling system and vertical headers connecting the said air/gas handling system to scrubbers for the said toxic gases and returning said air to said plenum system;

providing interchangeable means associated with said plenum system which quickly allow the change of location of the input of clean air from one class of clean air purity to another class of clean air purity whereby said processing equipment can be removed, replaced with another processing equipment or a new piece of processing equipment inserted without undue down time of the manufacturing of said integrated circuits;

transporting wafers from one piece of processing equipment to another in the same clean air class as exists in the processing equipment; and

following through the sequence of the process of manufacture in said process equipment until said integrated circuits have been completed on said wafers.

13. The method of claim 12 wherein said transporting of wafers from on piece of said processing equipment to another is done by moving said wafers in a cassette that is enclosed in a container that has a clean air class identical to that within said processing equipment and each said processing equipment has a interface that accepts said cassette of wafers for processing.

14. The method of claim 13 wherein said highest class of clean air purity is class 1 or below within the enclosed said processing equipment and said container, and said lower class of clean air purity is class 1000 or below.

15. The method of claim 12 wherein the said interchangeable means include filter and blank plates which are interchangeable;

said filter plates including high performance filter which can produce clean air of the highest class of clean air purity and said blank plates preventing air from entering said manufacturing floor.

16. The method of claim 15 and further comprising:

stopping said sequence of processing steps in one piece of said processing equipment without stopping any other said sequence of process in other processing equipment, turning off the said clean air to the enclosed said piece of processing equipment, removing said piece of processing equipment from the said manufacturing floor, installing another piece of processing equipment into the same location, turning on said clean air, and restarting said another piece of processing equipment to its said sequence of process.

17. The method of claim 15 and further comprising:

stopping said sequence of processing steps in one piece of said processing equipment without stopping any other said sequence of process in other processing equipment, turning off the said clean air to the enclosed said piece of processing equipment, removing said piece of processing equipment from the said manufacturing floor, replacing the said filter plates that provide said highest class of clean air with said blank plates to prevent air from entering said manufacturing floor.

18. The method of claim 15 and further comprising:

replacing the said blank plates that prevent air from entering said manufacturing floor with said filter plates that provide said highest class of clean air at a location on the said manufacturing floor where a new piece of said processing equipment is desired, installing said new piece of processing equipment, enclosing said new piece of processing equipment from the surrounding areas, turning on said clean air, and starting said new piece of processing equipment to its said sequence of process.

19. The method of claim 12 wherein the exhausting air/gas from said processing equipment is moved through separate trenches in the said lower floor for at least toxic gases and air before moving the toxic gases to said scrubbers.

20. The method of claim 12 wherein said processing equipment used for lithographic processing are located on the central region of said manufacturing floor, the remaining said processing equipment are positioned around the peripheral region of said manufacturing floor and said transporting wafers is done to and from said lithographic processing equipment in the said central region from the peripheral region whereby the distance and time for said transporting is substantially reduced.