Method and apparatus for inspection of solder joints utilizing shape determination from shading

• US 5,064,291 A
• Filed: 04/03/1990
• Issued: 11/12/1991
• Est. Priority Date: 04/03/1990
• Status: Expired due to Term

• Current Assignee: Hughes Electronics Corporation (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Reiser, Kurt
• Primary Examiner(s): Rosenberger, Richard A.
• Assistant Examiner(s): PHAM, HOA Q
• Application Number:
  US07/504,460
• Time in Patent Office: 588 Days
• Field of Search: 356/372, 356/375, 356/376, 356/394, 356/237, 250/561, 250/571, 358/101, 358/106, 358/107
• US Class Current: 356/625
• CPC Class Codes: G01N 2021/8816 by using multiple sources, e.g. LEDs
• CPC Class Codes: G01N 2021/8845 Multiple wavelengths of illumination or detection
• CPC Class Codes: G01N 2021/8887 based on image processing techniques
• CPC Class Codes: G01N 2021/95646 Soldering
• CPC Class Codes: G01N 21/95684 Patterns showing highly reflecting parts, e.g. metallic elements
• CPC Class Codes: G01N 2201/102 Video camera
• CPC Class Codes: H05K 13/0817 Monitoring of soldering processes inspection of solder joints or of printed solder paste G01N21/95684

Abstract

Inspection of solder joints utilizing ilumination, reflected light intensity measurements to determine surface heights and comparison with predetermined inspection criteria to determine the integrity of the solder joint. A solder fillet (16b) is sequentially illuminated from first and second angles and optically scanned and reflected light intensity values at incremental values of inclination are measured. The heights of the fillet wall (16d) at predetermined points and the integrity of the fillet (16b) are determined using the measured reflected light intensity values and either using real-time computation or accessing an array of predetermined incremental inclination values as a function of the reflected light intensity values. Alternatively, the ratio of the sensed reflected light intensity values at each point may be used as an input variable to a one dimensional look-up table or for real-time computation. The solder fillet may be coated with a matte coating.

Claims

1. A method for determining the height of a solder fillet at a predetermined point on a wall thereof, comprising the steps of:

(a) storing an array of predetermined incremental solder surface height change values, each being a function of first and second predetermined reflected light intensity values resulting from illumination of a solder surface from first and second angles at predetermined incremental values of solder surface tilt and swing respectively;

(b) optically scanning the solder fillet from the base of the wall to said predetermined point while illuminating the fillet from the first angle, and sensing first reflected light intensity values at incremental points of said scan respectively;

(c) optically scanning the fillet from a base of the wall to said predetermined point while illuminating the fillet from the second angle, and sensing second reflected light intensity values at the incremental points of said scan respectively;

(d) accessing the array to obtain incremental height change values corresponding to the sensed first and second reflected light intensity values at the incremental points of said scan respectively; and

(e) summing the accessed height change values to obtain the height of the solder fillet at said predetermined point.

2. A method as in claim 1, in which:

steps (b) and (c) are performed sequentially and comprise, in combination, providing a single optical scanning means and first and second light source means oriented at the first and second angles respectively relative to the scanning means;

step (b) includes illuminating the fillet with only the first light source means; and

step (c) includes illuminating the fillet with only the second light source means.

3. A method as in claim 1, in which steps (b) and (c) are performed simultaneously and comprise, in combination, providing a single light source means and first and second optical scanning means oriented at the first and second angles respectively relative to the light source means.

4. A method as in claim 1, in which step (a) comprises the substeps of:

(f) illuminating the solder surface from the first angle at the predetermined incremental values of solder surface tilt and swing, and measuring the reflected light intensity of the solder surface to obtain the first predetermined reflected light intensity values respectively;

(g) illuminating the solder surface from the second angle at the predetermined incremental values of solder surface tilt and swing, and measuring the reflected light intensity of the solder surface to obtain the second predetermined reflected light intensity values respectively; and

(h) computing the height change values as a function of the predetermined incremental values of solder surface tilt and a spacing between the incremental points of said scan respectively.

5. A method as in claim 4, in which step (h) comprises multiplying the spacing between the incremental points of said scan by tangents of the angles of tilt of the solder surface at the predetermined values of solder surface tilt respectively.

6. A method as in claim 1, in which step (a) comprises the substep of:

(f) illuminating the solder surface from the first angle and a predetermined value of solder surface swing at the predetermined incremental values of solder surface tilt, and measuring the reflected light intensity of the solder surface to obtain first reflected light intensity values respectively;

(g) illuminating the solder surface from the second angle and said predetermined value of solder surface swing at the predetermined incremental values of solder surface tilt, and measuring the reflected light intensity of the solder surface to obtain second reflected light intensity values respectively;

(h) computing first and second reflected light intensity values as a predetermined function of said first and second measured reflected light intensity values and solder surface swing, at the predetermined incremental values of solder surface tilt and the incremental values of solder surface swing other said predetermined value of solder surface swing;

the first and second predetermined reflected light intensity values including said measured and computed first and second reflected light intensity values in combination; and

(i) computing the height change values as a function of the predetermined incremental values of solder surface tilt and a spacing between the incremental points of said scan respectively.

