×

Light emitting diode array with aligned solder bumps

  • US 5,060,027 A
  • Filed: 05/15/1990
  • Issued: 10/22/1991
  • Est. Priority Date: 08/11/1988
  • Status: Expired due to Fees
First Claim
Patent Images

1. A light emitting diode array comprising an optically transparent substrate of semiconductor material in which a multiplicity of light emitting diodes are defined on one surface of the substrate, each of said diodes having an electrical contact on said one surface of the substrate, said substrate being provided with a common electrode of an optically transparent material for all the diodes, a further substrate in which a multiplicity of driver circuits are defined corresponding to the number and positions of the light emitting diodes on the substrate, each driver circuit having a corresponding contact and wherein the contacts of the light emitting diodes and the corresponding contacts of the driver circuits are in alignment and in electrical soldered contact.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×