Flame-retardant, high-impact polycarbonate molding compounds

• US 5,061,745 A
• Filed: 05/23/1989
• Issued: 10/29/1991
• Est. Priority Date: 06/04/1988
• Status: Expired due to Term

• Current Assignee: Bayer AG
• Original Assignee: Bayer AG
• Inventors: Wittmann, Dieter, Ott, Karl-Heinz, Peters, Horst, Kress, Hans-Jurgen, Buekers, Josef, Schoeps, Jochen
• Primary Examiner(s): SANDERS, KRIELLION ANTIONETTE
• Application Number:
  US07/355,957
• Time in Patent Office: 889 Days
• Field of Search: 524/139, 524/140, 524/141, 524/143, 524/504, 524/531
• US Class Current: 524/139
• CPC Class Codes: C08K 5/521 Esters of phosphoric acids, e.g. of H3PO4
• CPC Class Codes: C08K 5/5333 Esters of phosphonic acids
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 27/18 Homopolymers or copolymers or tetrafluoroethene
• CPC Class Codes: C08L 51/04 grafted on to rubbers
• CPC Class Codes: C08L 69/00 Compositions of polycarbonates; Compositions of derivatives of polycarbonates

Abstract

The invention relates to polycarbonate molding compounds consisting of halogen-free polycarbonates, graft polymers, phosphorus compounds, tetrafluoroethylene polymers and, optionally, copolymers and/or, optionally, other additives known per se and a process for their production.

Claims

1. Thermoplastic molding compounds consisting of

A) 50 to 96.5 parts by weight of one or more thermoplastic, halogen-free, aromatic polycarbonates based on diphenols corresponding to ##STR7## wherein A is a single bond, C_1-5 alkylene, C_2-5 alkylidene, C_5-6 cycloalkylidene, --S-- or SO₂

B) 3.5 to 25 parts by weight of one or more halogen-free graft polymers of

B.1) 5 to 90 parts by weight, based on B), of a mixture of

B.1.1) 50 to 95% by weight styrene, α

-methyl styrene, nucleus-substituted styrene, methyl methacrylate or mixtures thereof and

B.1.2) 50 to 5% by weight (meth)acrylonitrile, methyl methacrylate, n-butyl acrylate, t-butyl (meth)acrylate or mixtures thereof on

B.2) 95 to 10 parts by weight, based on B), of a rubber having a glass temperature T_G of ≦

10°

C. selected from the group consisting of butadiene, butadiene/styrene copolymer, polyisoprene, EPDM and silicone rubbers, and

C) 0 to 40 parts by weight of a halogen-free, thermoplastic copolymer of

C.1) 50 to 95% by weight styrene, α

-methyl styrene, nucleus-substituted styrene, methyl methacrylate or mixtures thereof,

C.2) 50 to 5% by weight (meth)acrylonitrile, methyl methacrylate or mixtures thereof, the sum of the parts by weight of A)+B)+optionally C) having to amount to 100 parts by weight, and

D) 1 to 20 parts by weight, based on 100 parts by weight of A)+B)+optionally C), of a halogen-free phosphorus compound corresponding to ##STR8## in which R₁, R₂ and R₃ independently of one another represent C₁ -C₈ alkyl or C₆ -C₂₀ aryl and n=0 or 1, and

E) 0.05 to 5 parts by weight, based on 100 parts by weight of A)+B)+optionally C), of a tetrafluoroethylene polymer having average particle sizes of 0.05 to 1000 μ

m, a density of 1.2 to 2.3 g/cm³ a fluorine content of 65 to 76% by weight.

2. Molding compounds as claimed in claim 1, characterized in that component A) is present in quantities of 60 to 96 parts by weight and component B) in quantities of 4 to 15 parts by weight.

3. Molding compounds as claimed in claim 1, characterized in that component A) is present in quantities of 70 to 95.5 parts by weight and component B) in quantities of 4.5 to 10 parts by weight.

4. Molding compounds as claimed in claim 1, characterized in that component C) is present in quantities of 1 to 30 parts by weight.

5. Molding compounds as claimed in claim 4, characterized in that component C) is present in quantities of 5 to 20 parts by weight.

6. Molding compounds as claimed in claim 1, characterized in that component D) is present in quantities of 2 to 15 parts by weight.

7. Molding compounds as claimed in claim 6, characterized in that component D) is present in quantities of 3 to 12 parts by weight.

8. Molding compounds as claimed in claim 1 , characterized in that component E) is present in quantities of 0.1 to 1 part by weight.

9. Molding compounds as claimed in claim 8, characterized in that component E) is present in quantities of 0.1 to 0.5 part by weight.

10. Molding compounds as claimed in claim 1, characterized in that component B) is synthesized from 30 to 80 parts by weight B.1 and 70 to 20 parts by weight B.2.

11. Molding compounds as claimed in claim 1 characterized in that component E) is used in the form of a coagulated mixture of emulsions of the tetrafluoroethylene polymers E) having an average particle size of 0.05 to 20 μ

m and a density of 1.2 to 1.9 g/cm³ with emulsions of graft polymers B), the ratio by weight of graft polymer B) to the tetrafluoroethylene polymer E) is from 95;

5 to 60;

40 and the content of additional quantities B), based on 100 parts by weight A)+B)+optionally C), is between 0.1 and 4.0 parts by weight.