7. A method as in claim 6, in which step (i) comprises multiplying a spacing between the incremental points of said scan by tangents of the angles of tilt of the solder surface at the predetermined values of solder surface tilt respectively.

8. A method as in claim 1, further comprising the step, performed before step (a), of:

(f) coating the solder surface with a material selected such that the coated solder surface has substantially uniform albedo;

the method further comprising the step, performed before steps (b) and (c), of;

(g) coating the wall of the fillet with said material.

9. A method as in claim 8, in which said material has a lower albedo than the solder surface and the wall of the fillet.

10. A method for inspecting a wall of a solder fillet, comprising the steps of:

(a) storing an array of predetermined incremental solder surface height change values, each being a function of first and second predetermined reflected light intensity values resulting from illumination of a solder surface from first and second angles at predetermined incremental values of solder surface tilt and swing respectively;

(b) optically scanning the solder fillet along a plurality of lines extending from a base of the wall to predetermined points on the wall while illuminating the fillet from the first angle, and sensing first reflected light intensity values at incremental points of said scan respectively;

(c) optically scanning the solder fillet along said plurality of lines extending from the base of the wall to said predetermined points on the wall while illuminating the fillet from the second angle, and sensing second reflected light intensity values at incremental points of said scan respectively;

(d) accessing the array to obtain incremental height change values corresponding to the sensed first and second reflected light intensity values at the incremental points of said scan respectively;

(e) summing the accessed height change values along said plurality of lines to obtain the heights of the solder fillet at said predetermined points respectively; and

(f) comparing said heights with a predetermined inspection criterion.

11. A method as in claim 10, in which:

steps (b) and (c) are performed sequentially and comprise, in combination, providing a single optical scanning means and first and second light source means oriented at the first and second angles respectively relative to the scanning means;

step (b) includes illuminating the fillet with only the first light source means; and

step (c) includes illuminating the fillet with only the second light source means.

12. A method as in claim 10, in which steps (b) and (c) are performed simultaneously and comprise, in combination, providing a single light source means and first and second optical scanning means oriented at the first and second angles respectively relative to the light source means.

13. A method as in claim 10, further comprising the step, performed before step (a), of:

(g) coating the solder surface with a material selected such that the coated solder surface has substantially uniform albedo;

the method further comprising the step, performed before steps (b) and (c), of;

(h) coating the wall of the fillet with said material.

14. A method as in claim 13, in which said material has a lower albedo than the solder surface and the wall of the fillet.

15. A method for determining the height of a predetermined point on a wall of an object having a substantially uniform value of albedo, comprising the steps of:

(a) storing an array of predetermined incremental surface height change values, each being a function of first and second predetermined reflected light intensity values resulting from illumination of a surface having said substantially uniform value of albedo from first and second angles at predetermined incremental values of surface tilt and swing respectively;

(b) optically scanning the wall from a base thereof to said predetermined point while illuminating the wall from the first angle, and sensing first reflected light intensity values at incremental points of said scan respectively;

(c) optically scanning the wall from a base thereof to said predetermined point while illuminating the fillet from the second angle, and sensing second reflected light intensity values at the incremental points of said scan respectively;

(d) accessing the array to obtain incremental height change values corresponding to the sensed first and second reflected light intensity values at the incremental points of said scan respectively; and

(e) summing the accessed height change values to obtain the height of the wall at said predetermined point.

16. A method as in claim 15, in which:

steps (b) and (c) are performed sequentially and comprise, in combination, providing a single optical scanning means and first and second light source means oriented at the first and second angles respectively relative to the scanning means;

step (b) includes illuminating the wall with only the first light source means; and

step (c) includes illuminating the wall with only the second light source means.

17. A method as in claim 15, in which steps (b) and (c) are performed simultaneously and comprise, in combination, providing a single light source means and first and second optical scanning means oriented at the first and second angles respectively relative to the light source means.

18. A method for determining the height of a predetermined point on a wall of an object having a substantially uniform value of albedo, comprising the steps of:

(a) storing an array of predetermined incremental surface height change values, each being a function of predetermined reflected light intensity values resulting from illumination of a surface having said substantially uniform value of albedo from a predetermined angle at predetermined incremental values of surface tilt and swing respectively;

(b) optically scanning the wall from a base thereof to said predetermined point while illuminating the wall from said predetermined angle, and sensing reflected light intensity values at incremental points of said scan respectively;

(c) accessing the array to obtain incremental height change values corresponding to the sensed reflected light intensity values at the incremental points of said scan respectively; and

(d) summing the accessed height change values to obtain the height of the wall at said predetermined point.

