Apparatus and method of forming optical waveguides on metalized substrates

• US 5,059,475 A
• Filed: 06/29/1990
• Issued: 10/22/1991
• Est. Priority Date: 06/29/1990
• Status: Expired due to Term

• Current Assignee: Viavi Solutions, Inc. (Lumentum Holdings Inc.)
• Original Assignee: Photonic Integration Research, Inc. (RWS Holdings Plc)
• Inventors: Sakaguchi, Shigeki, Miyashita, Tadashi, Sun, Cheng-ko J.
• Primary Examiner(s): Ryan, Patrick J.
• Application Number:
  US07/545,874
• Time in Patent Office: 480 Days
• Field of Search: 428/195, 428/209, 428/411.1, 428/426, 428/432, 428/446, 428/447, 428/901, 65/3.12, 350/96.12, 350/96.14, 350/96.33
• US Class Current: 428/195.1
• CPC Class Codes: G02B 6/132 by deposition of thin films
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31663 As siloxane, silicone or silane

Abstract

An integrated optoelectrical circuit is described. An apparatus and method are disclosed whereby planar optical waveguides are formed on Al₂ O₃, other ceramics, silicon, silica, and other glass substrates that are thin film wired. An interface coating of silicon or silicon dioxide is applied to a surface of the thin film wired substrates using a low temperature deposition process such as sputtering or chemical vapor deposition. Glass cladding and core layers are deposited onto the thin film coating using a flame hydrolysis deposition technique. With this invention, channel waveguides and integrated optical circuits can be formed on a common substrate with electronic IC chips.

Claims

1. An optical-electrical device, comprising:

a substrate selected from the group consisting of ceramics, glass, and silicon materials including electrically operative integrated circuits connected by metalized thin film connectors on a first planar surface thereof;

a thin film coating selected from the group consisting of silicon and silicon dioxide (SiO₂) materials applied onto said planar surface including the electrically operative integrated circuits;

an optically conductive waveguide formed from a glass cladding layer applied onto said thin film coating and a glass core layer applied to said cladding layer;

whereby the electrically operative integrated circuits are operationally interconnected to the optically conductive waveguides.

2. The device of claim 1, wherein said thin film coating applied to said first planar surface is between 1 and 5 microns thick.

3. The device of claim 1, further comprising a thin film coating applied to a second planar surface of said substrate opposite said first planar surface.

4. The device of claim 1, wherein said ceramic material substrate is Al₂ O₃.

5. the device of claim, wherein said glass substrate is silica glass.

6. A method for forming an optical waveguide on a metalized substrate said method comprising the steps of:

providing a substrate selected from a member of the group consisting of ceramics, glass, and silicon, having a film of metalized wires therein;

applying a thin film coating layer selected from a member of the group consisting of silicon and silicon dioxide, to said substrate using a low temperature deposition process, said coating layer applied over said wires;

applying a glass cladding layer onto said coating layer; and

applying a glass core layer to said cladding layer.

7. The method of claim 6, wherein said ceramic substrate is Al₂ O₃.

8. The method of claim 6, wherein said glass substrate is silica glass.

9. A device integrating an electronic integrated circuit with an integrated optical circuit, comprising:

a substrate selected from a member of the group consisting of ceramics, glass, and silicon materials, including said electronic circuit operatively interconnected by metallized thin film wires on a first surface thereof;

a coating of silicon dioxide (SiO₂) in a thickness of 1 to 5 microns applied to said first surface of said substrate; and

a double glass layer including optical circuit waveguides applied to said coating, said double glass layer formed from a first glass cladding layer and a second glass core layer.

10. An integrated opto-electronic circuit comprising thin film metalized circuitry of an electronic circuit formed on a substrate selected from a member of the group consisting of ceramics, glass, and silicon materials, and optical waveguides formed in a glass layer operatively interconnected with said electronic circuitry, are separated by an interface film coating layer selected from at least one of the members of the group consisting of silicon and silicon dioxide materials.