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Laminated semiconductor sensor with overpressure protection

  • US 5,062,302 A
  • Filed: 08/27/1990
  • Issued: 11/05/1991
  • Est. Priority Date: 04/29/1988
  • Status: Expired due to Fees
First Claim
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1. An electromechanical sensor comprising:

  • a first semiconductor wafer including a first stop surface residing in a first shallow recessed region of said first wafer;

    a second semiconductor wafer;

    wherein said first and second semiconductor wafers are laminated together such that said first recessed region of said first wafer and said second wafer define a first chamber in which said first stop surface and said second wafer are disposed close enough together such that said first stop surface restrains said second wafer from deflecting beyond said first stop surface;

    means for measuring deflection of said second wafer;

    wherein said second wafer includes a first contact surface residing in a second shallow recessed region of said second wafer;

    wherein said first stop surface and said first contact surface are disposed substantially opposite each other in said first chamber; and

    wherein said second shallow recessed region includes a center section and a thinner perimeter section which substantially surrounds said center section.

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