19. An apparatus for determining the height of a solder fillet at a predetermined point on a wall thereof, comprising:

storage means for storing an array of predetermined incremental solder surface height change values, each being a function of first and second predetermined reflected light intensity values resulting from illumination of a solder surface from first and second angles at predetermined incremental values of solder surface tilt and swing respectively;

scanning means for optically scanning the solder fillet from a base of the wall to said predetermined point while illuminating the fillet from the first angle, and sensing first reflected light intensity values at incremental points of said scan respectively; and

optically scanning the fillet from the base of the wall to said predetermined point while illuminating the fillet from the second angle, and sensing second reflected light intensity values at the incremental points of said scan respectively;

computing means for accessing the array stored in the storage means to obtain incremental height change values corresponding to the sensed first and second reflected light intensity values at the incremental points of said scan respectively; and

summing the accessed height change values to obtain the height of the solder fillet at said predetermined point.

20. An apparatus as in claim 19, in which:

the scanning means comprises a single optical scanner means and first and second light source means oriented at the first and second angles respectively relative to the scanning means;

the scanning means illuminating the fillet with the first and second light source means sequentially.

21. An apparatus as in claim 19, in which the scanning means comprises a single light source means and first and second optical scanner means oriented at the first and second angles respectively relative to the light source means;

the scanning means scanning the fillet with the first and second scanner means simultaneously.

22. An apparatus as in claim 19, further comprising a material for coating the wall of the fillet;

the material being selected such that the coated wall has substantially uniform albedo;

said solder surface utilized in obtaining the first and second predetermined reflected light intensity values for the array being coated with said material.

23. An apparatus as in claim 22, in which said material has a lower albedo than the solder surface and the wall of the fillet.

24. An apparatus for inspecting a wall of a solder fillet, comprising:

storage means for storing an array of predetermined incremental solder surface height change values, each being a function of first and second predetermined reflected light intensity values resulting from illumination of a solder surface from first and second angles at predetermined incremental values of solder surface tilt and swing respectively;

scanning means for optically scanning the solder fillet along a plurality of lines extending from a base of the wall to predetermined points on the wall while illuminating the fillet from the first angle, and sensing first reflected light intensity values at incremental points of said scan respectively; and

optically scanning the fillet along said plurality of lines extending from the base of the wall to said predetermined points while illuminating the fillet from the second angle, and sensing second reflected light intensity values at the incremental points of said scan respectively;

computing means for;

accessing the array stored in the storage means to obtain incremental height change values corresponding to the sensed first and second reflected light intensity values at the incremental points of said scan respectively;

summing the accessed height change values along said plurality of lines to obtain the height of the solder fillet at said predetermined points respectively; and

comparing said heights with a predetermined inspection criterion.

25. An apparatus as in claim 24, in which:

the scanning means comprises a single optical scanner means and first and second light source means oriented at the first and second angles respectively relative to the scanning means;

the scanning means illuminating the fillet with the first and second light source means sequentially.

26. An apparatus as in claim 24, in which the scanning means comprises a single light source means and first and second optical scanner means oriented at the first and second angles respectively relative to the light source means;

the scanning means scanning the fillet with the first and second scanner means simultaneously.

27. An apparatus as in claim 24, further comprising a material for coating the wall of the fillet;

the material being selected such that the coated wall has substantially uniform albedo;

said solder surface utilized in obtaining the first and second predetermined reflected light intensity values for the array being coated with said material.

28. An apparatus as in claim 27, in which said material has a lower albedo than the solder surface and the wall of the fillet.

29. A method for determining a height difference between two points on solder fillet, comprising the steps of:

(a) optically scanning the fillet in a first scan between said two points while illuminating the fillet form a first angle;

(b) sensing the reflected light intensity of the fillet at incremental points along said first scan;

(c) optically scanning the fillet in a second scan between said two points along the same path as the first scan while illuminating the fillet from a second angle which lies in the same plane as said first angle;

(d) sensing the reflected light intensity of the fillet at incremental points along said second scan; and

(e) determining said height difference between said two points by computing said height difference as a predetermined function of said sensed reflected light intensities during the two scans.

30. A method as in claim 29, in which step (e) comprises the substeps of:

(f) computing the ratio of the sensed reflected light intensities; and

(g) computing said height difference as a predetermined function of said ratio.

31. A method as in claim 29, in which said predetermined function comprises a one dimensional look-up table.

32. A method for determining the height of a solder fillet at a predetermined point on a wall thereof, comprising the steps of:

(a) storing an array of predetermined incremental solder surface height change values, each being a function of first and second predetermined reflected light intensity values resulting from illumination of a solder surface from first and second angles at predetermined incremental values of solder surface tilt and swing respectively;

(b) optically scanning the solder fillet from the base of the wall to said predetermined point while illuminating the fillet from the first angle, and sensing first reflected light intensity values at incremental points of said scan respectively;

(c) optically scanning the fillet from a base of the wall to said predetermined point while illuminating the fillet from the second angle, and sensing second reflected light intensity values at the incremental points of said scan respectively;

(d) accessing the array to obtain incremental height change values corresponding to the sensed first and second reflected light intensity values at the incremental points of said scan respectively; and

(e) summing the accessed height change values to obtain the height of the solder fillet at said predetermined point;

steps (b) and (c) being performed simultaneously and including, in combination, providing a single optical scanning means capable of performing individual scans in response to light of first and second wavelengths respectively; and

first and second light source means which emit light at the first and second wavelengths and are oriented at the first and second angles respectively relative to the scanning means.