Process for preparing an ink jet head

• US 5,062,937 A
• Filed: 12/02/1988
• Issued: 11/05/1991
• Est. Priority Date: 12/02/1987
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Komuro, Hirokazu
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Leader, William T.
• Application Number:
  US07/279,056
• Time in Patent Office: 1,068 Days
• Field of Search: 204/192.15, 204/192.16, 204/192.17, 204/192.22, 204/192.23, 346/140 R
• US Class Current: 204/192.15
• CPC Class Codes: B41J 2/14129 Layer structure
• CPC Class Codes: B41J 2/1604 of the edge shooter type
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2202/03 Specific materials used

Abstract

A process for preparing an ink jet head having a support, an electrothermal transducer provided on the support and having a heat-generating resistor and a pair of electrodes electrically connected to the heat-generating resistor, a first upper layer provided. on the electrothermal transducer, a second upper layer provided on the first upper layer and a liquid path communicated with a discharge opening for discharging liquid and formed on the support so as to correspond to the heat-generating portion of the electrothermal transducer formed between the pair of electrodes comprises the steps of:

forming the first upper layer by the bias sputtering method at the absolute value of the bias voltage of 50 V or less and

forming the second upper layer by the bias sputtering method at the absolute value of the bias voltage higher than 50 V.

The upper layers may be made of a protective material. Suitable materials are metal oxides such as SiO₂, TiO₂, WO₃ and Ta₂ O₅, and nitrides such as Si₃ N₄ and AlN.

Claims

1. A process for preparing an ink jet head having a support, an electrothermal transducer provided on the support and having a heat-generating resistor and a pair of electrodes electrically connected to the heat-generating resistor, a first upper layer provided on the electrothermal transducer, a second upper layer provided on the first upper layer and a liquid path communicated with a discharge opening for discharging liquid and formed on the support so as to correspond to the heat-generating resistor portion of the electrothermal transducer formed between the pair of electrodes, wherein the method comprises the steps of:

forming the first upper layer using a bias sputtering method, wherein the absolute value of the bias voltage is 50 V or less and greater than 0 V; and

forming the second upper layer using the bias sputtering method, wherein the absolute value of the bias voltage is higher than 50 V.

2. A process for preparing an ink jet head according to claim 1, wherein the absolute value of the bias voltage in the step of forming the first upper layer is 20 V or less.

3. A process for preparing an ink jet head according to claim 1, wherein the absolute value of the bias voltage in the step of forming the second upper layer is 70 V or higher.

4. A process for preparing an ink jet head according to claim 1, wherein the absolute value of the bias voltage in the step of forming the second upper layer is 100 V or higher.

5. A process for preparing an ink jet head according to claim 1, wherein the electrothermal transducer generates heat energy to be utilized for discharging liquid.

6. A process for preparing an ink jet head according to claim 1, wherein the liquid path is formed by providing a covering member having a recessed portion for forming the liquid path on the support.

7. A process for preparing an ink jet head according to claim 1, wherein the liquid path is formed by forming on the support a wall forming member for forming the wall of the liquid path and providing a top plate on the wall forming member.

8. A process for preparing an ink jet head according to claim 7, wherein the wall forming member is formed using a photosensitive resin.

9. A process for preparing an ink jet head according to claim 1, wherein the change in the absolute valve of the bias voltage between the step of forming the first upper layer and the step of forming the second upper layer is effected intermittently.

10. A process for preparing an ink jet head according to claim 1, wherein the change in the absolute valve of the bias voltage between the step of forming the first upper layer and the step of forming the second upper layer is effected continuously.

11. A process for preparing a substrate for an ink jet head having a support, an electrothermal transducer provided on the support and having a heat-generating resistor and a pair of electrodes electrically connected to the heat-generating resistor, a first upper layer provided on the electrothermal transducer and a second upper layer provided on the first upper layer, wherein the method comprises the steps of:

forming the first upper layer using a bias sputtering method, wherein the absolute value of the bias voltage is 50 V or less and greater than 0 V; and

forming the second upper layer using the bias sputtering method, wherein the absolute value of the bias voltage is higher than 50 V.

12. A process for preparing a substrate for an ink jet head according to claim 11, wherein the absolute value of the bias voltage in the step of forming the first upper layer is 20 V or less.

13. A process for preparing a substrate for an ink jet head according to claim 11, wherein the absolute value of the bias voltage in the step of forming the second upper layer is 70 V or higher.

14. A process for preparing a substrate for an ink jet head according to claim 11, wherein the absolute value of the bias voltage in the step of forming the second upper layer is 100 V or higher.

15. A process for preparing a substrate for an ink jet head according to claim 11, wherein the change in the absolute value of the bias voltage between the step of forming the first upper layer and the step of forming the second upper layer is effected intermittently.

16. A process for preparing a substrate for an ink jet head according the claim 11, wherein the change in the absolute value of the bias voltage between the step of forming the first upper layer and the step of forming the second upper layer is effected continuously.