12. Molding compounds as claimed in claim 1 characterized in that they contain effective quantities of at least one additive selected from the group consisting of stabilizers, pigments, flow aids, fillers and reinforcing materials, mold release agents and/or antistatic agents.

13. Molding compounds as claimed in claim 12, characterized in that they contain as reinforcing materials up to 60% by weight, based on the molding compound to be reinforced, of glass fibers.

14. A process for the production of the molding compounds claimed in claim 1, characterized in that components A), B), D), E) and, optionally, C) are mixed in known manner and the resulting mixture is melt-compounded or melt-extruded in standard units at temperatures in the range from 200°

to 330°

C.

15. The process of claim 14 characterized in that at least one additive selected from the group consisting of stabilizers, pigments, flow adds, fillers and reinforcing materials, mold release agents and anti-static agents is also incorporated.

18. The compound of claim 1 wherein said rubber is butadiene or butadiene/styrene copolymer.

16. A thermoplastic molding compound consisting of

A) 50 to 96.5 parts by weight of one or more thermoplastic, halogen-free aromatic polycarbonates based on diphenols corresponding to ##STR9## wherein A is a single bond, C_1-5 alkylene, C_2-5 alkylidene, C_5-6 cycloalkylidene, --S-- or --SO₂

B) 4.5 to 10 parts by weight of one or more halogen-free graft polymers of

B.1) 5 to 90 parts by weight, based on B), of a mixture of

B.1.1) 50 to 95% by weight styrene, α

-methyl styrene, nucleus-substituted styrene, methyl methacrylate or mixtures thereof and

B.1.2) 50 to 5% by weight (meth)acrylonitrile, methyl methacrylate, n-butyl acrylate, t-butyl (meth)acrylate or mixtures thereof on

B.2) 95 to 10 parts by weight, based on B), of a rubber having a glass temperature T_g of ≦

10°

C. selected from the group consisting of butadiene, butadiene/styrene copolymer, polyisoprene, EPDM and silicone rubbers, and

C) 0 to 40 parts by weight of a halogen-free, thermoplastic copolymer of

C1) 50 to 95% by weight styrene, α

-methyl styrene, nucleus-substituted styrene, methyl methacrylate or mixtures thereof, and

C2) 50 to 5% by weight (meth)acrylonitrile, methyl methacrylate or mixtures thereof,

the sum of the parts by weight of A)+B)+optionally C) having to amount to 100 parts by weight, and

D) 1 to 20 parts by weight, based on 100 parts by weight of A)+B)+optionally C), of a halogen-free phosphorus compound corresponding to ##STR10## in which R₁, R₂ and R₃ independently of one another represent C₁ -C₈ alkyl or C₆ -C₂₀ aryl and n=0 or 1, and

E) 0.05 to 5 parts by weight, based on 100 parts by weight of A)+B)+optionally C), of a tetrafluoroethylene polymer having average particle sizes of 0.05 to 1000 μ

m, a density of 1.2 to 2.3 g/cm³ and a fluorine content of 65 to 76% by weight.

19. The compound of claim 16 wherein said rubber is butadiene or butadiene/styrene copolymer.

17. A thermoplastic molding compound consisting of

A) 60 to 96 parts by weight of one or more thermoplastic, halogen-free aromatic polycarbonates based on diphenols corresponding to ##STR11## wherein A is a single bond, C_1-5 alkylene, C_2-5 alkylidene, C_5-6 cycloalkylidene, --S-- or SO₂

B) 4.0 to 15 parts by weight, of one or more halogen-free graft polymers of

B.1) 5 to 90 parts by weight, based on B), of a mixture of

B.1.1.) 50 to 95% by weight styrene, α

-methyl styrene, nucleus-substituted styrene, methyl methacrylate or mixture thereof and

B.1.2) 50 to 5% by weight (meth)acrylonitrile, methyl methacrylate, n-butyl acrylate, t-butyl (meth) acrylate or mixtures thereof on

B.2) 95 to 10 parts by weight, based on B), of a rubber having a glass temperature T_g of ≦

10°

C. selected from the group consisting of butadiene, butadiene/styrene copolymer, polyisoprene, EPDM and silicone rubbers, and

C) 0 to 40 parts by weight of a halogen-free, thermoplastic copolymer of

C.1) 50 to 95% by weight styrene, α

-methyl styrene, nucleus-substituted styrene, methyl methacrylate or mixtures thereof, and

C.2) 50 to 5% by weight (meth)acrylonitrile, methyl methacrylate or mixtures thereof,

the sum of the parts by weight of A)+B)+optionally C) having to amount to 100 parts by weight, and

D) 1 to 20 parts by weight, based on 100 parts by weight of A)+B)+optionally B), of a halogen-free phosphorus compound corresponding to ##STR12## in which R₁, R₂ and R₃ independently of one another represent C₁ -C₈ alkyl or C₆ -C₂₀ aryl and n=0 to 1,

E) 0.05 to 5 parts by weight, based on 100 parts by weight of A)+B)+optionally C), of a tetrafluoroethylene polymer having average particle sizes of 0.05 to 1000 μ

m, a density of 1.2 to 2.3 g/cm³ and a fluorine content of 65 to 76% by weight.

20. The compound of claim 17 wherein said rubber is butadiene or butadiene/styrene copolymer.